25C160-I from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	CS	input	Chip select input: a low level selects the device, and a high level deselects it and forces it into Standby mode, though a programming cycle already in progress completes regardless of CS.
2	SO	tri_state	Serial data output: data shifts out after the falling edge of SCK during a read, and SO goes to the high-impedance state when the device is deselected.
3	WP	input	Write-protect input: together with the WPEN Status register bit, a low level on WP disables writes to the nonvolatile Status register bits, and the WP function is blocked when WPEN is low.
4	VSS	power_in	Ground reference for the device.
5	SI	input	Serial data input: receives instructions, addresses and data, which are latched on the rising edge of the serial clock.
6	SCK	input	Serial clock input: SI is latched on the rising edge of SCK and SO is updated after the falling edge of SCK.
7	HOLD	input	Hold input: must be held high when not in use; pulling it low while SCK is low pauses serial communication and tri-states SO, and it must be returned high while SCK is low to resume.
8	VCC	power_in	Supply voltage: the 25C160 is specified for 4.5V to 5.5V operation.

Key specifications

Parameter	Value
Manufacturer	Microchip Tech
Package	SOIC-8
Category	Embedded Processors & Controllers
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Max	Unit	Conditions	Page
High-level input voltage	VIH1	2		V	VCC ≥ 2.7V (Note)	2
Low-level input voltage	VIL1	-0.3	0.8	V	VCC ≥ 2.7V (Note)	2
Low-level output voltage	VOL		0.4	V	IOL = 2.1 mA	2
Input leakage current	ILI	-10	10	µA	CS = VCC, VIN = VSS TO VCC	2
Output leakage current	ILO	-10	10	µA	CS = VCC, VOUT = VSS TO VCC	2
Internal capacitance (all inputs and outputs)	CINT		7	pF	TA = 25°C, CLK = 1.0 MHz, VCC = 5.0V (Note)	2
Read operating current	ICC		1	mA	VCC = 5.5V; FCLK = 3.0 MHz; SO = Open	2
Write operating current	ICC		5	mA	VCC = 5.5V	2
Standby current	ICCS		5	µA	CS = VCC = 5.5V, Inputs tied to VCC or VSS	2
Clock frequency	FCLK		3	MHz	VCC = 4.5V to 5.5V	3
CS setup time	TCSS	100		ns	VCC = 4.5V to 5.5V	3
CS hold time	TCSH	150		ns	VCC = 4.5V to 5.5V	3
CS disable time	TCSD	500		ns		3
Data setup time	TSU	30		ns	VCC = 4.5V to 5.5V	3
Data hold time	THD	50		ns	VCC = 4.5V to 5.5V	3
CLK rise time	TR		2	µs	(Note 1)	3
CLK fall time	TF		2	µs	(Note 1)	3
Clock high time	THI	150		ns	VCC = 4.5V to 5.5V	3
Clock low time	TLO	150		ns	VCC = 4.5V to 5.5V	3
Clock delay time	TCLD	50		ns		3
Clock enable time	TCLE	50		ns		3
Output valid from clock low	TV		150	ns	VCC = 4.5V to 5.5V	3
Output hold time	THO	0		ns	(Note 1)	3
Output disable time	TDIS		200	ns	VCC = 4.5V to 5.5V (Note 1)	3
HOLD setup time	THS	100		ns	VCC = 4.5V to 5.5V	3
HOLD hold time	THH	100		ns	VCC = 4.5V to 5.5V	3
HOLD low to output high-Z	THZ	100		ns	VCC = 4.5V to 5.5V (Note 1)	3
HOLD high to output valid	THV	100		ns	VCC = 4.5V to 5.5V	3
Internal write cycle time	TWC		5	ms		3
Endurance		1		M E/W Cycles	(Note 2)	3
VCC supply voltage	VCC		7	V		2
All inputs and outputs w.r.t. VSS		-0.6		V		2
Storage temperature		-65	150	°C		2
Ambient temperature under bias		-40	125	°C		2
Soldering temperature of leads			300	°C	10 seconds	2
ESD protection on all pins		4		KV		2
Supply voltage (25C160)	VCC	4.5	5.5	V	25C160 (Device Selection Table)	1
Operating ambient temperature, Industrial (I)	TA	-40	85	°C	Industrial (I) grade	1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	8-Lead Plastic Small Outline (SN), Narrow, 150 mil (SOIC) Foot Angle  048048	14

CAD (KiCad official)

Symbol: 25C160-I
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: 25c160-i-etched.step / 25c160-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 25c160-i.step / 25c160-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Microchip Tech datasheet (22 pp, sha256 c254c908c32920bb, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

25C160-I

Verified 25C160-I

Verification log 1 record

3D Model

Symbol & Footprint

Schematic Symbol

PCB Footprint

Datasheet

README