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2DA1797Q-13

Diodes Incorporated · Bipolar (BJT) · SOT-89

2DA1797Q-13 from Diodes Incorporated, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B input Base of the PNP transistor; the pin-out drawing shows it as the pin opposite the emitter, on the same side as the collector pin.
2 C passive Collector, rated VCEO -50 V, continuous IC -3 A and peak ICM -6 A; it is also connected to the exposed collector tab.
3 E passive Emitter of the PNP transistor, with a maximum emitter-base voltage VEBO of -6 V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-89
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-Base Breakdown Voltage BVCBO -50 V IC = -50μA, IE = 0 4
Collector-Emitter Breakdown Voltage BVCEO -50 V IC = -1mA, IB = 0 4
Emitter-Base Breakdown Voltage BVEBO -6 V IE = -50μA, IC = 0 4
Collector Cut-Off Current ICBO -0.1 μA VCB = -50V, IE = 0 4
Emitter Cut-Off Current IEBO -0.1 μA VEB = -5V, IC = 0 4
Collector-Emitter Saturation Voltage VCE(sat) -100 -350 mV IC = -1A, IB = -50mA 4
DC Current Gain hFE 82 270 VCE = -2V, IC = -500mA 4
Collector-Base Voltage VCBO -50 V 2
Collector-Emitter Voltage VCEO -50 V 2
Emitter-Base Voltage VEBO -6 V 2
Peak Pulse Current ICM -6 A 2
Continuous Collector Current IC -3 A 2
Power Dissipation PD 0.9 W Device mounted on FR-4 PCB with minimum recommended pad layout (Note 6) 2
Thermal Resistance, Junction to Ambient Air RJA 139 °C/W Device mounted on FR-4 PCB with minimum recommended pad layout (Note 6) 2
Power Dissipation PD 2 W Device mounted on FR-4 PCB with 1 inch2 copper pad layout (Note 7) 2
Thermal Resistance, Junction to Ambient Air RJA 62.5 °C/W Device mounted on FR-4 PCB with 1 inch2 copper pad layout (Note 7) 2
Thermal Resistance, Junction to Lead RJL 5.3 °C/W Junction to solder-point, on the exposed collector pad (Note 8) 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Electrostatic Discharge - Human Body Model ESD HBM 4000 V JEDEC Class 3A 2
Electrostatic Discharge - Machine Model ESD MM 400 V JEDEC Class C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Finish, Matte Tin. Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: 2DA1797Q-13
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: 2da1797q-13-etched.step / 2da1797q-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 2da1797q-13.step / 2da1797q-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 bbcb6b6c36dd1b31, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF