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5.0SMDJ200CA

Zhengxin(正芯) · IC · SMC

5.0SMDJ200CA from Zhengxin(正芯), in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Bidirectional (CA) device terminal 1 with no polarity marking; the symbol shows two unlabeled terminals, and the device is rated at 200 V VRWM and 224-247 V breakdown at 1 mA.
2 A2 passive Bidirectional (CA) device terminal 2 with no polarity marking; the symbol shows two unlabeled terminals, and the device clamps at 324 V maximum at 15.4 A peak pulse current.

Key specifications

Parameter Value
Manufacturer Zhengxin(正芯)
Package SMC
Category
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage (min) VBR 224 V @ IT = 1.0 mA (5.0SMDJ200CA, bidirectional) 3
Breakdown voltage (max) VBR 247 V @ IT = 1.0 mA (5.0SMDJ200CA, bidirectional) 3
Maximum reverse leakage current IR 5 μA @ VRWM = 200 V 3
Maximum reverse surge current IPP 15.4 A 10/1000 μs waveform 3
Maximum clamping voltage VC 324 V @ IPP (10/1000 μs waveform) 3
Peak power dissipation PPPM 5000 W 10/1000 μs waveform 1
Power dissipation PD 6.5 W on infinite heat sink at TL=75℃ 1
Operating junction and storage temperature range TJ,TSTG -55 150 ℃ 1
Thermal resistance, junction to ambient RθJ-A 75 ℃/W junction to ambient; mounted on minimum recommended pad layout 2
Thermal resistance, junction to lead RθJ-L 15 ℃/W junction to lead; mounted on minimum recommended pad layout 2
Thermal resistance, junction to case RθJ-C 13 ℃/W junction to case; mounted on minimum recommended pad layout 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminals: Tin plated leads, solderable per J-STD￾002 and JESD22-B102 ● Polarity: For uni-directional types the band denotes 1

CAD (KiCad official)

  • Symbol: 5.0SMDJ200CA
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC (KiCad packages3D, STEP)
  • 3D model files: 5-0smdj200ca-etched.step / 5-0smdj200ca-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 5-0smdj200ca.step / 5-0smdj200ca.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Zhengxin(正芯) datasheet (5 pp, sha256 b6677432328dd8c0, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF