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6CWQ03FN

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SMC Sangdest Microelectronicstronic Nanjing Schottky Diodes, DPAK. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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6CWQ03FN

SMC Sangdest Microelectronicstronic Nanjing · Schottky Diodes · DPAK

6CWQ03FN from SMC Sangdest Microelectronicstronic Nanjing, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Schottky diode leg, rated 3.5 A average forward current per leg with VRRM of 30 V.
2 K passive Common cathode of both diode legs (center tap), also connected to the tab, rated 7 A average per device with VRRM of 30 V.
3 A2 passive Anode of the second Schottky diode leg, rated 3.5 A average forward current per leg with VRRM of 30 V.

Key specifications

Parameter Value
Manufacturer SMC Sangdest Microelectronicstronic Nanjing
Package DPAK
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VR 30 V 1
Average Rectified Forward Current (Peg Device) IF (AV) 7 A 50% duty cycle @TC = 131°C, rectangular wave form 1
Average Rectified Forward Current (Peg Leg) IF (AV) 3.5 A 50% duty cycle @TC = 131°C, rectangular wave form 1
Peak One Cycle Non-Repetitive Surge Current (Peg Leg) IFSM 108 A 8.3 ms, half Sine pulse 1
Forward Voltage Drop (Per Leg) VF1 0.42 0.45 V @ 3A, Pulse, TJ = 25 C 1
Forward Voltage Drop (Per Leg) VF1 0.52 V @ 6A, Pulse, TJ = 25 C 1
Forward Voltage Drop (Per Leg) VF2 0.32 0.35 V @ 3A, Pulse, TJ = 125 C 1
Forward Voltage Drop (Per Leg) VF2 0.46 V @ 6A, Pulse, TJ = 125 C 1
Reverse Current (per leg) IR1 0.02 1 mA @VR = rated VR, TJ = 25 C 1
Reverse Current (per leg) IR2 17 50 mA @VR = rated VR, TJ = 125 C 1
Junction Capacitance (Per Leg) CT 200 290 pF @VR = 5V, TC = 25 C, fSIG = 1MHz 1
Junction Temperature TJ -55 150 C 2
Storage Temperature Tstg -55 150 C 2
Typical Thermal Resistance Junction to Case (Per Leg, peg leg) RJC 4.7 C/W Peg leg 2
Typical Thermal Resistance Junction to Case (peg device) RJC 2.35 C/W Peg device 2

CAD (KiCad official)

  • Symbol: 6CWQ03FN
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: 6cwq03fn-etched.step / 6cwq03fn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 6cwq03fn.step / 6cwq03fn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC Sangdest Microelectronicstronic Nanjing datasheet (4 pp, sha256 efcd642325122718, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF