Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

1SMB5930BT3G-MS

MSKSEMI · Zener Diodes · SMB

1SMB5930BT3G-MS from MSKSEMI, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 15.2 16 16.8 V @ IZT, TL = 30°C 4
Zener Test Current IZT 23.4 mA 4
Zener Impedance ZZT 10 Ω @ IZT 4
Zener Impedance at knee ZZK 600 Ω @ IZK = 0.25 mA 4
Reverse Leakage Current IR 1 μA @ VR = 12.2 V 4
Maximum DC Zener Current IZM 93 mA(dc) 4
Forward Voltage VF 1.5 V IF = 200 mA(dc) 3
Steady State Power Dissipation PD 3 W TL = 75°C, zero lead length 2
Steady State Power Dissipation PD 550 mW TA = 25°C, FR-4 board, recommended footprint 2
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 2
Thermal Resistance Junction-to-Lead RθJL 25 °C/W 2
Thermal Resistance Junction-to-Ambient RθJA 226 °C/W FR-4 board, recommended footprint 2
Power Derating above 75°C 40 mW/°C Above TL = 75°C 2
Power Derating above 25°C 4.4 mW/°C Above TA = 25°C 2
Zener Voltage Tolerance -5 5 % Type number indicates ±5% tolerance 4

CAD (KiCad official)

  • Symbol: 1SMB5930BT3G-MS
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: 1smb5930bt3g-ms-etched.step / 1smb5930bt3g-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1smb5930bt3g-ms.step / 1smb5930bt3g-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (8 pp, sha256 d1db003dcf102a3c, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF