component
5.0SMDJ30CA
Public Made by Adomby adom
Liown TVS, SMC(DO-214AB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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5.0SMDJ30CA
Liown · TVS · SMC(DO-214AB)
5.0SMDJ30CA from Liown, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Liown |
| Package | SMC(DO-214AB) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPPM | 5000 | W | 10/1000μs waveform (Note1, Note2, Fig.1) | 1 | ||
| Steady state power dissipation | PM(AV) | 6.5 | W | TA=50℃ (Fig.5) | 1 | ||
| Peak forward surge current | IFSM | 300 | A | 8.3ms single half sine-wave superimposed on rated load, (JEDEC Method) (Note3, Fig.6) | 1 | ||
| Operating junction and storage temperature range | TJ、TSTG | -55 | 150 | ℃ | 1 | ||
| Typical thermal resistance junction to lead | RθJL | 15 | ℃/W | junction to lead, typical | 1 | ||
| Typical thermal resistance junction to ambient | RθJA | 75 | ℃/W | junction to ambient, typical | 1 | ||
| Breakdown voltage (minimum) | VB | 33.3 | V | @IT 1 mA | 2 | ||
| Breakdown voltage (maximum) | VB | 36.8 | V | @IT 1 mA | 2 | ||
| Maximum clamping voltage | VC | 48.4 | V | @IPP 103.0 A | 2 | ||
| Reverse leakage current | IR | 2 | μA | @VR 30.0 V | 2 |
CAD (KiCad official)
- Symbol:
5.0SMDJ30CA - Footprint:
Diode_SMD:D_SMC - 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files:
5-0smdj30ca-etched.step/5-0smdj30ca-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);5-0smdj30ca.step/5-0smdj30ca.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Liown datasheet (6 pp, sha256
978426d3c2f4f44c, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# 5.0SMDJ30CA
**Liown** · TVS · SMC(DO-214AB)
5.0SMDJ30CA from Liown, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Liown |
| Package | SMC(DO-214AB) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPPM | | | 5000 | W | 10/1000μs waveform (Note1, Note2, Fig.1) | 1 |
| Steady state power dissipation | PM(AV) | | | 6.5 | W | TA=50℃ (Fig.5) | 1 |
| Peak forward surge current | IFSM | | | 300 | A | 8.3ms single half sine-wave superimposed on rated load, (JEDEC Method) (Note3, Fig.6) | 1 |
| Operating junction and storage temperature range | TJ、TSTG | -55 | | 150 | ℃ | | 1 |
| Typical thermal resistance junction to lead | RθJL | | 15 | | ℃/W | junction to lead, typical | 1 |
| Typical thermal resistance junction to ambient | RθJA | | 75 | | ℃/W | junction to ambient, typical | 1 |
| Breakdown voltage (minimum) | VB | 33.3 | | | V | @IT 1 mA | 2 |
| Breakdown voltage (maximum) | VB | | | 36.8 | V | @IT 1 mA | 2 |
| Maximum clamping voltage | VC | | | 48.4 | V | @IPP 103.0 A | 2 |
| Reverse leakage current | IR | | | 2 | μA | @VR 30.0 V | 2 |
## CAD (KiCad official)
- Symbol: `5.0SMDJ30CA`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
- 3D model files: `5-0smdj30ca-etched.step` / `5-0smdj30ca-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `5-0smdj30ca.step` / `5-0smdj30ca.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Liown datasheet](docs/5-0smdj30ca-datasheet.pdf) (6 pp, sha256 `978426d3c2f4f44c`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/5-0smdj30ca-datasheet.pdf)