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1N4448WS-7-F

Diodes Incorporated · Switching Diodes · SOD-323

1N4448WS-7-F from Diodes Incorporated, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOD-323
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage V(BR)R 75 V IR = 2.5µA 2
Forward Voltage VFM 0.62 0.72 V IF = 5.0mA 2
Forward Voltage VFM 0.855 V IF = 10mA 2
Forward Voltage VFM 1 V IF = 100mA 2
Forward Voltage VFM 1.25 V IF = 150mA 2
Peak Reverse Current IRM 2.5 µA VR = 75V 2
Peak Reverse Current IRM 50 µA VR = 75V, TJ = +150°C 2
Peak Reverse Current IRM 30 µA VR = 25V, TJ = +150°C 2
Peak Reverse Current IRM 25 nA VR = 20V 2
Total Capacitance CT 4 pF VR = 0, f = 1.0MHz 2
Reverse Recovery Time tRR 4 ns IF = IR = 10mA, IRR = 0.1 x IR, RL = 100Ω 2
Non-Repetitive Peak Reverse Voltage VRM 100 V TA = +25°C 2
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VR 75 V TA = +25°C 2
RMS Reverse Voltage VR(RMS) 53 V TA = +25°C 2
Forward Continuous Current IFM 500 mA TA = +25°C 2
Non-Repetitive Peak Forward Surge Current IFSM 4 A t = 1.0μs 2
Non-Repetitive Peak Forward Surge Current IFSM 0.5 A t = 1.0s 2
Power Dissipation PD 200 mW Note 6 2
Thermal Resistance Junction to Ambient Air RθJA 625 °C/W Note 6 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Leads: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead-Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: 1N4448WS-7-F
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: 1n4448ws-7-f-etched.step / 1n4448ws-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1n4448ws-7-f.step / 1n4448ws-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 589ab4420bff6189, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF