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2N60 TO252-VB
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VBsemi Elec MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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2N60 TO252-VB
VBsemi Elec · MOSFETs · TO-252
2N60 TO252-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET, with gate-source voltage rated at ±30 V (VGS). |
| 2 | D | passive | Drain of the N-channel MOSFET, rated at 650 V drain-source voltage (VDS) with 1.6 A continuous drain current at TC = 100 °C. |
| 3 | S | passive | Source of the N-channel MOSFET, with continuous source-drain diode current IS of 4 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 650 | V | 1 | |||
| Gate-Source Voltage | VGS | -30 | 30 | V | 1 | ||
| Continuous Drain Current | ID | 1.6 | A | TC = 100 °C | 1 | ||
| Pulsed Drain Current | IDM | 8 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 165 | mJ | 1 | |||
| Repetitive Avalanche Current | IAR | 2 | A | 1 | |||
| Repetitive Avalanche Energy | EAR | 4 | 1 | ||||
| Maximum Power Dissipation | PD | 60 | W | TC = 25 °C | 1 | ||
| Peak Diode Recovery dV/dt | dV/dt | 2.8 | V/ns | 1 | |||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Soldering Recommendations (Peak Temperature) | 300 | for 10 s | 1 | ||||
| Mounting Torque | 10 | lbf · in | 6-32 or M3 screw | 1 | |||
| Maximum Junction-to-Ambient Thermal Resistance | RthJA | -65 | °C/W | 2 | |||
| Maximum Junction-to-Case (Drain) Thermal Resistance | RthJC | -2.1 | °C/W | 2 | |||
| Drain-Source Breakdown Voltage | VDS | 650 | V | VGS = 0 V, ID = 250 µA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | 2 | 4 | V | VDS = VGS, ID = 250 µA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VGS = ± 30 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 25 | µA | VDS = 650 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current at elevated temperature | IDSS | 250 | µA | VDS = 520 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| Forward Transconductance | gfs | 3.9 | S | VDS = 50 V, ID = 3.1 A | 2 | ||
| Total Gate Charge | Qg | 15 | nC | ID = 3.2 A, VDS = 400 V, VGS = 10 V, see fig. 6 and 13b | 2 | ||
| Gate-Drain Charge | Qgd | 6 | nC | ID = 3.2 A, VDS = 400 V, VGS = 10 V, see fig. 6 and 13b | 2 | ||
| Continuous Source-Drain Diode Current | IS | 4 | A | 2 | |||
| Pulsed Diode Forward Current | ISM | 21 | A | 2 | |||
| Body Diode Voltage | VSD | 1.5 | V | TJ = 25 °C, IS = 3.2 A, VGS = 0 V | 2 | ||
| Body Diode Reverse Recovery Time | trr | 493 | 739 | ns | TJ = 25 °C, IF = 3.2 A, dI/dt = 100 A/µs | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 2.1 | 3.2 | µC | 2 | ||
| Gate-Source Charge | Qgs | 3 | nC | ID = 3.2 A, VDS = 400 V, VGS = 10 V, see fig. 6 and 13b | 2 | ||
| VDS Temperature Coefficient | ΔVDS/TJ | 670 | mV/°C | Reference to 25 °C, ID = 1 mA | 2 |
CAD (KiCad official)
- Symbol:
2N60 TO252-VB - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
2n60-to252-vb-etched.step/2n60-to252-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);2n60-to252-vb.step/2n60-to252-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (9 pp, sha256
a743b07d96880ba7, retrieved 2026-11-02, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# 2N60 TO252-VB
**VBsemi Elec** · MOSFETs · TO-252
2N60 TO252-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET, with gate-source voltage rated at ±30 V (VGS). |
| 2 | D | passive | Drain of the N-channel MOSFET, rated at 650 V drain-source voltage (VDS) with 1.6 A continuous drain current at TC = 100 °C. |
| 3 | S | passive | Source of the N-channel MOSFET, with continuous source-drain diode current IS of 4 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 650 | V | | 1 |
| Gate-Source Voltage | VGS | -30 | | 30 | V | | 1 |
| Continuous Drain Current | ID | | | 1.6 | A | TC = 100 °C | 1 |
| Pulsed Drain Current | IDM | | | 8 | A | | 1 |
| Single Pulse Avalanche Energy | EAS | | | 165 | mJ | | 1 |
| Repetitive Avalanche Current | IAR | | | 2 | A | | 1 |
| Repetitive Avalanche Energy | EAR | | | 4 | | | 1 |
| Maximum Power Dissipation | PD | | | 60 | W | TC = 25 °C | 1 |
| Peak Diode Recovery dV/dt | dV/dt | | | 2.8 | V/ns | | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Soldering Recommendations (Peak Temperature) | | | | 300 | | for 10 s | 1 |
| Mounting Torque | | | | 10 | lbf · in | 6-32 or M3 screw | 1 |
| Maximum Junction-to-Ambient Thermal Resistance | RthJA | | | -65 | °C/W | | 2 |
| Maximum Junction-to-Case (Drain) Thermal Resistance | RthJC | | | -2.1 | °C/W | | 2 |
| Drain-Source Breakdown Voltage | VDS | 650 | | | V | VGS = 0 V, ID = 250 µA | 2 |
| Gate-Source Threshold Voltage | VGS(th) | 2 | | 4 | V | VDS = VGS, ID = 250 µA | 2 |
| Gate-Source Leakage | IGSS | -100 | | 100 | nA | VGS = ± 30 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 25 | µA | VDS = 650 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current at elevated temperature | IDSS | | | 250 | µA | VDS = 520 V, VGS = 0 V, TJ = 125 °C | 2 |
| Forward Transconductance | gfs | 3.9 | | | S | VDS = 50 V, ID = 3.1 A | 2 |
| Total Gate Charge | Qg | | | 15 | nC | ID = 3.2 A, VDS = 400 V, VGS = 10 V, see fig. 6 and 13b | 2 |
| Gate-Drain Charge | Qgd | | | 6 | nC | ID = 3.2 A, VDS = 400 V, VGS = 10 V, see fig. 6 and 13b | 2 |
| Continuous Source-Drain Diode Current | IS | | | 4 | A | | 2 |
| Pulsed Diode Forward Current | ISM | | | 21 | A | | 2 |
| Body Diode Voltage | VSD | | | 1.5 | V | TJ = 25 °C, IS = 3.2 A, VGS = 0 V | 2 |
| Body Diode Reverse Recovery Time | trr | | 493 | 739 | ns | TJ = 25 °C, IF = 3.2 A, dI/dt = 100 A/µs | 2 |
| Body Diode Reverse Recovery Charge | Qrr | | 2.1 | 3.2 | µC | | 2 |
| Gate-Source Charge | Qgs | | 3 | | nC | ID = 3.2 A, VDS = 400 V, VGS = 10 V, see fig. 6 and 13b | 2 |
| VDS Temperature Coefficient | ΔVDS/TJ | | 670 | | mV/°C | Reference to 25 °C, ID = 1 mA | 2 |
## CAD (KiCad official)
- Symbol: `2N60 TO252-VB`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `2n60-to252-vb-etched.step` / `2n60-to252-vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `2n60-to252-vb.step` / `2n60-to252-vb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](docs/2n60-to252-vb-datasheet.pdf) (9 pp, sha256 `a743b07d96880ba7`, retrieved 2026-11-02, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/2n60-to252-vb-datasheet.pdf)