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Contents

README

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65HVD72EIM

HGSEMI · RS-485 / RS-422 ICs · SOIC-8

65HVD72EIM from HGSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output. When /RE is low, RO drives high if (A-B) ≥ -50mV and low if (A-B) ≤ -200mV. High-impedance when receiver is disabled (/RE high) or in shutdown.
2 /RE input Receiver output enable, active low. RO is valid when /RE is low; RO is high-Z when /RE is high. If /RE=high and DE=low simultaneously, the device enters low-power shutdown mode. Hot-swap input structure.
3 DE input Driver output enable, active high. Driver outputs (A, B) are enabled when DE is high; outputs are high-impedance when DE is low. If DE=low and /RE=high, the device enters low-power shutdown mode. Hot-swap input structure.
4 DI input Driver data input. When DE is high, a logic-low on DI drives A low and B high; a logic-high on DI drives A high and B low. VIH = 2V min, VIL = 0.8V max.
5 GND power_in Ground reference for the device.
6 A bidirectional Non-inverting receiver input and non-inverting driver output for the RS-485/RS-422 differential bus. Withstands -7V to +12V bus common-mode range. 96 kΩ input impedance (1/8 unit load).
7 B bidirectional Inverting receiver input and inverting driver output for the RS-485/RS-422 differential bus. Withstands -7V to +12V bus common-mode range. 96 kΩ input impedance (1/8 unit load).
8 VCC power_in Positive supply, 3.15V ≤ VCC ≤ 3.45V (nominal 3.3V). Bypass with a 0.1 µF capacitor to GND close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOIC-8
Category Interface
Pins 8

Ordering variants

  • 65HVD72EIM/TR
  • 65HVD72EIMECM/TR
  • 65HVD72EIMECN
  • 65HVD72EIMEIN
  • 65HVD72EIMECMM/TR
  • 65HVD72EIMM/TR

CAD (KiCad official)

  • Symbol: 65HVD72EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: 65hvd72eim-etched.step / 65hvd72eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 65hvd72eim.step / 65hvd72eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (20 pp, sha256 11f027c743ac8483, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF