# 553MLFT

**RENESAS** · Clock Buffers, Drivers · SOIC-8

553MLFT from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD | power_in | Positive supply; connect to +2.5 V, +3.3 V or +5.0 V, with operating voltage stated as 2.375 V to 5.25 V overall. |
| 2 | Q0 | output | Clock output 0; all four outputs must use identical terminations, loads and trace geometries to achieve the stated output-to-output skew of 50 ps maximum. |
| 3 | Q1 | output | Clock output 1; all four outputs must use identical terminations, loads and trace geometries to achieve the stated output-to-output skew of 50 ps maximum. |
| 4 | GND | power_in | Ground; connect to ground, with a 0.01 µF decoupling capacitor recommended between VDD (pin 1) and GND (pin 4) placed close to the device. |
| 5 | ICLK | input | Clock input; 5 V tolerant, with absolute maximum rating of -0.5 V to 5.5 V. |
| 6 | Q2 | output | Clock output 2; all four outputs must use identical terminations, loads and trace geometries to achieve the stated output-to-output skew of 50 ps maximum. |
| 7 | Q3 | output | Clock output 3; all four outputs must use identical terminations, loads and trace geometries to achieve the stated output-to-output skew of 50 ps maximum. |
| 8 | OE | input | Output Enable; tri-states the outputs when low, and should be connected to VDD for normal operation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Clock and Timing |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Ambient Operating Temperature (commercial) |  | 0 |  | 70 | °C |  | 3 |
| Power Supply Voltage (measured in respect to GND) |  | 2.375 |  | 5.25 | V |  | 3 |
| Supply Voltage | VDD |  |  | 7 | V |  | 3 |
| Output Enable and All Outputs |  | -0.5 |  |  | V | Upper limit printed as VDD+0.5 V | 3 |
| ICLK |  | -0.5 |  | 5.5 | V |  | 3 |
| Storage Temperature |  | -65 |  | 150 | °C |  | 3 |
| Junction Temperature |  |  |  | 125 | °C |  | 3 |
| Soldering Temperature |  |  |  | 260 | °C |  | 3 |
| Operating Voltage | VDD | 2.375 |  | 2.625 | V | VDD=2.5 V ±5% | 3 |
| Input High Voltage, ICLK | VIH |  |  | 5.5 | V | VDD=2.5 V ±5%; Note 1 | 3 |
| Input High Voltage, OE | VIH | 1.8 |  |  | V | VDD=2.5 V ±5% | 3 |
| Input Low Voltage, OE | VIL |  |  | 0.7 | V | VDD=2.5 V ±5% | 3 |
| Output High Voltage | VOH | 2 |  |  | V | VDD=2.5 V ±5%; IOH = -16 mA | 3 |
| Output Low Voltage | VOL |  |  | 0.4 | V | VDD=2.5 V ±5%; IOL = 16 mA | 3 |
| Operating Supply Current | IDD |  |  | 25 | mA | VDD=2.5 V ±5%; No load, 135 MHz | 3 |
| Short Circuit Current | IOS | -28 |  | 28 | mA | VDD=2.5 V ±5% | 3 |
| Operating Voltage | VDD | 3.15 |  | 3.45 | V | VDD=3.3 V ±5% | 4 |
| Input High Voltage, ICLK | VIH |  |  | 5.5 | V | VDD=3.3 V ±5%; Note 1 | 4 |
| Input High Voltage, OE | VIH | 2 |  |  | V | VDD=3.3 V ±5% | 4 |
| Input Low Voltage, OE | VIL |  |  | 0.8 | V | VDD=3.3 V ±5% | 4 |
| Output High Voltage | VOH | 2.4 |  |  | V | VDD=3.3 V ±5%; IOH = -25 mA | 4 |
| Output Low Voltage | VOL |  |  | 0.4 | V | VDD=3.3 V ±5%; IOL = 25 mA | 4 |
| Operating Supply Current | IDD |  |  | 35 | mA | VDD=3.3 V ±5%; No load, 135 MHz | 4 |
| Short Circuit Current | IOS | -50 |  | 50 | mA | VDD=3.3 V ±5% | 4 |
| Operating Voltage | VDD | 4.75 |  | 5.25 | V | VDD=5 V ±5% | 4 |
| Operating Supply Current | IDD |  |  | 45 | mA | VDD=5 V ±5%; No load, 135 MHz | 4 |
| Short Circuit Current | IOS | -80 |  | 80 | mA | VDD=5 V ±5% | 4 |
| Input Frequency |  | 0 |  | 200 | MHz | VDD = 2.5 V ±5% | 5 |
| Output Rise Time | tOR | 1 |  | 1.5 | ns | VDD = 2.5 V ±5%; 0.8 to 2.0 V, CL=15 pF | 5 |
| Output Fall Time | tOF | 1 |  | 1.5 | ns | VDD = 2.5 V ±5%; 2.0 to 0.8 V, CL=15 pF | 5 |
| Propagation Delay |  | 2.2 | 3 | 5 | ns | VDD = 2.5 V ±5%; Note 1 | 5 |
| Additive Period Jitter |  |  |  | 1 | ps | VDD = 2.5 V ±5% | 5 |
| Output to Output Skew |  | 0 |  | 50 | ps | VDD = 2.5 V ±5%; Note 2; rising edges at VDD/2 | 5 |
| Device to Device Skew |  |  |  | 500 | ps | VDD = 2.5 V ±5%; rising edges at VDD/2 | 5 |
| Output Rise Time | tOR | 0.6 |  | 1 | ns | VDD = 3.3 V ±5%; 0.8 to 2.0 V, CL=15 pF | 5 |
| Output Fall Time | tOF | 0.6 |  | 1 | ns | VDD = 3.3 V ±5%; 2.0 to 0.8 V, CL=15 pF | 5 |
| Propagation Delay |  | 2 | 2.4 | 4 | ns | VDD = 3.3 V ±5%; Note 1 | 5 |
| Output Rise Time | tOR | 0.3 |  | 0.7 | ns | VDD = 5 V ±5%; 0.8 to 2.0 V, CL=15 pF | 5 |
| Output Fall Time | tOF | 0.3 |  | 0.7 | ns | VDD = 5 V ±5%; 2.0 to 0.8 V, CL=15 pF | 5 |
| Propagation Delay |  | 1.8 | 2.5 | 4 | ns | VDD = 5 V ±5%; Note 1 | 5 |

## CAD (KiCad official)

- Symbol: `553MLFT`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `553mlft-etched.step` / `553mlft-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `553mlft.step` / `553mlft.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [RENESAS datasheet](docs/553mlft-datasheet.pdf) (9 pp, sha256 `5dfc6b3abd6da676`, retrieved 2026-10-31, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/553mlft-datasheet.pdf)