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2DB1713-13

Public Made by Adom

by adom

Diodes Incorporated Bipolar (BJT), SOT-89. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componenttransistors-thyristors2db1713-13factory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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2DB1713-13

Diodes Incorporated · Bipolar (BJT) · SOT-89

2DB1713-13 from Diodes Incorporated, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B input Base of the PNP transistor; VEBO max -6V, and IB = -30mA is the test condition for VCE(sat) < -250mV at IC = -1.5A.
2 C passive Collector (also the exposed tab, drawn as C on the pin-out); IC = -3A continuous, -6A peak, VCEO -12V, VCBO -15V.
3 E passive Emitter of the PNP transistor; VEBO max -6V relative to the base.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-89
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-Base Breakdown Voltage BVCBO -15 V IC = -10µA 3
Collector-Emitter Breakdown Voltage BVCEO -12 V IC = -1mA 3
Emitter-Base Breakdown Voltage BVEBO -6 V IE = -10µA 3
Collector Cut-Off Current ICBO -0.1 µA VCB = -15V 3
Emitter Cut-Off Current IEBO -0.1 µA VEB = -6V 3
Collector-Emitter Saturation Voltage VCE(sat) -120 -250 mV IC = -1.5A, IB = -30mA 3
DC Current Gain hFE 270 680 VCE = -2V, IC = -500mA 3
Collector-Base Voltage VCBO -15 V 2
Collector-Emitter Voltage VCEO -12 V 2
Emitter-Base Voltage VEBO -6 V 2
Continuous Collector Current IC -3 A 2
Peak Pulse Current ICM -6 A 2
Power Dissipation PD 0.9 W Note 5: FR-4 PCB with minimum recommended pad layout 2
Thermal Resistance, Junction to Ambient Air RJA 139 °C/W Note 5: FR-4 PCB with minimum recommended pad layout 2
Power Dissipation PD 2 W Note 6: FR-4 PCB with 1 inch² copper pad layout 2
Thermal Resistance, Junction to Ambient Air RJA 62.5 °C/W Note 6: FR-4 PCB with 1 inch² copper pad layout 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Finish, Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: 2DB1713-13
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: 2db1713-13-etched.step / 2db1713-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 2db1713-13.step / 2db1713-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 a19a31761f1a2c15, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF