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Contents

README

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2EDN8534FXTMA1

Infineon Technologies · Gate Drivers · SOIC-8

2EDN8534FXTMA1 from Infineon Technologies, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ENA input Enable input for channel A: if ENA is high or left open, OUTA is controlled by INA, and if ENA is low, OUTA is forced low.
2 INA input Logic input signal for channel A that controls OUTA.
3 GND power_in Gate driver reference ground.
4 INB input Logic input signal for channel B that controls OUTB.
5 OUTB output Low-impedance driver output for channel B with source and sink capability.
6 VDD power_in Positive supply voltage with an operating range of 4.5 V/8.6 V to 20 V.
7 OUTA output Low-impedance driver output for channel A with source and sink capability.
8 ENB input Enable input for channel B: if ENB is high or left open, OUTB is controlled by INB, and if ENB is low, OUTB is forced low.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Positive supply voltage VDD -0.3 22 V 13
Voltage at pins INA, INB, ENA, ENB VIN -12 22 V 13
Voltage at pins OUTA, OUTB VOUT -0.3 V Printed max VDD+ 0.3 V; voltage spikes from reverse current peaks allowed (note 1) 13
Voltage at pins OUTA, OUTB (repetitive pulse) VOUT -2 V Repetitive pulse < 200 ns; printed max VDD+2 V (note 2) 13
Reverse current peak at pins OUTA, OUTB ISNKREV, ISRCREV -5 5 A Apk < 500 ns 13
Junction temperature TJ -40 150 °C 13
Storage temperature TS -55 150 °C 13
ESD capability VESD 0.5 kV Charged Device Model (CDM), JESD22-002 13
ESD capability VESD 2 kV Human Body Model (HBM), JESD22-A114-B 13
Supply voltage VDD 4.5 20 V Min. defined by UVLO 15
Logic input voltage VIN -10 20 V 15
Junction temperature (operating) TJ -40 150 °C Continuous operation above 125°C may reduce life time (note 1) 15
VDD quiescent current, OUT = high IVDDQU1 0.5 0.9 1.2 mA OUT = high, VDD = 12 V 15
VDD quiescent current, OUT = low IVDDQU2 0.3 0.5 0.7 mA OUT = low, VDD = 12 V 15
Undervoltage lockout turn on threshold (8 V version) UVLOON 8 8.6 V 15
Undervoltage lockout turn off threshold (8 V version) UVLOOFF 6.5 7 V 15
UVLO threshold hysteresis (8 V version) UVLOHYS 0.8 1 1.2 V 15
Input voltage threshold for transition LH VINH 1.9 2.1 2.3 V 16
Input voltage threshold for transition HL VINL 1 1.2 1.4 V 16
High level (sourcing) output resistance (2EDN853x) RONSRC 0.4 0.8 1.4 Ω ISRC = 50 mA 16
Low level (sinking) output resistance (2EDN853x) RONSNK 0.35 0.6 1.2 Ω ISNK = 50 mA 16
Input/Enable to output propagation delay, low to high tPDlh 15 19 25 ns CLOAD= 1.8 nF, VDD= 12 V; low to high transition at Input/Enable 17
Input/Enable to output propagation delay, high to low tPDhl 15 19 25 ns CLOAD= 1.8 nF, VDD= 12 V; high to low transition at Input/Enable 17
Input/Enable to output propagation delay mismatch between the two channels on the same IC ΔtPD 2 ns 17
Rise time tRISE 8.6 15 ns CLOAD = 1.8 nF, VDD = 12 V 17
Fall time tFALL 6 13 ns CLOAD = 1.8 nF, VDD = 12 V 17
Minimum input pulse width that changes output state tPW 6 10 ns CLOAD = 1.8 nF, VDD = 12 V 17
Thermal resistance junction-ambient (PG-DSO-8) RthJA25 111 K/W PG-DSO-8, Tamb = 25°C 13
Thermal resistance junction-case (top) (PG-DSO-8) RthJC25 66 K/W PG-DSO-8, Tamb = 25°C 13
Thermal resistance junction-board (PG-DSO-8) RthJB25 59 K/W PG-DSO-8, Tamb = 25°C 13
Characterization parameter junction-top (PG-DSO-8) ΨthJC25 12 K/W PG-DSO-8, Tamb = 25°C 13
Characterization parameter junction-board (PG-DSO-8) ΨthJB25 57 K/W PG-DSO-8, Tamb = 25°C 13

CAD (KiCad official)

  • Symbol: 2EDN8534FXTMA1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: 2edn8534fxtma1-etched.step / 2edn8534fxtma1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 2edn8534fxtma1.step / 2edn8534fxtma1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (36 pp, sha256 5adb1dc38d25805d, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF