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74AHC1G126SE-7

Public Made by Adom

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Diodes Incorporated Buffers, Drivers, Receivers, Transceivers, SOT-353. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

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74AHC1G126SE-7

Diodes Incorporated · Buffers, Drivers, Receivers, Transceivers · SOT-353

74AHC1G126SE-7 from Diodes Incorporated, in a SOT-353. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE input Output enable input; a LOW level applied to OE places output Y in the high-impedance (Z) state.
2 A input Data input of the non-inverting buffer; with OE HIGH, output Y follows the level applied to A.
3 GND power_in Ground reference pin.
4 Y tri_state Data output with 3-state capability; Y is high impedance when OE is LOW.
5 VCC power_in Supply voltage pin; the device is specified for an operating range of 2.0 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-353
Category Logic
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
ESD HBM Human Body Model ESD Protection ESD HBM 2 KV 3
ESD CDM Charged Device Model ESD Protection ESD CDM 1 KV 3
ESD MM Machine Model ESD Protection ESD MM 200 V 3
Supply Voltage Range VCC -0.5 6.5 V 3
Input Voltage Range VI -0.5 6.5 V 3
Voltage applied to output in high or low state VO -0.5 V Printed max is VCC +0.5 V 3
Input Clamp Current IIK -20 mA VI<0 3
Output Clamp Current IOK -20 20 mA VO < 0 or VO > VCC 3
Continuous output current IO -25 25 mA VO = 0 to VCC 3
Continuous current through VCC ICC 50 mA 3
Continuous current through GND IGND -50 mA 3
Operating Junction Temperature TJ -40 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Operating Voltage VCC 2 5.5 V 3
High-level Input Voltage VIH 1.5 V VCC = 2V 3
High-level Input Voltage VIH 2.1 V VCC = 3V 3
High-level Input Voltage VIH 3.85 V VCC = 5.5V 3
Low-level input voltage VIL 0.5 V VCC = 2V 3
Low-level input voltage VIL 0.9 V VCC = 3V 3
Low-level input voltage VIL 1.65 V VCC = 5.5V 3
Input Voltage VI 0 5.5 V 3
Output Voltage VO 0 V Printed max is VCC 3
High-level output current IOH -50 uA VCC = 2V 3
High-level output current IOH -4 mA VCC = 3.3V ± 0.3V 3
High-level output current IOH -8 mA VCC = 5V ± 0.5V 3
Low-level output current IOL 50 uA VCC = 2V 3
Low-level output current IOL 8 mA VCC = 3V 3
Low-level output current IOL 4 mA VCC = 5V ± 0.5V 3
Input transition rise or fall rate Δt/ΔV 100 ns/V VCC = 3.3V ± 0.3V 3
Input transition rise or fall rate Δt/ΔV 20 ns/V VCC = 5V ± 0.5V 3
Operating free-air temperature TA -40 125 ºC 3
High Level Output Voltage VOH 1.9 2 V IOH = -50μA, VCC = 2V, 25ºC 4
High Level Output Voltage VOH 2.9 3 V IOH = -50μA, VCC = 3V, 25ºC 4
High Level Output Voltage VOH 4.4 4.5 V IOH = -50μA, VCC = 4.5V, 25ºC 4
High Level Output Voltage VOH 2.58 V IOH = -4mA, VCC = 3V, 25ºC 4
High Level Output Voltage VOH 3.94 V IOH = -8mA, VCC = 4.5V, 25ºC 4
Low Level Output Voltage VOL 0.1 V IOL = 50μA, VCC = 2V, 25ºC 4
Low Level Output Voltage VOL 0.36 V IOL = 4mA, VCC = 3V, 25ºC 4
Input Current II -0.1 0.1 μA VI = 5.5 V or GND, 0 to 5.5V, 25ºC 4
Input Current II -1 1 μA VI = 5.5 V or GND, 0 to 5.5V, -40ºC to 85ºC 4
Input Current II -2 2 μA VI = 5.5 V or GND, 0 to 5.5V, -40ºC to 125ºC 4
Z State Leakage Current IOZ 2.5 μA VO = 0 to 5.5 V, VCC 5.5V, -40ºC to 85ºC 4
Z State Leakage Current IOZ 10 μA VO = 0 to 5.5 V, VCC 5.5V, -40ºC to 125ºC 4
Supply Current ICC 10 μA VI = 5.5V or GND, IO=0, VCC 5.5V, -40ºC to 85ºC 4
Supply Current ICC 40 μA VI = 5.5V or GND, IO=0, VCC 5.5V, -40ºC to 125ºC 4
Input Capacitance CI 10 pF VI = VCC or GND, VCC 5.5V, -40ºC to 85ºC 4
Z State Leakage Current IOZ 0.25 μA VO = 0 to 5.5 V, VCC 5.5V, 25ºC 4
Supply Current ICC 1 μA VI = 5.5V or GND, IO=0, VCC 5.5V, 25ºC 4
Input Capacitance CI 2 pF VI = VCC or GND, VCC 5.5V, 25ºC 4
Thermal Resistance Junction-to-Ambient θJA 430 °C/W SOT353 (Note 4): FR-4 PCB, 2oz copper, minimum recommended pad layout 4
Thermal Resistance Junction-to-Case θJC 155 °C/W SOT353 (Note 4): FR-4 PCB, 2oz copper, minimum recommended pad layout 4

CAD (KiCad official)

  • Symbol: 74AHC1G126SE-7
  • Footprint: Package_TO_SOT_SMD:SOT-353_SC-70-5
  • 3D model: SOT-353 (KiCad packages3D, STEP)
  • 3D model files: 74ahc1g126se-7-etched.step / 74ahc1g126se-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 74ahc1g126se-7.step / 74ahc1g126se-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (9 pp, sha256 a9208469722d83d9, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed (audit)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF