component

65HVD3088EIM

Public Made by Adom

by adom

HGSEMI RS-485/RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface ics65hvd3088eimfactory-2.0.0extractor-text

Verified 65HVD3088EIM

by Ray · last 2 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

2 Nov 2026RayPublished by the parts factory: tier lcsc, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: 65HVD3088EIM · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • •datasheet (warn): 1/8 pin names appear NOWHERE in the datasheet text: ['2:RE@p1']
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-zlectjk4/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ 65hvd3088eim.kicad_sym✓ 65hvd3088eim.kicad_mod✓ 65hvd3088eim.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 1d ago
viewers 65hvd3088eim: viewers · Ray 1d ago
65hvd3088eim-etched.glb Publish 0.1.0 · Ray 1d ago
65hvd3088eim-etched.step 65hvd3088eim: factory component page (tier=lcsc) · Ray 1d ago
65hvd3088eim-hero.glb 65hvd3088eim: hero GLB from the etched model (keeps the MPN mark) · Ray 1d ago
65hvd3088eim-hero.overlay.json Publish 0.1.0 · Ray 1d ago
65hvd3088eim.glb Publish 0.1.0 · Ray 1d ago
65hvd3088eim.kicad_mod Publish 0.1.0 · Ray 1d ago
65hvd3088eim.kicad_sym Publish 0.1.0 · Ray 1d ago
65hvd3088eim.lbr Publish 0.1.0 · Ray 1d ago
65hvd3088eim.step Publish 0.1.0 · Ray 1d ago
package.json Publish 0.1.0 · Ray 1d ago
page.json Set visibility: public · Ray 1d ago
README.md Publish 0.1.0 · Ray 1d ago
verification.json Verified: Published by the parts factory: tier lcsc, 8 pins · Ray 1d ago

65HVD3088EIM

HGSEMI · RS-485/RS-422 ICs · SOIC-8

65HVD3088EIM from HGSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: when RE is low, RO goes high if (A - B) is not less than 50mV and low if (A - B) is not greater than -200mV.
2 RE input Receiver output enable: RO is active when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure.
3 DE input Driver output enable: the driver outputs are active when DE is high and high-impedance when DE is low; RE high with DE low enters low-power shutdown, and DE has a hot-plug input structure.
4 DI input Driver input: with DE high, a low on DI drives A/Y low and B/Z high, and a high on DI drives A/Y high and B/Z low.
5 GND power_in Ground reference for the device.
6 A bidirectional Receiver non-inverting input (A - B) and driver non-inverting output (A/Y) on the half-duplex device.
7 B bidirectional Receiver inverting input (A - B) and driver inverting output (B/Z) on the half-duplex device.
8 VCC power_in Positive supply: 4.5V ≤ VCC ≤ 5.5V; connect a 0.1µF capacitor to ground.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 4.5 5.5 V 4
Input high voltage VIH 2 V DE, DI, RE 4
Input low voltage VIL 0.8 V DE, DI 4
Differential driver output voltage (RS-485) VOD 2.1 V Figure 1, RL=54Ω (RS-485) 4
Differential driver output voltage (RS-422) VOD 2.7 V Figure 1, RL=100Ω (RS-422) 4
Change in differential driver output voltage magnitude ΔVOD 0.2 V Figure 1, RL=100Ω or RL=54Ω 4
Driver common-mode output voltage VOC 3 V Figure 1, RL=100Ω or RL=54Ω 4
Change in common-mode output voltage magnitude ΔVOC 0.2 V Figure 1, RL=100Ω or RL=54Ω 4
Input current IIN -1 1 μA DE, DI, RE 4
Input current (A,B) full-duplex IA, IB 125 μA DE=GND, VCC=GND or VCC, VIN=12V 4
Input current (A,B) full-duplex IA, IB -75 μA DE=GND, VCC=GND or VCC, VIN=-7V 4
Output leakage current (Y,Z) full-duplex IO 125 μA DE=GND, VCC=GND or VCC, VIN=12V 4
Output leakage current (Y,Z) full-duplex IO -100 μA DE=GND, VCC=GND or VCC, VIN=-7V 4
Driver short-circuit output current IOSD 250 mA 0≦VOUT≦12V 4
Driver short-circuit output current IOSD -250 mA -7≦VOUT≦Vcc 4
Driver short-circuit foldback output current IOSDF 20 mA Vcc-1V≦VOUT≦Vcc+0.5V 4
Driver short-circuit foldback output current IOSDF -20 mA -0.5V≦VOUT≦+1V 4
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V≦VCM≦12V 4
Receiver output low voltage VOL 0.4 V IO=4mA, VID=-200mV 4
Receiver tri-state output current IOZR -1 1 μA 0≦VO≦VCC 4
Supply current (no load, RE=VCC, DE=VCC) Icc 530 900 μA No load, RE=VCC, DI=GND or VCC, DE=VCC 5
Supply current (no load, RE=VCC, DE=GND) Icc 475 600 μA No load, RE=VCC, DI=GND or VCC, DE=GND 5
Supply current (no load, RE=GND, DE=VCC) Icc 530 1000 μA No load, RE=GND, DI=GND or VCC, DE=VCC 5
Supply current (no load, RE=GND, DE=GND) Icc 475 800 μA No load, RE=GND, DI=GND or VCC, DE=GND 5
Standby mode supply current ISHDN 0.05 10 μA DE=GND, RE=VCC 5
Standby time tSHDN 50 350 700 ns Note 4 8
Absolute maximum supply voltage VCC 6 V 3
Control input voltage (RE, DE) -0.3 6 V 3
Driver input voltage (DI) -0.3 6 V 3
Driver output voltage (A,B,Y,Z) -7 12 V 3
Receiver input voltage (A,B) -7 12 V 3
Receiver output voltage (RO) -0.3 V 3
Continuous power dissipation 8SOP 500 mW TA=+70℃ 3
Operating temperature (EI industrial grade) -40 85 ℃ 3
Storage temperature -65 150 ℃ 3
Lead temperature (soldering 10s) TLEAD 260 ℃ 10s soldering 3

CAD (KiCad official)

  • Symbol: 65HVD3088EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: 65hvd3088eim-etched.step / 65hvd3088eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 65hvd3088eim.step / 65hvd3088eim.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (24 pp, sha256 c3a19f70c067cbbd, retrieved 2026-11-02, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF