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Contents

README

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40P06-VB

VBsemi Elec · MOSFETs · SO-8

40P06-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the P-channel MOSFET; rated for VDS = -60 V with continuous drain current of -8 A at TC = 25 °C.
2 S passive Source terminal of the P-channel MOSFET; rated for VDS = -60 V with continuous drain current of -8 A at TC = 25 °C.
3 S passive Source terminal of the P-channel MOSFET; rated for VDS = -60 V with continuous drain current of -8 A at TC = 25 °C.
4 G input Gate terminal; gate-source voltage is limited to ±20 V per the absolute maximum ratings.
5 D passive Drain terminal of the P-channel MOSFET; the drain is also the junction-to-foot thermal path (RthJF = 30 °C/W).
6 D passive Drain terminal of the P-channel MOSFET; the drain is also the junction-to-foot thermal path (RthJF = 30 °C/W).
7 D passive Drain terminal of the P-channel MOSFET; the drain is also the junction-to-foot thermal path (RthJF = 30 °C/W).
8 D passive Drain terminal of the P-channel MOSFET; the drain is also the junction-to-foot thermal path (RthJF = 30 °C/W).

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SO-8
Category Triode/MOS Tube/Transistor
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -60 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -8 A TC = 25 °C 1
Continuous Drain Current ID -4.75 A TC = 125 °C 1
Continuous Source Current (Diode Conduction) IS -4.5 A 1
Pulsed Drain Current IDM -32 A Note a: pulse width ≤ 300 μs, duty cycle ≤ 2 % 1
Single Pulse Avalanche Current IAS -22.4 A L = 0.1 mH 1
Single Pulse Avalanche Energy EAS 25 mJ 1
Maximum Power Dissipation PD 5 W TC = 25 °C 1
Maximum Power Dissipation PD 1.67 W TC = 125 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 175 °C 1
Junction-to-Ambient (PCB Mount) RthJA 110 °C/W PCB mount, FR-4 1" square PCB (Note b) 1
Junction-to-Foot (Drain) RthJF 30 °C/W 1
Drain-Source Breakdown Voltage VDS -60 V VGS = 0 V, ID = -250 μA 2
Gate-Source Threshold Voltage VGS(th) -1 -2.5 V VDS = VGS, ID = -250 μA 2
Gate-Source Leakage IGSS -100 100 nA VDS = 0 V, VGS = ± 20 V 2
Zero Gate Voltage Drain Current IDSS -1 μA VGS = 0 V, VDS = -60 V 2
Zero Gate Voltage Drain Current IDSS -50 μA VGS = 0 V, VDS = -60 V, TJ = 125 °C 2
Zero Gate Voltage Drain Current IDSS -150 μA VGS = 0 V, VDS = -60 V, TJ = 175 °C 2
On-State Drain Current ID(on) -30 A VGS = -10 V, VDS ≤ -5 V 2
Drain-Source On-State Resistance RDS(on) 0.06 Ω VGS = -10 V, ID = -4.3 A 2
Drain-Source On-State Resistance RDS(on) 0.07 Ω VGS = -10 V, ID = -4.3 A, TJ = 125 °C 2
Drain-Source On-State Resistance RDS(on) 0.08 Ω VGS = -10 V, ID = -4.3 A, TJ = 175 °C 2
Drain-Source On-State Resistance RDS(on) 0.063 Ω VGS = -4.5 V, ID = -3.8 A 2
Gate Resistance Rg 1.3 2.5 4 Ω f = 1 MHz 2
Output Capacitance Coss 334 417 pF VGS = 0 V, VDS = -30 V, f = 1 MHz 2
Reverse Transfer Capacitance Crss 114 142 pF VGS = 0 V, VDS = -30 V, f = 1 MHz 2
Turn-On Delay Time td(on) 11 17 ns VDD = -30 V, RL = 8.8 Ω, ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω 2
Rise Time tr 11 17 ns VDD = -30 V, RL = 8.8 Ω, ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 35 52 ns VDD = -30 V, RL = 8.8 Ω, ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω 2
Fall Time tf 6 9 ns VDD = -30 V, RL = 8.8 Ω, ID ≅ -5 A, VGEN = -10 V, Rg = 1 Ω 2
Pulsed Current ISM -32 A Note a: pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 % 2
Forward Voltage VSD -0.8 -1.2 V IF = -2.8 A, VGS = 0 V 2
Forward Transconductance gfs 13 S VDS = -15 V, ID = -4.3 A 2
Input Capacitance Ciss 1500 pF VGS = 0 V, VDS = -30 V, f = 1 MHz 2
Gate-Source Charge Qgs -4.7 nC VGS = -10 V, VDS = -30 V, ID = -5 A 2
Gate-Drain Charge Qgd -9 nC VGS = -10 V, VDS = -30 V, ID = -5 A 2

CAD (KiCad official)

  • Symbol: 40P06-VB
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: 40p06-vb-etched.step / 40p06-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 40p06-vb.step / 40p06-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 11d626c3a0b4d023, retrieved 2026-10-29, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF