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1N5819HW1-7-F

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Diodes Incorporated Schottky Barrier Diodes (SBD), SOD-123F. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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1N5819HW1-7-F

Diodes Incorporated · Schottky Barrier Diodes (SBD) · SOD-123F

1N5819HW1-7-F from Diodes Incorporated, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOD-123F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage V(BR)R 40 V IR = 1.0mA 2
Forward Voltage Drop VF 0.51 V IF = 1A, TJ = +25°C 2
Forward Voltage Drop VF 0.75 V IF = 3A, TJ = +25°C 2
Leakage Current IR 0.5 mA VR = 40V, TJ = +25°C 2
Leakage Current IR 50 mA VR = 40V, TJ = +125°C 2
Leakage Current IR 0.008 mA VR = 4V, TJ = +25°C 2
Leakage Current IR 0.01 0.075 mA VR = 6V, TJ = +25°C 2
Forward Voltage Drop VF 0.44 V IF = 0.1A, TJ = +25°C 2
Forward Voltage Drop VF 0.36 V IF = 1A, TJ = +125°C 2
Reverse Recovery Time tRR 15 ns IF = 10mA, IRRM = 0.1IR, TA = +25°C 2
Total Capacitance CT 30 pF VR = 10V, f = 1MHz 2
Peak Repetitive Reverse Voltage VRRM 40 V TA = +25°C 2
RMS Reverse Voltage VR(RMS) 28 V TA = +25°C 2
Average Rectified Output Current IO 1 A TA = +25°C 2
Non-Repetitive Peak Forward Surge Current IFSM 30 A 8.3ms Single Half Sine-Wave Superimposed on Rated Load 2
Operating Junction Temperature Range TJ -55 125 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Thermal Resistance, Junction to Ambient RθJA 135 °C/W Note 5: 1 x MRP FR-4 PC board, 2oz 2
Thermal Resistance, Junction to Case RθJC 20 °C/W Note 5: 1 x MRP FR-4 PC board, 2oz 2
Thermal Resistance, Junction to Ambient RθJA 75 °C/W Note 6: 1inch sq. copper pad, 2oz 2
Thermal Resistance, Junction to Case RθJC 12 °C/W Note 6: 1inch sq. copper pad, 2oz 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminals: Matte Tin Finish Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: 1N5819HW1-7-F
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123F (KiCad packages3D, STEP)
  • 3D model files: 1n5819hw1-7-f-etched.step / 1n5819hw1-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1n5819hw1-7-f.step / 1n5819hw1-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 4398f00da5562878, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF