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65HVD485EIM

Public Made by Adom

by adom

HGSEMI RS-485 / RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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65HVD485EIM

HGSEMI · RS-485 / RS-422 ICs · SOIC-8

65HVD485EIM from HGSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: with RE low, RO is high when A-B is at least -50 mV and low when A-B is at most -200 mV; RO is high-impedance when RE is high.
2 RE input Receiver output enable, active low; RE high puts RO in high-impedance, and RE high with DE low puts the device into low-power shutdown, with a hot-plug input structure.
3 DE input Driver output enable, active high; the driver outputs are high-impedance when DE is low, and DE low with RE high enters shutdown, with a hot-plug input structure.
4 DI input Driver input: with DE high, a low on DI drives A low and B high, and a high on DI drives A high and B low.
5 GND power_in Ground reference for the device.
6 A bidirectional Non-inverting receiver input and non-inverting driver output on the RS-485 bus (receiver input range -7 V to +12 V).
7 B bidirectional Inverting receiver input and inverting driver output on the RS-485 bus (receiver input range -7 V to +12 V).
8 VCC power_in Positive supply, 4.5 V to 5.5 V; decouple with a 0.1 µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOIC-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (absolute maximum) VCC 6 V 4
Control input voltage RE, DE -0.3 6 V 4
Driver input voltage DI -0.3 6 V 4
Driver output voltage A, B -7 12 V 4
Receiver input voltage A, B -7 12 V 4
Receiver output voltage RO -0.3 V 4
Continuous power dissipation (SOP8) 500 mW TA=+70℃ 4
Operating temperature range (65HVD485EI) -40 85 ℃ 4
Storage temperature -65 150 ℃ 4
Lead temperature (soldering) TLEAD 260 ℃ Soldering, 10s 4
Supply voltage (operating) VCC 4.5 5.5 V 4
Differential driver output voltage (RS-422 load) VOD 2.7 V Figure 1, RL=100Ω (RS-422) 4
Differential driver output voltage (RS-485 load) VOD 2.1 V Figure 1, RL=54Ω (RS-485) 4
Differential driver output voltage magnitude change ΔVOD 0.2 V Figure 1, RL=100Ω or RL=54Ω 4
Driver common-mode output voltage VOC 3 V Figure 1, RL=100Ω or RL=54Ω 4
Common-mode output voltage magnitude change ΔVOC 0.2 V Figure 1, RL=100Ω or RL=54Ω 4
Input high voltage (DE, DI, RE) VIH 2 V 4
Input low voltage (DE, DI) VIL 0.8 V 4
Input current (DE, DI, RE) IIN -1 1 μA 4
Driver short-circuit output current IOSD 250 mA 0≦VOUT ≦12V 4
Driver short-circuit output current IOSD -250 mA -7≦VOUT ≦Vcc 4
Driver short-circuit foldback output current IOSDF 20 mA Vcc-1V ≦VOUT ≦Vcc+0.5V 4
Driver short-circuit foldback output current IOSDF -20 mA -0.5V ≦VOUT ≦+1V 4
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V≦VCM≦12V 5
Receiver output low voltage VOL 0.4 V IO= 4mA, VID=-200mV 5
Receiver tri-state output current IOZR -1 1 μA 0≦VO≦VCC 5
Receiver output short-circuit current IOSR -95 95 mA 0V≦VRO≦VCC 5
Supply current (RE=VCC, DE=VCC) Icc 530 900 μA No load, RE = VCC, DI = GND or VCC, DE = VCC 5
Supply current (RE=VCC, DE=GND) Icc 475 600 μA DE=GND 5
Supply current (RE=GND, DE=VCC) Icc 530 1000 μA No load, RE = GND, DI = GND or VCC, DE = VCC 5
Supply current (RE=GND, DE=GND) Icc 475 800 μA DE=GND 5
Standby mode supply current ISHDN 0.05 10 μA DE = GND, RE = VCC 5
ESD IEC 61000-4-2 air-gap discharge -16 16 kV Pins A, B 5
ESD IEC 61000-4-2 contact discharge -16 16 kV Pins A, B 5
ESD HBM pins to GND -16 16 kV Pins A, B to GND 5
ESD HBM all pins -4 4 kV All pins, JEDEC JS-001-2010 5
ESD charged device model (CDM) -500 500 V All pins, JESD22-C101E 5
Driver propagation delay tDPLH, tDPHL 50 ns Figure 2 and 5, RL=54Ω, CL=50pF 6
Driver output skew tDSKEW 10 ns Figure 2 and 5, RL=54Ω, CL=50pF 6
Driver rise and fall time tDR, tDF 20 ns Figure 2 and 5, RL=54Ω, CL=50pF 6
Maximum data rate (driver) fMAX 10 Mbps 6
Driver enable to output high tDZH 150 ns Figure 3 and 6, CL=100pF, S3 closed 6
Driver enable to output low tDZL 150 ns Figure 3 and 6, CL=100pF, S2 closed 6
Driver output low to disable time tDLZ 100 ns Figure 3 and 6, CL=15pF, S2 closed 6
Driver output high to disable time tDHZ 100 ns Figure 3 and 6, CL=15pF, S3 closed 6
Driver enable from standby to output high tDZH (SHDN) 2200 ns Figure 3 and 6, CL=15pF, S3 closed 6
Driver enable from standby to output low tDZL (SHDN) 2200 ns Figure 3 and 6, CL=15pF, S2 closed 6
Driver standby time tSHDN 50 350 700 ns 6
Receiver propagation delay tRPLH, tRPHL 50 ns Figure 7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 6
Receiver output skew tRSKEW 20 ns Figure 7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns 6
Maximum data rate (receiver) fMAX 10 Mbps 6
Receiver enable to output low tRZL 50 ns Figure 4 and 9, S1=-1.5V, S2 to VCC 6
Receiver enable to output high tRZH 50 ns Figure 4 and 9, S1=+1.5V, S2 to GND 6
Receiver output low to disable time tRLZ 50 ns Figure 4 and 9, S1=-1.5V, S2 to VCC 6
Receiver output high to disable time tRHZ 50 ns Figure 4 and 9, S1=+1.5V, S2 to GND 6
Receiver enable from standby to output high tRZH (SHDN) 2200 ns Figure 4 and 9, S1=-1.5V, S2 to VCC 6
Receiver enable from standby to output low tRZL (SHDN) 2200 ns Figure 4 and 9, S1=+1.5V, S2 to GND 6
Receiver standby time tSHDN 50 350 700 ns 6
Receiver input resistance RIN 96 kΩ -7V≦VCM≦12V 5
Thermal shutdown temperature TTS 165 ℃ 4

CAD (KiCad official)

  • Symbol: 65HVD485EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: 65hvd485eim-etched.step / 65hvd485eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 65hvd485eim.step / 65hvd485eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (18 pp, sha256 b3966edb92698414, retrieved 2026-10-21, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF