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2N7002ET1G-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, SOT-23(TO-236). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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2N7002ET1G-VB
VBsemi Elec · MOSFETs · SOT-23(TO-236)
2N7002ET1G-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the datasheet limits gate-source voltage VGS to ±20 V. |
| 2 | S | passive | Source terminal of the N-channel MOSFET; the datasheet gives no separate pin-specific limit. |
| 3 | D | passive | Drain terminal of the N-channel MOSFET; the datasheet rates drain-source voltage VDS at 60 V and continuous drain current at 250 mA (TJ = 150 °C, TA = 25 °C). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SOT-23(TO-236) |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 60 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | 250 | mA | TA = 25 °C | 1 | ||
| Continuous Drain Current | ID | 150 | mA | TA = 100 °C | 1 | ||
| Pulsed Drain Current | IDM | 800 | mA | 1 | |||
| Power Dissipation | PD | 0.3 | W | TA = 25 °C | 1 | ||
| Power Dissipation | PD | 0.13 | W | TA = 100 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 350 | °C/W | 1 | |||
| Drain-Source Breakdown Voltage | VDS | 60 | V | VGS = 0 V, ID = 10 µA | 2 | ||
| Gate-Threshold Voltage | VGS(th) | 1 | 2.5 | V | VDS = VGS, ID = 250 µA | 2 | |
| Gate-Body Leakage | IGSS | -10 | 10 | µA | VDS = 0 V, VGS = ±20 V | 2 | |
| Gate-Body Leakage | IGSS | -1 | 1 | µA | VDS = 0 V, VGS = ±15 V | 2 | |
| Gate-Body Leakage | IGSS | -150 | 150 | nA | VDS = 0 V, VGS = ±10 V | 2 | |
| Gate-Body Leakage | IGSS | -1000 | 1000 | nA | VDS = 0 V, VGS = ±10 V, TJ = 85 °C | 2 | |
| Gate-Body Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±5 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 60 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 500 | µA | VDS = 60 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| On-State Drain Current | ID(on) | 500 | mA | VGS = 10 V, VDS = 7.5 V | 2 | ||
| On-State Drain Current | ID(on) | 300 | mA | VGS = 4.5 V, VDS = 10 V | 2 | ||
| Drain-Source On-Resistance | RDS(on) | 2.8 | Ω | VGS = 10 V, ID = 200 mA | 2 | ||
| Drain-Source On-Resistance | RDS(on) | 3.1 | Ω | VGS = 4.5 V, ID = 150 mA | 2 | ||
| Diode Forward Voltage | VSD | 1.3 | V | IS = 100 mA, VGS = 0 V | 2 | ||
| Total Gate Charge | Qg | 0.4 | 0.6 | nC | VDS = 10 V, VGS = 4.5 V, ID ≅ 150 mA | 2 |
CAD (KiCad official)
- Symbol:
2N7002ET1G-VB - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23(TO-236) (KiCad packages3D, STEP)
- 3D model files:
2n7002et1g-vb-etched.step/2n7002et1g-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);2n7002et1g-vb.step/2n7002et1g-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (8 pp, sha256
a453054ab4f8ae77, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# 2N7002ET1G-VB
**VBsemi Elec** · MOSFETs · SOT-23(TO-236)
2N7002ET1G-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the datasheet limits gate-source voltage VGS to ±20 V. |
| 2 | S | passive | Source terminal of the N-channel MOSFET; the datasheet gives no separate pin-specific limit. |
| 3 | D | passive | Drain terminal of the N-channel MOSFET; the datasheet rates drain-source voltage VDS at 60 V and continuous drain current at 250 mA (TJ = 150 °C, TA = 25 °C). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SOT-23(TO-236) |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 60 | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous Drain Current | ID | | | 250 | mA | TA = 25 °C | 1 |
| Continuous Drain Current | ID | | | 150 | mA | TA = 100 °C | 1 |
| Pulsed Drain Current | IDM | | | 800 | mA | | 1 |
| Power Dissipation | PD | | | 0.3 | W | TA = 25 °C | 1 |
| Power Dissipation | PD | | | 0.13 | W | TA = 100 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Maximum Junction-to-Ambient | RthJA | | | 350 | °C/W | | 1 |
| Drain-Source Breakdown Voltage | VDS | 60 | | | V | VGS = 0 V, ID = 10 µA | 2 |
| Gate-Threshold Voltage | VGS(th) | 1 | | 2.5 | V | VDS = VGS, ID = 250 µA | 2 |
| Gate-Body Leakage | IGSS | -10 | | 10 | µA | VDS = 0 V, VGS = ±20 V | 2 |
| Gate-Body Leakage | IGSS | -1 | | 1 | µA | VDS = 0 V, VGS = ±15 V | 2 |
| Gate-Body Leakage | IGSS | -150 | | 150 | nA | VDS = 0 V, VGS = ±10 V | 2 |
| Gate-Body Leakage | IGSS | -1000 | | 1000 | nA | VDS = 0 V, VGS = ±10 V, TJ = 85 °C | 2 |
| Gate-Body Leakage | IGSS | -100 | | 100 | nA | VDS = 0 V, VGS = ±5 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VDS = 60 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 500 | µA | VDS = 60 V, VGS = 0 V, TJ = 125 °C | 2 |
| On-State Drain Current | ID(on) | 500 | | | mA | VGS = 10 V, VDS = 7.5 V | 2 |
| On-State Drain Current | ID(on) | 300 | | | mA | VGS = 4.5 V, VDS = 10 V | 2 |
| Drain-Source On-Resistance | RDS(on) | | | 2.8 | Ω | VGS = 10 V, ID = 200 mA | 2 |
| Drain-Source On-Resistance | RDS(on) | | | 3.1 | Ω | VGS = 4.5 V, ID = 150 mA | 2 |
| Diode Forward Voltage | VSD | | | 1.3 | V | IS = 100 mA, VGS = 0 V | 2 |
| Total Gate Charge | Qg | | 0.4 | 0.6 | nC | VDS = 10 V, VGS = 4.5 V, ID ≅ 150 mA | 2 |
## CAD (KiCad official)
- Symbol: `2N7002ET1G-VB`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23(TO-236) (KiCad packages3D, STEP)
- 3D model files: `2n7002et1g-vb-etched.step` / `2n7002et1g-vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `2n7002et1g-vb.step` / `2n7002et1g-vb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8602989346144739328) (8 pp, sha256 `a453054ab4f8ae77`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/2n7002et1g-vb-datasheet.pdf)