component

24LC32AF-E

Public Made by Adom

by adom

Microchip Tech EEPROM, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentmemory24lc32af-efactory-2.0.0extractor-text

Verified 24LC32AF-E

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 8 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: 24LC32AF-E · SOIC-8 · 8 pins
  • ✓copper: 8 copper pads, none touching another net
  • ✓datasheet: all 8 pin names found in the 30-page datasheet
  • •distributor (warn): no ['digikey', 'mouser'] number
  • ✓family: SOIC-8_3.9x4.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-zglyk35e/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 8 pins = 8 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 8 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ 24lc32af-e.kicad_sym✓ 24lc32af-e.kicad_mod✓ 24lc32af-e.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 1h ago
viewers 24lc32af-e: viewers · Ray 1h ago
24lc32af-e-etched.glb Publish 0.1.0 · Ray 1h ago
24lc32af-e-etched.step 24lc32af-e: factory component page (tier=mfr) · Ray 1h ago
24lc32af-e-hero.glb 24lc32af-e: hero GLB from the etched model (keeps the MPN mark) · Ray 1h ago
24lc32af-e-hero.overlay.json Publish 0.1.0 · Ray 1h ago
24lc32af-e.glb Publish 0.1.0 · Ray 1h ago
24lc32af-e.kicad_mod Publish 0.1.0 · Ray 1h ago
24lc32af-e.kicad_sym Publish 0.1.0 · Ray 1h ago
24lc32af-e.lbr Publish 0.1.0 · Ray 1h ago
24lc32af-e.step Publish 0.1.0 · Ray 1h ago
package.json Publish 0.1.0 · Ray 1h ago
page.json Set visibility: public · Ray 1h ago
README.md Publish 0.1.0 · Ray 1h ago
verification.json Verified: Published by the parts factory: tier mfr, 8 pins · Ray 1h ago

24LC32AF-E

Microchip Tech · EEPROM · SOIC-8

24LC32AF-E from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Chip address input that must be tied to VCC or VSS; its level is compared with the slave address bits to select the device, allowing up to eight devices on one bus.
2 A1 input Chip address input that must be tied to VCC or VSS; its level is compared with the slave address bits to select the device, allowing up to eight devices on one bus.
3 A2 input Chip address input that must be tied to VCC or VSS; its level is compared with the slave address bits to select the device, allowing up to eight devices on one bus.
4 VSS power_in Ground reference for the device.
5 SDA bidirectional Open-drain serial address/data I/O requiring a pull-up resistor to VCC (typically 10 kΩ for 100 kHz, 2 kΩ for 400 kHz), with data allowed to change only while SCL is low.
6 SCL input Serial clock input used to synchronize data transfer to and from the device.
7 WP input Write-protect input that must be tied to VSS to enable writes or to VCC to inhibit writes to the upper 1/4 of the array (C00h-FFFh), with read operations unaffected.
8 VCC power_in Power supply, +1.7V to 5.5V as stated in the pin function table.

Key specifications

Parameter Value
Manufacturer Microchip Tech
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
All inputs and outputs w.r.t. VSS -0.3 V Upper limit printed as VCC + 1.0V 2
Storage temperature -65 150 °C 2
Ambient temperature with power applied -40 125 °C 2
ESD protection on all pins 4 kV 2
Supply voltage VCC, Automotive (E) operating range VCC 2.5 5.5 V Automotive (E): TA = -40°C to +125°C 2
Ambient temperature range, Automotive (E) TA -40 125 °C Automotive (E) 2
High-level input voltage (A0, A1, A2, WP, SCL, SDA) VIH 0.7 VCC 2
Low-level input voltage (A0, A1, A2, WP, SCL, SDA) VIL 0.3 VCC VCC ≥ 2.5V 2
Hysteresis of Schmitt trigger inputs (SDA, SCL) VHYS 0.05 VCC VCC ≥ 2.5V 2
Low-level output voltage VOL 0.4 V IOL = 3.0 mA, VCC = 4.5V 2
Input leakage current ILI -1 1 μA VIN = VSS or VCC 2
Output leakage current ILO -1 1 μA VOUT = VSS or VCC 2
Pin capacitance (all inputs/outputs) CIN, COUT 10 pF VCC = 5.0V; TA = 25°C, FCLK = 1 MHz 2
Operating current, write ICC write 0.1 3 mA VCC = 5.5V, SCL = 400 kHz 2
Operating current, read ICC read 0.05 400 μA 2
Standby current, Automotive (E) ICCS 5 μA Automotive; SDA = SCL = VCC = 5.5V; A0, A1, A2, WP = VSS 2
Clock frequency FCLK 400 kHz 2.5V ≤ VCC ≤ 5.5V 3
Clock high time THIGH 600 ns 2.5V ≤ VCC ≤ 5.5V 3
Clock low time TLOW 1300 ns 2.5V ≤ VCC ≤ 5.5V 3
SDA and SCL rise time TR 300 ns 2.5V ≤ VCC ≤ 5.5V 3
SDA and SCL fall time TF 300 ns 3
Start condition hold time THD:STA 600 ns 2.5V ≤ VCC ≤ 5.5V 3
Start condition setup time TSU:STA 600 ns 2.5V ≤ VCC ≤ 5.5V 3
Data input hold time THD:DAT 0 ns 3
Data input setup time TSU:DAT 100 ns 2.5V ≤ VCC ≤ 5.5V 3
Stop condition setup time TSU:STO 600 ns 2.5V ≤ VCC ≤ 5.5V 3
WP setup time TSU:WP 600 ns 2.5V ≤ VCC ≤ 5.5V 3
WP hold time THD:WP 1300 ns 2.5V ≤ VCC ≤ 5.5V 3
Output valid from clock TAA 900 ns 2.5V ≤ VCC ≤ 5.5V 3
Bus free time TBUF 1300 ns 2.5V ≤ VCC ≤ 5.5V 3
Output fall time from VIH minimum to VIL maximum TOF 250 ns CB ≤ 100 pF 3
Input filter spike suppression (SDA and SCL pins) TSP 50 ns 3
Write cycle time (byte or page) TWC 5 ms 3
Endurance 1e+06 cycles 25°C 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Package: P = Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (3.90 mm body), 8-lead 27

CAD (KiCad official)

  • Symbol: 24LC32AF-E
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: 24lc32af-e-etched.step / 24lc32af-e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 24lc32af-e.step / 24lc32af-e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Microchip Tech datasheet (30 pp, sha256 cba543bb7f4aa50c, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF