main
History Download
Ray Publish 0.1.0 26b2903 1d ago

1SMB5923BT3G

onsemi · Zener Diodes · SMB

1SMB5923BT3G from onsemi, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode end of the Zener diode, indicated by the polarity band on the SMB (Case 403A) package; for 1SMB5923BT3G, VZ is 8.2 V nominal (7.79 to 8.61 V) at IZT = 45.7 mA.
2 Anode passive Anode end of the Zener diode (non-polarity-band side) of the SMB (Case 403A) package; maximum forward voltage is 1.5 V at IF = 200 mA.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 7.79 8.2 8.61 V @ IZT = 45.7 mA, TL = 30°C 3
Zener Test Current IZT 45.7 mA 3
Maximum Zener Impedance ZZT 3.5 Ω @ IZT 3
Maximum Zener Impedance at knee ZZK 400 Ω @ IZK = 0.5 mA 3
Reverse Leakage Current IR 5 µA @ VR = 6.5 V 3
Maximum DC Zener Current IZM 182 mA 3
Forward Voltage VF 1.5 V @ IF = 200 mA(dc) 3
Zener Voltage Tolerance -5 5 % type numbers indicate tolerance of ±5% 3
Maximum Steady State Power Dissipation PD 3 W @ TL = 75°C, zero lead length 1
Maximum Steady State Power Dissipation PD 550 mW @ TA = 25°C, FR-4 board, recommended footprint 1
Operating and Storage Temperature Range TJ, Tstg -65 150 °C 1
Thermal Resistance Junction-to-Lead RθJL 25 °C/W 1
Thermal Resistance Junction-to-Ambient RθJA 226 °C/W FR-4 board, recommended footprint 1

CAD (KiCad official)

  • Symbol: 1SMB5923BT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: 1smb5923bt3g-etched.step / 1smb5923bt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1smb5923bt3g.step / 1smb5923bt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 b2ddba7d745c56c9, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF