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74AHCT1G00SE-7

Diodes Incorporated · Logic Gates · SOT-353

74AHCT1G00SE-7 from Diodes Incorporated, in a SOT-353. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A input Data input to the NAND gate; unused inputs should be held at VCC or ground, and the input voltage range is 0 to 5.5 V.
2 B input Data input to the NAND gate; unused inputs should be held at VCC or ground, and the input voltage range is 0 to 5.5 V.
3 GND power_in Ground reference; continuous current through GND is limited to -50 mA.
4 Y output Data output with standard totem-pole drive of ±8 mA at 5.0 V; continuous output current is limited to ±25 mA.
5 VCC power_in Supply voltage, recommended operating range 4.5 V to 5.5 V; absolute maximum range -0.5 V to 6.5 V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-353
Category Logic
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Voltage VCC 4.5 5.5 V 3
High-level Input Voltage VIH 2 V 3
Low-level input voltage VIL 0.8 V 3
Input Voltage VI 0 5.5 V 3
Output Voltage VO 0 V 3
High-level output current IOH -8 mA 3
Low-level output current IOL 8 mA 3
Input transition rise or fall rate Δt/ΔV 20 ns/V 3
Operating free-air temperature TA -40 125 ºC 3
ESD Human Body Model ESD Protection ESD HBM 2 KV 3
ESD Charged Device Model ESD Protection ESD CDM 1 KV 3
ESD Machine Model ESD Protection ESD MM 200 V 3
Supply Voltage Range VCC -0.5 6.5 V 3
Input Voltage Range VI -0.5 6.5 V 3
Voltage applied to output in high or low state VO -0.5 V 3
Input Clamp Current IIK -20 mA VI<0 3
Output Clamp Current IOK -20 20 mA VO < 0 or VO > VCC 3
Continuous output current IO -25 25 mA VO = 0 to VCC 3
Continuous current through VCC ICC 50 mA 3
Continuous current through GND IGND -50 mA 3
Operating Junction Temperature TJ -40 150 °C 3
Storage Temperature TSTG -65 150 °C 3
High Level Output Voltage VOH 4.4 4.5 V IOH = -50μA, VCC 4.5V; 25ºC 4
High Level Output Voltage VOH 4.4 V IOH = -50μA, VCC 4.5V; -40ºC to 85ºC 4
High Level Output Voltage VOH 3.94 V IOH = -8mA, VCC 4.5V; 25ºC 4
High Level Output Voltage VOH 3.8 V IOH = -8mA, VCC 4.5V; -40ºC to 85ºC 4
High Level Output Voltage VOH 3.7 V IOH = -8mA, VCC 4.5V; -40ºC to 125ºC 4
Low Level Output Voltage VOL 0 0.1 V IOL = 50μA, VCC 4.5V; 25ºC 4
Low Level Output Voltage VOL 0.1 V IOL = 50μA, VCC 4.5V; -40ºC to 85ºC 4
Low Level Output Voltage VOL 0.36 V IOL = 8mA, VCC 4.5V; 25ºC 4
Low Level Output Voltage VOL 0.44 V IOL = 8mA, VCC 4.5V; -40ºC to 85ºC 4
Low Level Output Voltage VOL 0.55 V IOL = 8mA, VCC 4.5V; -40ºC to 125ºC 4
Input Current II -0.1 0.1 μA VI = 5.5V or GND, VCC 0 to 5.5V; 25ºC 4
Input Current II -1 1 μA VI = 5.5V or GND, VCC 0 to 5.5V; -40ºC to 85ºC 4
Input Current II -2 2 μA VI = 5.5V or GND, VCC 0 to 5.5V; -40ºC to 125ºC 4
Supply Current ICC 1 10 μA VI = 5.5V or GND, IO=0, VCC 5.5V; 25ºC 4
Supply Current ICC 40 μA VI = 5.5V or GND, IO=0, VCC 5.5V; -40ºC to 125ºC 4
Input Capacitance Ci 2 10 pF VI = VCC or GND, VCC 5.5V; 25ºC 4
Input Capacitance Ci 10 pF VI = VCC or GND, VCC 5.5V; -40ºC to 85ºC 4
Additional Supply Current ΔICC 1.35 1.5 mA One input at 3.4V, other inputs at VCC or GND, VCC 5.5V; 25ºC 4
Propagation delay tpd tpd 0.6 3.6 6.2 ns A or B to Y, CL=15pF, VCC = 5V ± 0.5V; 25ºC 4
Propagation delay tpd tpd 0.6 7.1 ns A or B to Y, CL=15pF, VCC = 5V ± 0.5V; -40ºC to 85ºC 4
Propagation delay tpd tpd 0.6 8 ns A or B to Y, CL=15pF, VCC = 5V ± 0.5V; -40ºC to 125ºC 4
Propagation delay tpd tpd 0.6 5 7.9 ns A or B to Y, CL=50pF, VCC = 5V ± 0.5V; 25ºC 4
Propagation delay tpd tpd 0.6 9 ns A or B to Y, CL=50pF, VCC = 5V ± 0.5V; -40ºC to 85ºC 4
Propagation delay tpd tpd 0.6 10 ns A or B to Y, CL=50pF, VCC = 5V ± 0.5V; -40ºC to 125ºC 4
Thermal Resistance Junction-to-Ambient (SOT353) θJA 371 °C/W SOT353; Note 4: FR-4 substrate PC board, 2oz copper, minimum recommended pad layout 4
Thermal Resistance Junction-to-Case (SOT353) θJC 143 °C/W SOT353; Note 4: FR-4 substrate PC board, 2oz copper, minimum recommended pad layout 4

CAD (KiCad official)

  • Symbol: 74AHCT1G00SE-7
  • Footprint: Package_TO_SOT_SMD:SOT-353_SC-70-5
  • 3D model: SOT-353 (KiCad packages3D, STEP)
  • 3D model files: 74ahct1g00se-7-etched.step / 74ahct1g00se-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74ahct1g00se-7.step / 74ahct1g00se-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (8 pp, sha256 5415c3b327094c04, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF