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Contents

README

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6N136

Everlight Elec · Logic Output Optoisolators · DIP-8

6N136 from Everlight Elec, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection, listed as 'No Connection' in the pin configuration.
2 Anode passive Anode of the infrared emitting diode; the datasheet rates forward current IF at 25 mA max and reverse voltage VR at 5 V max.
3 Cathode passive Cathode of the infrared emitting diode; the datasheet rates forward current IF at 25 mA max and reverse voltage VR at 5 V max.
4 NC unconnected No connection, listed as 'No Connection' in the pin configuration.
5 GND power_in Ground connection of the output-side photodetector and transistor stage, used for high speed logic ground isolation.
6 Vout output Output of the open-collector output transistor; the datasheet rates output voltage VO at -0.5 to 20 V, average output current IO(AVG) at 8 mA and peak output current IO(PK) at 16 mA.
7 VB power_in Separate connection for the photodiode bias, which reduces input base-collector capacitance to increase switching speed.
8 VCC power_in Supply voltage pin; the datasheet rates VCC at -0.5 to 30 V absolute maximum.

Key specifications

Parameter Value
Manufacturer Everlight Elec
Package DIP-8
Category Optoisolators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Current Transfer Ratio (IF=16mA, VO=0.4V, VCC=4.5V) CTR 19 50 % IF = 16mA, VO = 0.4V, VCC=4.5V, TA=25°C 3
Current Transfer Ratio (IF=16mA, VO=0.5V, VCC=4.5V) CTR 15 % IF = 16mA, VO = 0.5V, VCC=4.5V 3
Logic Low Output Voltage (IO=3mA) VOL 0.25 0.4 V IF = 16mA, IO = 3mA, VCC=4.5V, TA=25°C 3
Logic Low Output Voltage (IO=2.4mA) VOL 0.5 V IF = 16mA, IO = 2.4mA, VCC=4.5V 3
Reverse Voltage VR 5 V IR = 10μA 3
Forward Voltage VF 1.45 1.8 V IF =16mA 3
Logic High Output Current IOH 0.001 0.5 µA IF=0mA, VO=VCC=5.5V, TA=25°C 3
Logic High Output Current IOH 0.01 1 µA IF=0mA, VO=VCC=15V, TA=25°C 3
Logic High Output Current IOH 50 µA IF=0mA, VO=VCC=15V 3
Logic Low Supply Current ICCL 140 200 µA IF=16mA, VO=Open, VCC=15V 3
Logic High Supply Current ICCH 0.01 1 µA IF=0mA, VO=Open, VCC=15V, TA=25°C 3
Logic High Supply Current ICCH 2 µA IF=0mA, VO=Open, VCC=15V 3
Propagation Delay Time to Logic Low (RL=1.9KΩ, TA=25°C) TPHL 0.35 0.8 µs RL=1.9KΩ, TA=25°C; IF=16mA, Vcc=5V 4
Propagation Delay Time to Logic Low (RL=1.9KΩ) TPHL 1 µs RL =1.9KΩ; IF=16mA, Vcc=5V 4
Propagation Delay Time to Logic High (RL=1.9KΩ, TA=25°C) TPLH 0.3 0.8 µs RL =1.9KΩ, TA=25°C; IF=16mA, Vcc=5V 4
Propagation Delay Time to Logic High (RL=1.9KΩ) TPLH 1 µs RL =1.9KΩ; IF=16mA, Vcc=5V 4
Common Mode Transient Immunity at Logic High CMH 1000 V/µs IF = 0mA, VCM=10Vp-p, RL=1.9KΩ, TA=25°C 4
Common Mode Transient Immunity at Logic Low CML 1000 V/µs IF = 16mA, VCM=10Vp-p, RL=1.9KΩ, TA=25°C 4
Temperature coefficient of forward voltage VF/TA -1.9 mV/°C IF =16mA 3
Forward current IF 25 mA 2
Peak forward current IFP 50 mA 50% duty, 1ms P.W 2
Peak transient current IFtrans 1 A ≤1μs P.W, 300pps 2
Reverse voltage VR 5 V 2
Input power dissipation PIN 45 mW 2
Output power dissipation PO 100 mW 2
Emitter-Base reverse voltage (6N136) VEBR 5 V 2
Base current (6N136) IB 5 mA 2
Average output current IO(AVG) 8 mA 2
Peak output current IO(PK) 16 mA 2
Output voltage VO -0.5 20 V 2
Supply voltage VCC -0.5 30 V 2
Total power dissipation PTOT 200 mW 2
Isolation voltage VISO 5000 Vrms AC for 1 minute, R.H. 40-60%; pins 1-4 shorted together, pins 5-8 shorted together 2
Operating temperature TOPR -55 100 °C 2
Storage temperature TSTG -55 125 °C 2
Soldering temperature TSOL 260 °C For 10 seconds 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 1.1 (A) Maximum Body Case Temperature Profile for evaluation of Reflow Profile Note: Reference: IPC/JEDEC J-STD-020D 12

CAD (KiCad official)

  • Symbol: 6N136
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: 6n136-etched.step / 6n136-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 6n136.step / 6n136.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Everlight Elec datasheet (13 pp, sha256 6e3f09492d1ba264, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF