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Contents

README

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3.0SMCJ33A

Littelfuse · TVS · DO-214AB

3.0SMCJ33A from Littelfuse, in a DO-214AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the unidirectional 3.0SMCJ33A TVS (marked with cathode band), with VR 33.00 V stand-off and 36.70-40.60 V breakdown at 1 mA.
2 Anode passive Anode terminal of the unidirectional 3.0SMCJ33A TVS, to be connected to the lower-potential/return side of the protected line.

Key specifications

Parameter Value
Manufacturer Littelfuse
Package DO-214AB
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Stand-off Voltage VR 33 V 2
Breakdown Voltage VBR 36.7 40.6 V @ IT = 1 mA 2
Test Current IT 1 mA 2
Maximum Clamping Voltage (10/1000μs) VC 53.3 V @ Ipp (10/1000μs) 2
Maximum Peak Pulse Current (10/1000μs) Ipp 56.3 A 10/1000μs 2
Maximum Clamping Voltage (8/20μs) VC 68.86 V @ Ipp (8/20μs) 2
Maximum Peak Pulse Current (8/20μs) Ipp 281.5 A 8/20μs 2
Maximum Reverse Leakage IR 2 µA @ VR 2
Maximum Temperature coefficient of VBR 0.097 %/C 2
Peak Pulse Power Dissipation PPPM 3000 W 10/1000μs waveform, TA=25°C 1
Power dissipation on infinite heatsink PD 6.5 W TC = 25 °C 1
Peak Forward Surge Current IFSM 300 A 8.3ms single half sine wave, unidirectional only 1
Maximum Instantaneous Forward Voltage VF 3.5 V at 100A, unidirectional only 1
Operating Temperature Range TJ -65 150 °C 1
Storage Temperature Range TSTG -65 175 °C 1
Typical Thermal Resistance Junction to Lead RθJL 15 °C/W 1
Typical Thermal Resistance Junction to Ambient RθJA 75 °C/W 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper 2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal. 1

CAD (KiCad official)

  • Symbol: 3.0SMCJ33A
  • Footprint: Diode_SMD:D_SMC
  • 3D model: DO-214AB (KiCad packages3D, STEP)
  • 3D model files: 3-0smcj33a-etched.step / 3-0smcj33a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 3-0smcj33a.step / 3-0smcj33a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse datasheet (6 pp, sha256 53531fb5f0ed34c5, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF