# 23LC1024T-I

**Microchip Tech** · SRAM · TSSOP-8

23LC1024T-I from Microchip Tech, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | A low level on this Chip Select input selects the device, and a high level deselects it and forces it into Standby mode. |
| 2 | SO/SIO1 | bidirectional | Serial output in SPI mode, and a bidirectional Serial I/O 1 in SDI and SQI modes, with data shifted out after the falling SCK edge and latched on the rising edge. |
| 3 | SIO2 | bidirectional | Bidirectional Serial I/O 2 used only in SQI mode, which should not be left floating when SQI is not used. |
| 4 | VSS | power_in | Ground reference pin for the device. |
| 5 | SI/SIO0 | bidirectional | Serial input in SPI mode, and a bidirectional Serial I/O 0 in SDI and SQI modes, with data latched on the rising SCK edge. |
| 6 | SCK | input | Serial clock input that synchronizes communication, rated at 20 MHz for all modes (16 MHz for E-temp). |
| 7 | HOLD/SIO3 | bidirectional | In SPI and SDI modes this HOLD input suspends serial communication when pulled low (it must be held high when unused), and it is a bidirectional Serial I/O 3 in SQI mode where HOLD is unavailable. |
| 8 | VCC | power_in | Power supply pin; the 23LC1024 operates from 2.5 V to 5.5 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | TSSOP-8 |
| Category | Memory |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage Temperature | TSTG | -65 |  | 150 | °C |  | 2 |
| Ambient Temperature under Bias | TA | -40 |  | 125 | °C |  | 2 |
| All Inputs and Outputs w.r.t. VSS |  | -0.3 |  |  | V | max printed as VCC + 0.3V | 2 |
| VCC Supply Voltage | VCC | 2.5 |  | 5.5 | V | 23LC1024 | 2 |
| Operating Ambient Temperature, Industrial (I) | TA | -40 |  | 85 | °C | Industrial (I) | 2 |
| Low-level Input Voltage | VIL |  |  | 0.1 | VCC | 23LC1024 | 2 |
| High-level Input Voltage | VIH | 0.7 |  |  | VCC |  | 2 |
| Low-level Output Voltage | VOL |  |  | 0.2 | V | IOL = 1 mA | 2 |
| High-level Output Voltage | VOH | -0.5 |  |  | V | IOH = -400 A; printed as VCC - 0.5 | 2 |
| Input Leakage Current | ILI | -1 |  | 1 | µA | CS = VCC, VIN = VSS or VCC | 2 |
| Output Leakage Current | ILO | -1 |  | 1 | µA | CS = VCC, VOUT = VSS or VCC | 2 |
| Read Operating Current | ICC |  | 3 | 10 | mA | FCLK = 20 MHz; SO = O, 5.5V | 2 |
| Standby Current | ICCS |  | 4 | 10 | µA | CS = VCC = 5.5V, Inputs tied to VCC or VSS, I-Temp | 2 |
| Input Capacitance | CINT |  |  | 7 | pF | VCC = 5.0V, f = 1 MHz, TA = 25°C | 2 |
| Clock Frequency | FCLK |  |  | 20 | MHz | I-Temp | 3 |
| CS Setup Time | TCSS | 25 |  |  | ns | I-Temp | 3 |
| CS Hold Time | TCSH | 50 |  |  | ns |  | 3 |
| CS Disable Time | TCSD | 25 |  |  | ns | I-Temp | 3 |
| Data Setup Time | TSU | 10 |  |  | ns |  | 3 |
| Data Hold Time | THD | 10 |  |  | ns |  | 3 |
| CLK Rise Time | TR |  |  | 20 | ns |  | 3 |
| CLK Fall Time | TF |  |  | 20 | ns |  | 3 |
| Clock High Time | THI | 25 |  |  | ns | I-Temp | 3 |
| Clock Low Time | TLO | 25 |  |  | ns | I-Temp | 3 |
| Clock Delay Time | TCLD | 25 |  |  | ns | I-Temp | 3 |
| Output Valid from Clock Low | TV |  |  | 25 | ns | I-Temp | 3 |
| Output Hold Time | THO | 0 |  |  | ns |  | 3 |
| Output Disable Time | TDIS |  |  | 20 | ns |  | 3 |
| HOLD Setup Time | THS | 10 |  |  | ns |  | 3 |
| HOLD Hold Time | THH | 10 |  |  | ns |  | 3 |
| HOLD Low to Output High-Z | THZ | 10 |  |  | ns |  | 3 |
| HOLD High to Output Valid | THV |  |  | 50 | ns |  | 3 |
| RAM Data Retention Voltage | VDR |  | 1 |  | V |  | 2 |

## CAD (KiCad official)

- Symbol: `23LC1024T-I`
- Footprint: `Package_SO:TSSOP-8_3x3mm_P0.65mm`
- 3D model: TSSOP-8 (KiCad packages3D, STEP)
- 3D model files: `23lc1024t-i-etched.step` / `23lc1024t-i-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `23lc1024t-i.step` / `23lc1024t-i.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Microchip Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588931634687053824) (32 pp, sha256 `a43100c9e97fbdba`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/23lc1024t-i-datasheet.pdf)