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1SMB5935BT3G

onsemi · Zener Diodes · SMB

1SMB5935BT3G from onsemi, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode, indicated by the polarity band; the Zener operates with this pin positive relative to the anode (VZ 25.65 V min, 27 V nom, 28.35 V max @ IZT = 13.9 mA for the 1SMB5935B).
2 Anode passive Anode of the Zener diode; forward voltage VF is 1.5 V max @ IF = 200 mA(dc).

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 25.65 27 28.35 V @ IZT = 13.9 mA, TL = 30C 3
Zener Test Current IZT 13.9 mA 3
Maximum Zener Impedance ZZT 23 Ω @ IZT 3
Maximum Zener Impedance ZZK 700 Ω @ IZK = 0.25 mA 3
Reverse Leakage Current IR 1 µA @ VR = 20.6 V 3
Maximum DC Zener Current IZM 55 mA 3
Forward Voltage VF 1.5 V IF = 200 mA(dc) 3
Zener Voltage Tolerance -5 5 % Type numbers listed indicate a tolerance of 5% 3
Maximum Steady State Power Dissipation PD 3 W @ TL = 75C, measured at zero lead length 1
Power Derating above 75C 40 mW/C Derate above 75C 1
Maximum Steady State Power Dissipation PD 550 mW @ TA = 25C, FR-4 board, recommended footprint 1
Power Derating above 25C 4.4 mW/C Derate above 25C 1
Operating and Storage Temperature Range TJ, Tstg -65 150 C 1
Thermal Resistance, Junction-to-Lead RθJL 25 C/W 1
Thermal Resistance, Junction-to-Ambient RθJA 226 C/W FR-4 board, recommended footprint 1
Maximum Lead Temperature for Soldering 260 C 10 seconds 1

CAD (KiCad official)

  • Symbol: 1SMB5935BT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: 1smb5935bt3g-etched.step / 1smb5935bt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1smb5935bt3g.step / 1smb5935bt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 52985d4757f03142, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF