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5PB1104CMT18

RENESAS · Clock Buffers, Drivers · WDFN-8(2x2)

5PB1104CMT18 from RENESAS, in a WDFN-8(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CLKIN input LVCMOS clock input that is 3.3V tolerant, with an absolute input voltage range of -0.4 V to 3.465 V.
2 1G input Output enable input: with 1G high the outputs follow CLKIN, and with 1G low the outputs are held low (VIH 2.0 V min and VIL 0.8 V max at VDD = 3.3 V).
3 Y0 output LVCMOS clock output with 50 Ω nominal output impedance; at VDD = 3.3 V, VOH is 2.4 V min at -12 mA and VOL is 0.7 V max at 12 mA.
4 GND power_in Ground reference pin for the device.
5 Y2 output LVCMOS clock output with 50 Ω nominal output impedance; at VDD = 3.3 V, VOH is 2.4 V min at -12 mA and VOL is 0.7 V max at 12 mA.
6 VDD power_in Supply pin; operating voltage is 1.71 V to 3.465 V measured with respect to GND, with an absolute maximum of 3.8 V.
7 Y3 output LVCMOS clock output with 50 Ω nominal output impedance; at VDD = 3.3 V, VOH is 2.4 V min at -12 mA and VOL is 0.7 V max at 12 mA.
8 Y1 output LVCMOS clock output with 50 Ω nominal output impedance; at VDD = 3.3 V, VOH is 2.4 V min at -12 mA and VOL is 0.7 V max at 12 mA.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer RENESAS
Package WDFN-8(2x2)
Category Clock and Timing
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient Operating Temperature (Automotive Grade 1) TA -40 125 C 5
Power Supply Voltage (measured in respect to GND) VDD 1.71 3.465 V measured in respect to GND 5
Supply Voltage VDD 3.8 V 5
Output Enable and All Outputs -0.4 V maximum printed as VDD + 0.5 V 5
Input Voltage, CLKIN -0.4 3.465 V 5
Storage Temperature TSTG -65 150 C 5
Junction Temperature TJ 125 C 5
Soldering Temperature 260 C 5
Operating Voltage VDD (1.8V table, Automotive) VDD 1.71 1.8 1.89 V 8
Input High Voltage, 1G (1.8V table, Automotive) VIH 1.6 V 8
Input Low Voltage, 1G (1.8V table, Automotive) VIL 0.6 V 8
Output High Voltage (1.8V table, Automotive) VOH 1.2 V IOH = -5mA. 8
Output Low Voltage (1.8V table, Automotive) VOL 0.45 V IOL = 5mA. 8
Operating Supply Current 5PB1104 (1.8V, Automotive) at 40MHz IDD 11 13 mA 40MHz, CL = 5pF. 8
Operating Supply Current 5PB1104 (1.8V, Automotive) at 100MHz IDD 25 30 mA 100MHz, CL = 5pF. 8
Operating Supply Current 5PB1104 (1.8V, Automotive) at 156.25MHz IDD 37 47 mA 156.25MHz, CL = 5pF. 8
Operating Supply Current 5PB1104 (1.8V, Automotive) at 200MHz IDD 39 57 mA 200MHz, CL = 5pF. 8
Input High Leakage (1.8V table, Automotive) IIH 5 µA VIN = VDD 8
Input Low Leakage (1.8V table, Automotive) IIL 5 µA VIN = 0V 8
Operating Voltage VDD (2.5V table, Automotive) VDD 2.375 2.5 2.625 V 10
Input High Voltage, 1G (2.5V table, Automotive) VIH 1.8 V 10
Input Low Voltage, 1G (2.5V table, Automotive) VIL 0.7 V 10
Output High Voltage (2.5V table, Automotive) VOH 1.6 V IOH = -8mA. 10
Output Low Voltage (2.5V table, Automotive) VOL 0.625 V IOL = 8mA. 10
Operating Supply Current 5PB1104 (2.5V, Automotive) at 40MHz IDD 15 17 mA 40MHz, CL = 5pF. 10
Operating Supply Current 5PB1104 (2.5V, Automotive) at 100MHz IDD 35 42 mA 100MHz, CL = 5pF. 10
Operating Supply Current 5PB1104 (2.5V, Automotive) at 156.25MHz IDD 52 67 mA 156.25MHz, CL = 5pF. 10
Operating Supply Current 5PB1104 (2.5V, Automotive) at 200MHz IDD 56 80 mA 200MHz, CL = 5pF. 10
Input High Leakage (2.5V table, Automotive) IIH 5 µA VIN = VDD 10
Input Low Leakage (2.5V table, Automotive) IIL 5 µA VIN = 0V 10
Operating Voltage VDD (3.3V table, Automotive) VDD 3.135 3.3 3.465 V 12
Input High Voltage, 1G (3.3V table, Automotive) VIH 2.1 V 12
Output High Voltage (3.3V table, Automotive) VOH 2.1 V IOH = -12mA. 12
Output Low Voltage 5PB1104 (3.3V table, Automotive) VOL 0.825 V IOL = 12mA. 12
Operating Supply Current 5PB1104 (3.3V, Automotive) at 40MHz IDD 19 22 mA 40MHz, CL = 5pF. 12
Operating Supply Current 5PB1104 (3.3V, Automotive) at 100MHz IDD 45 54 mA 100MHz, CL = 5pF. 12
Operating Supply Current 5PB1104 (3.3V, Automotive) at 156.25MHz IDD 67 87 mA 156.25MHz, CL = 5pF. 12
Operating Supply Current 5PB1104 (3.3V, Automotive) at 200MHz IDD 75 107 mA 200MHz, CL = 5pF. 12
Input High Leakage (3.3V table, Automotive) IIH 5 µA VIN = VDD 12
Input Low Leakage (3.3V table, Automotive) IIL 5 µA VIN = 0V 12
Input Frequency (1.8V, Automotive) 0 200 MHz 14
Output Rise Time (5pF load, 1.8V, Automotive) tOR 0.65 1.2 ns 0.36V to 1.44V, CL = 5pF. 14
Output Fall Time (5pF load, 1.8V, Automotive) 5PB1104 tOF 0.65 1.2 ns 1.44V to 0.36V, CL = 5pF. 14
Propagation Delay (1.8V, Automotive) 5PB1104 tPD 1 3.4 ns With rail-to-rail input clock. 14
Output to Output Skew (1.8V, Automotive) 35 87 ps Rising edges at VDD/2. 14
Device to Device Skew (1.8V, Automotive) 200 ps Rising edges at VDD/2. 14
Output Rise Time (5pF load, 2.5V, Automotive) 5PB1104 tOR 0.63 1.2 ns 0.5V to 2.0V, CL = 5pF. 16
Output Fall Time (5pF load, 2.5V, Automotive) 5PB1104 tOF 0.63 1.2 ns 2.0V to 0.5V, CL = 5pF. 16
Propagation Delay (2.5V, Automotive) 5PB1104 tPD 1 4.5 ns With rail-to-rail input clock. 16
Output to Output Skew (2.5V, Automotive) 35 87 ps Rising edges at VDD/2. 16
Device to Device Skew (2.5V, Automotive) 200 ps Rising edges at VDD/2. 16
Output Rise Time (5pF load, 3.3V, Automotive) 5PB1104 tOR 0.61 1.2 ns 0.66V to 2.64V, CL = 5pF. 18
Output Fall Time (5pF load, 3.3V, Automotive) 5PB1104 tOF 0.61 1.2 ns 2.64V to 0.66V, CL = 5pF. 18
Propagation Delay (3.3V, Automotive) 5PB1104 tPD 1 3.4 ns With rail-to-rail input clock. 18
Output to Output Skew (3.3V, Automotive) 35 87 ps Rising edges at VDD/2. 18
Device to Device Skew (3.3V, Automotive) 200 ps Rising edges at VDD/2. 18
Thermal Resistance Junction-to-Ambient, 8-DFN (5PB1104CMT) ΘJA 120.2 °C/W still air 6
Thermal Resistance Junction-to-Case, 8-DFN (5PB1104CMT) ΘJC 99.4 °C/W still air 6
Thermal Resistance Junction-to-Board, 8-DFN (5PB1104CMT) ΘJB 63.3 °C/W still air 6

CAD (KiCad official)

  • Symbol: 5PB1104CMT18
  • Footprint: Package_DFN_QFN:WDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm
  • 3D model: WDFN-8(2x2), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: 5pb1104cmt18-etched.step / 5pb1104cmt18-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 5pb1104cmt18.step / 5pb1104cmt18.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (41 pp, sha256 a39aca2d9b003582, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF