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Ray Publish 0.1.0 582d1db 6h ago

1SMA5929BT3G

onsemi · Zener Diodes · SMA

1SMA5929BT3G from onsemi, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode terminal, marked by the polarity band on the SMA package; the 1SMA5929BT3G regulates in reverse bias at a nominal 15 V (VZ 14.25 V min to 15.75 V max) measured at IZT = 25 mA.
2 ANODE passive Anode terminal, the forward-biased side; forward voltage is 1.5 V max at IF = 200 mA, and the device is rated for 1.5 W DC power dissipation at TL = 75°C.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage @ IZT VZ 14.25 15 15.75 V @ IZT = 25 mA 2
Zener voltage tolerance (type number designation) -5 5 % Per Note 3: type number indicates 5% tolerance 2
Maximum Zener Impedance @ IZT ZZT 9 Ω @ IZT = 25 mA 2
Maximum Zener Impedance @ IZK ZZK 600 Ω @ IZK = 0.25 mA 2
Maximum DC Zener Current IZM 100 mA(dc) 2
Forward Voltage VF 1.5 V @ IF = 200 mA 2
Reverse Leakage Current IR 0.5 µA @ VR = 11.4 V 2
DC Power Dissipation @ TL = 75C, measured zero lead length (Note 1) PD 1.5 W TL = 75C, measured zero lead length (Note 1) 1
DC Power Dissipation @ TA = 25C (Note 2) PD 0.5 W TA = 25C (Note 2) 1
Thermal Resistance, Junction-to-Lead RθJL 50 C/W Junction-to-lead, 1 in square copper pad, FR-4 (Note 1) 1
Thermal Resistance, Junction-to-Ambient RθJA 250 C/W Junction-to-ambient, FR-4, ON Semiconductor minimum recommended footprint (Note 2) 1
Operating and Storage Temperature Range TJ, Tstg -65 150 C 1

CAD (KiCad official)

  • Symbol: 1SMA5929BT3G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: 1sma5929bt3g-etched.step / 1sma5929bt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1sma5929bt3g.step / 1sma5929bt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 1ca169f64a35c9ee, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF