component

1SMB5927BT3G-MS

Public Made by Adom

by adom

MSKSEMI Zener Diodes, SMB. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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1SMB5927BT3G-MS

MSKSEMI · Zener Diodes · SMB

1SMB5927BT3G-MS from MSKSEMI, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage (nominal 12 V, ±5% suffix B) VZ 11.4 12 12.6 Volts @ IZT = 31.2 mA, TL = 30°C 4
Forward Voltage VF 1.5 V @ IF = 200 mA(dc) 3
Maximum Zener Impedance ZZT 6.5 Ω @ IZT = 31.2 mA; IZ(ac) = 0.1 IZ(dc), 60 Hz 4
Maximum Zener Impedance ZZK 550 Ω @ IZK = 0.25 mA; IZ(ac) = 0.1 IZ(dc), 60 Hz 4
Maximum DC Zener Current IZM 125 mA(dc) 4
Maximum Steady State Power Dissipation PD 3 W TL = 75°C, measured at zero lead length 2
Maximum Steady State Power Dissipation PD 550 mW TA = 25°C (FR-4 board, recommended footprint, Note 1) 2
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 2
Power Derating Above Lead Temperature 25 mW/°C Derate above TL = 75°C 2
Power Derating Above Ambient Temperature 4.4 mW/°C Derate above TA = 25°C 2
Thermal Resistance, Junction-to-Lead RθJL 40 °C/W Junction-to-lead 2
Thermal Resistance, Junction-to-Ambient RθJA 226 °C/W Junction-to-ambient, FR-4 board, recommended footprint (Note 1) 2

CAD (KiCad official)

  • Symbol: 1SMB5927BT3G-MS
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: 1smb5927bt3g-ms-etched.step / 1smb5927bt3g-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1smb5927bt3g-ms.step / 1smb5927bt3g-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (8 pp, sha256 d1db003dcf102a3c, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF