component
551MLF
Public Made by Adomby adom
RENESAS Clock Buffers, Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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551MLF
RENESAS · Clock Buffers, Drivers · SOIC-8
551MLF from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ICLK | input | Clock input with an internal pull-up resistor. |
| 2 | Q1 | output | Non-inverting clock output 1, tri-stated when OE is low. |
| 3 | Q2 | output | Non-inverting clock output 2, tri-stated when OE is low. |
| 4 | Q3 | output | Non-inverting clock output 3, tri-stated when OE is low. |
| 5 | Q4 | output | Non-inverting clock output 4, tri-stated when OE is low. |
| 6 | GND | power_in | Connect to ground; the 0.01 µF decoupling capacitor between VDD (pin 7) and GND should be placed as close to the device as possible. |
| 7 | VDD | power_in | Connect to 3.3 V or 5.0 V (power supply voltage range is +3.0 V to +5.5 V measured with respect to GND). |
| 8 | OE | input | Output Enable input that tri-states the outputs when low, with an internal pull-up resistor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Clock and Timing |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Voltage | VDD | 3 | 3.6 | V | VDD=3.3 V ±10% | 4 | |
| Input High Voltage, ICLK | VIH | 3.8 | V | VDD=3.3 V ±10%; Note 1 | 4 | ||
| Input High Voltage, OE | VIH | 2 | V | VDD=3.3 V ±10% | 4 | ||
| Input Low Voltage, OE | VIL | 0.8 | V | VDD=3.3 V ±10% | 4 | ||
| Output High Voltage | VOH | 2.4 | V | VDD=3.3 V ±10%; IOH = -25 mA | 4 | ||
| Output Low Voltage | VOL | 0.4 | V | VDD=3.3 V ±10%; IOL = 25 mA | 4 | ||
| Operating Supply Current | IDD | 18 | mA | VDD=3.3 V ±10%; No load, 135 MHz | 4 | ||
| Short Circuit Current | IOS | -50 | 50 | mA | VDD=3.3 V ±10% | 4 | |
| Operating Voltage | VDD | 4.5 | 5.5 | V | VDD = 5 V ±10% | 4 | |
| Input High Voltage, ICLK | VIH | 5.5 | V | VDD = 5 V ±10%; Note 1 | 4 | ||
| Operating Supply Current | IDD | 35 | mA | VDD = 5 V ±10%; No load, 135 MHz | 4 | ||
| Short Circuit Current | IOS | -80 | 80 | mA | VDD = 5 V ±10% | 4 | |
| Input Frequency | 0 | 160 | MHz | VDD = 3.3 V ±10% | 5 | ||
| Output Frequency | 160 | MHz | VDD = 3.3 V ±10%; 15 pF load, Note 4 | 5 | |||
| Output Clock Rise Time | tOR | 1 | ns | VDD = 3.3 V ±10%; 0.8 to 2.0 V | 5 | ||
| Output Clock Fall Time | tOF | 1 | ns | VDD = 3.3 V ±10%; 2.0 to 0.8 V | 5 | ||
| Propagation Delay | 2 | 4 | 8 | ns | VDD = 3.3 V ±10%; Note 1; 135 MHz | 5 | |
| Output to Output Skew | 250 | ps | VDD = 3.3 V ±10%; Note 2; Rising edges at VDD/2 | 5 | |||
| Input Frequency | 0 | 135 | MHz | VDD = 5 V ±10% | 5 | ||
| Output Frequency | 135 | MHz | VDD = 5 V ±10%; 15 pF load, Note 4 | 5 | |||
| Propagation Delay | 1.5 | 3 | 6 | ns | VDD = 5 V ±10%; Note 1; 135 MHz | 5 | |
| Supply Voltage | VDD | 7 | V | 3 | |||
| All Inputs and Outputs | -0.5 | V | Relative to VDD+0.5 V upper limit | 3 | |||
| Ambient Operating Temperature, Commercial | 0 | 70 | °C | Commercial grade (551MLF) | 3 | ||
| Storage Temperature | -65 | 150 | °C | 3 | |||
| Junction Temperature | 125 | °C | 3 | ||||
| Soldering Temperature | 260 | °C | 3 | ||||
| Power Supply Voltage | 3 | 5.5 | V | Measured with respect to GND | 3 |
CAD (KiCad official)
- Symbol:
551MLF - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
551mlf-etched.step/551mlf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);551mlf.step/551mlf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RENESAS datasheet (10 pp, sha256
802e91a02e0502bd, retrieved 2026-10-28, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# 551MLF
**RENESAS** · Clock Buffers, Drivers · SOIC-8
551MLF from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ICLK | input | Clock input with an internal pull-up resistor. |
| 2 | Q1 | output | Non-inverting clock output 1, tri-stated when OE is low. |
| 3 | Q2 | output | Non-inverting clock output 2, tri-stated when OE is low. |
| 4 | Q3 | output | Non-inverting clock output 3, tri-stated when OE is low. |
| 5 | Q4 | output | Non-inverting clock output 4, tri-stated when OE is low. |
| 6 | GND | power_in | Connect to ground; the 0.01 µF decoupling capacitor between VDD (pin 7) and GND should be placed as close to the device as possible. |
| 7 | VDD | power_in | Connect to 3.3 V or 5.0 V (power supply voltage range is +3.0 V to +5.5 V measured with respect to GND). |
| 8 | OE | input | Output Enable input that tri-states the outputs when low, with an internal pull-up resistor. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Clock and Timing |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Voltage | VDD | 3 | | 3.6 | V | VDD=3.3 V ±10% | 4 |
| Input High Voltage, ICLK | VIH | | | 3.8 | V | VDD=3.3 V ±10%; Note 1 | 4 |
| Input High Voltage, OE | VIH | 2 | | | V | VDD=3.3 V ±10% | 4 |
| Input Low Voltage, OE | VIL | | | 0.8 | V | VDD=3.3 V ±10% | 4 |
| Output High Voltage | VOH | 2.4 | | | V | VDD=3.3 V ±10%; IOH = -25 mA | 4 |
| Output Low Voltage | VOL | | | 0.4 | V | VDD=3.3 V ±10%; IOL = 25 mA | 4 |
| Operating Supply Current | IDD | | | 18 | mA | VDD=3.3 V ±10%; No load, 135 MHz | 4 |
| Short Circuit Current | IOS | -50 | | 50 | mA | VDD=3.3 V ±10% | 4 |
| Operating Voltage | VDD | 4.5 | | 5.5 | V | VDD = 5 V ±10% | 4 |
| Input High Voltage, ICLK | VIH | | | 5.5 | V | VDD = 5 V ±10%; Note 1 | 4 |
| Operating Supply Current | IDD | | | 35 | mA | VDD = 5 V ±10%; No load, 135 MHz | 4 |
| Short Circuit Current | IOS | -80 | | 80 | mA | VDD = 5 V ±10% | 4 |
| Input Frequency | | 0 | | 160 | MHz | VDD = 3.3 V ±10% | 5 |
| Output Frequency | | | | 160 | MHz | VDD = 3.3 V ±10%; 15 pF load, Note 4 | 5 |
| Output Clock Rise Time | tOR | | | 1 | ns | VDD = 3.3 V ±10%; 0.8 to 2.0 V | 5 |
| Output Clock Fall Time | tOF | | | 1 | ns | VDD = 3.3 V ±10%; 2.0 to 0.8 V | 5 |
| Propagation Delay | | 2 | 4 | 8 | ns | VDD = 3.3 V ±10%; Note 1; 135 MHz | 5 |
| Output to Output Skew | | | | 250 | ps | VDD = 3.3 V ±10%; Note 2; Rising edges at VDD/2 | 5 |
| Input Frequency | | 0 | | 135 | MHz | VDD = 5 V ±10% | 5 |
| Output Frequency | | | | 135 | MHz | VDD = 5 V ±10%; 15 pF load, Note 4 | 5 |
| Propagation Delay | | 1.5 | 3 | 6 | ns | VDD = 5 V ±10%; Note 1; 135 MHz | 5 |
| Supply Voltage | VDD | | | 7 | V | | 3 |
| All Inputs and Outputs | | -0.5 | | | V | Relative to VDD+0.5 V upper limit | 3 |
| Ambient Operating Temperature, Commercial | | 0 | | 70 | °C | Commercial grade (551MLF) | 3 |
| Storage Temperature | | -65 | | 150 | °C | | 3 |
| Junction Temperature | | | | 125 | °C | | 3 |
| Soldering Temperature | | | | 260 | °C | | 3 |
| Power Supply Voltage | | 3 | | 5.5 | V | Measured with respect to GND | 3 |
## CAD (KiCad official)
- Symbol: `551MLF`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `551mlf-etched.step` / `551mlf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `551mlf.step` / `551mlf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [RENESAS datasheet](docs/551mlf-datasheet.pdf) (10 pp, sha256 `802e91a02e0502bd`, retrieved 2026-10-28, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/551mlf-datasheet.pdf)