component

2SC4672U-H127

Public Made by Adom

by adom

ST Semtech Bipolar (BJT), SOT-89. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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2SC4672U-H127

ST Semtech · Bipolar (BJT) · SOT-89

2SC4672U-H127 from ST Semtech, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B input Base of the NPN transistor; VEBO max 6 V, IEBO max 100 nA at VEB = 5 V.
2 C passive Collector of the NPN transistor; VCBO 60 V, VCEO 50 V, IC 3 A DC and 6 A pulse (TP = 10 ms).
3 E passive Emitter of the NPN transistor; reference terminal for VCE and VEB ratings.

Key specifications

Parameter Value
Manufacturer ST Semtech
Package SOT-89
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector Emitter Saturation Voltage VCE(sat) 0.35 V IC = 1 A, IB = 50 mA 2
DC Current Gain hFE 120 270 VCE = 2 V, IC = 0.5 A 2
DC Current Gain hFE 45 VCE = 2 V, IC = 1.5 A 2
Collector Base Breakdown Voltage V(BR)CBO 60 V IC = 50 µA 2
Collector Emitter Breakdown Voltage V(BR)CEO 50 V IC = 1 mA 2
Emitter Base Breakdown Voltage V(BR)EBO 6 V IE = 50 µA 2
Collector Base Cutoff Current ICBO 100 nA VCB = 60 V 2
Emitter Base Cutoff Current IEBO 100 nA VEB = 5 V 2
Collector Base Voltage VCBO 60 V 1
Collector Emitter Voltage VCEO 50 V 1
Emitter Base Voltage VEBO 6 V 1
Collector Current - DC IC 3 A 1
Collector Current - Pulse ICP 6 A TP = 10 ms 1
Total Power Dissipation Ptot 0.5 W Device on FR-4 PCB, 2oz copper, minimum recommended pad layout (note 1) 1
Total Power Dissipation Ptot 2 W Device on FR-4 PCB, 2oz copper, 1-inch square copper plate in still air (note 2) 1
Junction Temperature Tj 150 ℃ 1
Storage Temperature Range Tstg -55 150 ℃ 1
Thermal Resistance from Junction to Ambient RθJA 250 ℃/W Device on FR-4 PCB, 2oz copper, minimum recommended pad layout (note 1) 1
Thermal Resistance from Junction to Ambient RθJA 62.5 ℃/W Device on FR-4 PCB, 2oz copper, 1-inch square copper plate in still air (note 2) 1

CAD (KiCad official)

  • Symbol: 2SC4672U-H127
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: 2sc4672u-h127-etched.step / 2sc4672u-h127-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 2sc4672u-h127.step / 2sc4672u-h127.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ST Semtech datasheet (4 pp, sha256 9207053ceee562d7, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF