component
2N7002HR
Public Made by Adomby adom
Nexperia MOSFETs, TO-236AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 10d ago |
| viewers | 10d ago |
| 2n7002hr-etched.glb | 10d ago |
| 2n7002hr-etched.step | 10d ago |
| 2n7002hr-hero.glb | 10d ago |
| 2n7002hr-hero.overlay.json | 10d ago |
| 2n7002hr.glb | 10d ago |
| 2n7002hr.kicad_mod | 10d ago |
| 2n7002hr.kicad_sym | 10d ago |
| 2n7002hr.lbr | 10d ago |
| 2n7002hr.step | 10d ago |
| package.json | 10d ago |
| page.json | 10d ago |
| README.md | 10d ago |
2N7002HR
Nexperia · MOSFETs · TO-236AB
2N7002HR from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the gate-source voltage VGS is limited to -20 V to 20 V at Tamb = 25 °C. |
| 2 | S | passive | Source terminal; the source current IS is limited to 360 mA at Tamb = 25 °C in the source-drain diode. |
| 3 | D | passive | Drain terminal; the drain-source voltage VDS is limited to 60 V and the drain current ID to 360 mA at VGS = 10 V, Tamb = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TO-236AB |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 60 | V | 3 | |||
| Gate-source voltage | VGS | -20 | 20 | V | Tamb = 25 °C | 3 | |
| Drain current | ID | 360 | mA | VGS = 10 V; Tamb = 25 °C [1] | 3 | ||
| Drain current | ID | 230 | mA | VGS = 10 V; Tamb = 100 °C [1] | 3 | ||
| Peak drain current | IDM | 1.4 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 | ||
| Total power dissipation | Ptot | 340 | mW | Tamb = 25 °C [2] | 3 | ||
| Total power dissipation | Ptot | 420 | mW | [1] (FR4 PCB, mounting pad for drain 1 cm2) | 3 | ||
| Total power dissipation | Ptot | 1.1 | W | Tsp = 25 °C | 3 | ||
| Junction temperature | Tj | -55 | 150 | °C | 3 | ||
| Ambient temperature | Tamb | -55 | 150 | °C | 3 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 3 | ||
| Source current | IS | 360 | mA | Tamb = 25 °C [1] | 3 | ||
| Thermal resistance junction to ambient | Rth(j-a) | 310 | 370 | K/W | in free air; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint | 5 | |
| Thermal resistance junction to ambient | Rth(j-a) | 260 | 300 | K/W | in free air; [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm2 | 5 | |
| Thermal resistance junction to solder point | Rth(j-sp) | 115 | K/W | 5 | |||
| Drain-source breakdown voltage | V(BR)DSS | 60 | V | ID = 10 µA; VGS = 0 V; Tj = 25 °C | 6 | ||
| Gate-source threshold voltage | VGSth | 1.1 | 1.75 | 2.4 | V | ID = 250 µA; VDS = VGS; Tj = 25 °C | 6 |
| Drain leakage current | IDSS | 1 | µA | VDS = 60 V; VGS = 0 V; Tj = 25 °C | 6 | ||
| Drain leakage current | IDSS | 10 | µA | VDS = 60 V; VGS = 0 V; Tj = 150 °C | 6 | ||
| Gate leakage current | IGSS | 100 | nA | VGS = 20 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Gate leakage current | IGSS | -100 | nA | VGS = -20 V; VDS = 0 V; Tj = 25 °C | 6 | ||
| Drain-source on-state resistance | RDSon | 1 | 1.6 | Ω | VGS = 10 V; ID = 500 mA; Tj = 25 °C | 6 | |
| Drain-source on-state resistance | RDSon | 2.1 | 3.3 | Ω | VGS = 10 V; ID = 500 mA; Tj = 150 °C | 6 | |
| Drain-source on-state resistance | RDSon | 1.3 | 2 | Ω | VGS = 5 V; ID = 50 mA; Tj = 25 °C | 6 | |
| Total gate charge | QG(tot) | 0.3 | 0.5 | nC | VDS = 30 V; ID = 300 mA; VGS = 4.5 V; Tj = 25 °C | 6 | |
| Source-drain voltage | VSD | 0.47 | 0.75 | 1.1 | V | IS = 115 mA; VGS = 0 V; Tj = 25 °C | 6 |
CAD (KiCad official)
- Symbol:
2N7002HR - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: TO-236AB (KiCad packages3D, STEP)
- 3D model files:
2n7002hr-etched.step/2n7002hr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);2n7002hr.step/2n7002hr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (15 pp, sha256
29476a373edb92f3, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).