component

1SMB5917BT3G

Public Made by Adom

by adom

onsemi Zener Diodes, SMB. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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1SMB5917BT3G

onsemi · Zener Diodes · SMB

1SMB5917BT3G from onsemi, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (min) VZ 4.46 V @ IZT = 79.8 mA; TL = 30°C unless otherwise noted 3
Zener voltage (max) VZ 4.94 V @ IZT = 79.8 mA; TL = 30°C unless otherwise noted 3
Zener voltage (nominal) VZ 4.7 V @ IZT = 79.8 mA; TL = 30°C unless otherwise noted 3
Maximum zener impedance ZZT 5 Ω @ IZT = 79.8 mA 3
Maximum zener impedance ZZK 500 Ω @ IZK = 1 mA 3
Maximum DC zener current IZM 319 mA(dc) 3
Forward voltage VF 1.5 V @ IF = 200 mA(dc), for all types 2
Reverse leakage current IR 5 µA @ VR = 1.5 V 3
Zener voltage tolerance (type number designation) -5 5 % type number 1SMB5917BT3G, ±5% per Note 2 3
Steady state power dissipation @ TL PD 3 W TL = 75°C, measured at zero lead length 1
Derate above TL 25 mW/°C above TL = 75°C 1
Steady state power dissipation @ TA PD 550 mW TA = 25°C, FR-4 board, recommended footprint (Note 1) 1
Derate above TA 4.4 mW/°C above TA = 25°C 1
Thermal resistance junction-to-lead RθJL 40 °C/W 1
Thermal resistance junction-to-ambient RθJA 226 °C/W FR-4 board, recommended footprint (Note 1) 1
Operating and storage temperature range TJ, Tstg -65 150 °C 1

CAD (KiCad official)

  • Symbol: 1SMB5917BT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: 1smb5917bt3g-etched.step / 1smb5917bt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1smb5917bt3g.step / 1smb5917bt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 e95f4deeabd8ea97, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF