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1SMB5917BT3G-MS

MSKSEMI · Zener Diodes · SMB

1SMB5917BT3G-MS from MSKSEMI, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener voltage (nominal 4.7 V, ±5%) VZ 4.46 4.7 4.94 V @ IZT = 79.8 mA; TL = 30°C unless otherwise noted 4
Maximum Zener impedance ZZT 5 Ω @ IZT = 79.8 mA; IZ(ac) = 0.1 IZ(dc), 60 Hz (Note 4) 4
Maximum Zener impedance ZZK 500 Ω @ IZK = 1 mA; IZ(ac) = 0.1 IZ(dc), 60 Hz (Note 4) 4
Reverse leakage current IR 5 μA @ VR = 1.5 V 4
Maximum DC Zener current IZM 319 mA 4
Forward voltage VF 1.5 V @ IF = 200 mA (dc), for all types 3
Zener voltage tolerance (type number designation) -5 5 % Type numbers indicate ±5% tolerance (Note 2) 4
Maximum steady state power dissipation PD 3 W TL = 75°C, measured at zero lead length 2
Maximum steady state power dissipation PD 550 mW TA = 25°C (Note 1, FR-4 board, recommended footprint) 2
Thermal resistance, junction-to-lead RθJL 40 °C/W Junction-to-lead, measured at zero lead length 2
Thermal resistance, junction-to-ambient RθJA 226 °C/W Junction-to-ambient (Note 1, FR-4 board) 2
Operating and storage temperature range TJ, Tstg -65 150 °C 2
Maximum case temperature for soldering purposes 260 °C for 10 seconds 2
ESD rating, Human Body Model 16 kV Class 3 per HBM; datasheet prints '> 16 kV' 2

CAD (KiCad official)

  • Symbol: 1SMB5917BT3G-MS
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: 1smb5917bt3g-ms-etched.step / 1smb5917bt3g-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1smb5917bt3g-ms.step / 1smb5917bt3g-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (8 pp, sha256 d1db003dcf102a3c, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF