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24FC64F-I

Microchip Tech · EEPROM · SOIC-8

24FC64F-I from Microchip Tech, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	A0	input	Chip address input compared with the slave address bit; must be tied to VCC or VSS to select among up to eight devices on the bus.
2	A1	input	Chip address input compared with the slave address bit; must be tied to VCC or VSS to select among up to eight devices on the bus.
3	A2	input	Chip address input compared with the slave address bit; must be tied to VCC or VSS to select among up to eight devices on the bus.
4	VSS	power_in	Ground.
5	SDA	bidirectional	Serial data I/O for addresses and data, open-drain so it requires a pull-up resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz).
6	SCL	input	Serial clock input that synchronizes data transfer to and from the device.
7	WP	input	Write-protect input that must be tied to VSS or VCC; at VSS writes are enabled, at VCC writes to the upper 1/4 of the array (1800h-1FFFh) are inhibited while reads are unaffected.
8	VCC	power_in	Power supply, +1.7V to 5.5V.

Key specifications

Parameter	Value
Manufacturer	Microchip Tech
Package	SOIC-8
Category	Memory
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply voltage range	VCC	1.7		5.5	V	Industrial (I)	1
Operating temperature (Industrial)	TA	-40		85	°C	Industrial (I)	2
Storage temperature		-65		150	°C		2
Ambient temperature with power applied		-40		125	°C		2
High-level input voltage	VIH	0.7			V	x VCC	2
Low-level input voltage	VIL			0.3	V	VCC ≥ 2.5V, x VCC	2
Low-level input voltage	VIL			0.2	V	VCC < 2.5V, x VCC	2
Hysteresis of Schmitt Trigger inputs	VHYS	0.05			V	VCC ≥ 2.5V (Note 1), x VCC	2
Low-level output voltage	VOL			0.4	V	IOL = 3.0 mA @ VCC = 4.5V; IOL = 2.1 mA @ VCC = 2.5V	2
Input leakage current	ILI	-1		1	µA	VIN = VSS or VCC	2
Output leakage current	ILO	-1		1	µA	VOUT = VSS or VCC	2
Pin capacitance	CIN, COUT			10	pF	VCC = 5.0V (Note 1), TA = 25°C, FCLK = 1 MHz	2
Operating current write	ICC write		0.1	3	mA	VCC = 5.5V, SCL = 400 kHz	2
Operating current read	ICC read		0.05	400	µA		2
Standby current	ICCS		0.01	1	µA	Industrial; SDA = SCL = VCC; A0, A1, A2, WP = VSS	2
Clock frequency	FCLK			400	kHz	1.7V ≤ VCC < 2.5V 24FC64F	3
Clock frequency	FCLK			1000	kHz	2.5V ≤ VCC ≤ 5.5V 24FC64F	3
Clock high time	THIGH	600			ns	1.7V ≤ VCC < 2.5V 24FC64F	3
Clock high time	THIGH	500			ns	2.5V ≤ VCC ≤ 5.5V 24FC64F	3
Clock low time	TLOW	1300			ns	1.7V ≤ VCC < 2.5V 24FC64F	3
Clock low time	TLOW	500			ns	2.5V ≤ VCC ≤ 5.5V 24FC64F	3
SDA and SCL rise time	TR			300	ns	1.7V ≤ VCC ≤ 5.5V 24FC64F (Note 1)	3
SDA and SCL fall time	TF			100	ns	1.7V ≤ VCC ≤ 5.5V 24FC64F (Note 1)	3
Start condition hold time	THD:STA	600			ns	1.7V ≤ VCC < 2.5V 24FC64F	3
Start condition hold time	THD:STA	250			ns	2.5V ≤ VCC ≤ 5.5V 24FC64F	3
Start condition setup time	TSU:STA	600			ns	1.7V ≤ VCC < 2.5V 24FC64F	3
Start condition setup time	TSU:STA	250			ns	2.5V ≤ VCC ≤ 5.5V 24FC64F	3
Data input hold time	THD:DAT	0			ns	(Note 2)	3
Data input setup time	TSU:DAT	100			ns	1.7V ≤ VCC ≤ 5.5V 24FC64F	3
Stop condition setup time	TSU:STO	600			ns	1.7V ≤ VCC < 2.5V 24FC64F	3
Stop condition setup time	TSU:STO	250			ns	2.5V ≤ VCC ≤ 5.5V 24FC64F	3
WP setup time	TSU:WP	600			ns	1.7V ≤ VCC ≤ 5.5V 24FC64F	3
WP hold time	THD:WP	1300			ns	1.7V ≤ VCC ≤ 5.5V 24FC64F	3
Output valid from clock	TAA			900	ns	1.7V ≤ VCC < 2.5V 24FC64F (Note 2)	4
Output valid from clock	TAA			400	ns	2.5V ≤ VCC ≤ 5.5V 24FC64F (Note 2)	4
Bus free time	TBUF	1300			ns	1.7V ≤ VCC < 2.5V 24FC64F	4
Bus free time	TBUF	500			ns	2.5V ≤ VCC ≤ 5.5V 24FC64F	4
Output fall time from VIH min to VIL max	TOF			250	ns	24FC64F (Note 1), CB ≤ 100 pF	4
Write cycle time (byte or page)	TWC			5	ms		4
Endurance		1e+06			cycles	Page Mode 25°C, 5.5V (Note 4)	4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts		tin	Package: P = Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (3.90 mm body), 8-lead	33

CAD (KiCad official)

Symbol: 24FC64F-I
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: 24fc64f-i-etched.step / 24fc64f-i-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 24fc64f-i.step / 24fc64f-i.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Microchip Tech datasheet (36 pp, sha256 0e8acceabe2a8fb7, retrieved 2026-10-27, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF