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Contents

README

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1EDI60N12AF

Infineon Technologies · Gate Drivers · SO-8

1EDI60N12AF from Infineon Technologies, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC1 power_in Logic input supply voltage with a 3.3 V to 15 V wide operating range (Table 3 gives an operating range of 3.1 V to 17 V for VCC1).
2 IN+ input Non-inverted driver input (active high) that controls the output when IN- is low, with an internal weak pull-down that favors the off-state and a minimum pulse width to filter noise.
3 IN- input Inverted driver input (active low) that controls the output when IN+ is high, with an internal weak pull-up that favors the off-state and a minimum pulse width to filter noise.
4 GND1 power_in Logic ground and ground connection of the input circuit, to which the input-side voltages are referenced.
5 VCC2 power_in Positive power supply of the output driving circuit, which needs a blocking capacitor placed close to the pin (operating range 10 V to 35 V referenced to GND2 per Table 3).
6 OUT+ output Driver source output that turns on the external MOSFET by switching to VCC2 in the on-state, is turned off at a UVLO event, and can sink approximately 100 mA during turn-off.
7 OUT- output Driver sink output that turns off the external MOSFET by switching to GND2 in the off-state, where an active shut-down keeps the output low during UVLO.
8 GND2 power_in Reference ground of the output driving circuit; in a bipolar supply this pin is connected to the negative supply voltage (e.g. -8 V relative to the MOSFET source in the typical example).

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SO-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Power supply output side VVCC2 -0.3 40 V With respect to GND2 14
Positive power supply input side VVCC1 -0.3 18 V 14
Logic input voltages (IN+,IN-) VLogicIN -0.3 18 V 14
Input to output isolation voltage (GND2) VISO -1200 1200 V 14
Junction temperature TJ -40 150 °C 14
Storage temperature TS -55 150 °C 14
Power dissipation (Input side) PD, IN 25 mW @TA = 25°C 14
Power dissipation (Output side) PD, OUT 400 mW @TA = 25°C 14
Thermal resistance (Input side) RTHJA,IN 145 K/W @TA = 85°C 14
Thermal resistance (Output side) RTHJA,OUT 165 K/W @TA = 85°C 14
ESD capability VESD,HBM 2 kV Human Body Model 14
Power supply output side VVCC2 10 35 V With respect to GND2 15
Power supply input side VVCC1 3.1 17 V 15
Logic input voltages (IN+,IN-) VLogicIN -0.3 17 V 15
Switching frequency fsw 4 MHz Do not exceed max. power dissipation 15
Ambient temperature TA -40 125 °C 15
Thermal coefficient, junction-top Ψth,jt 4.8 K/W @TA = 85°C 15
Common mode transient immunity (CMTI) /dVISO/dt/ 100 kV/µs @ 1000 V 15
UVLO threshold input chip (rising) VUVLOH1 2.85 3.1 V 15
UVLO threshold input chip (falling) VUVLOL1 2.55 2.75 V 15
UVLO hysteresis input chip (VUVLOH1 - VUVLOL1) VHYS1 90 100 mV 15
UVLO threshold output chip MOSFET supply (rising) VUVLOH2 9.1 10 V 15
UVLO threshold output chip MOSFET supply (falling) VUVLOL2 8 8.5 V 15
UVLO hysteresis output chip (VUVLOH2 - VUVLOL2) VHYS2 550 600 mV 15
IN+,IN- low input voltage (relative to VCC1) VIN+L, VIN-L 30 % of VCC1 16
IN+,IN- high input voltage (relative to VCC1) VIN+H, VIN-H 70 % of VCC1 16
IN+,IN- low input voltage VIN+L, VIN-L 1.5 V 16
IN+,IN- high input voltage VIN+H, VIN-H 3.5 V 16
IN- input current IIN- 70 200 µA VIN- = GND1 16
IN+ input current IIN+ 70 200 µA VIN+ = VCC1 16
Quiescent current input chip IQ1 0.65 1 mA VVCC1 = 5 V, IN+ = High, IN- = Low => OUT = High 16
Quiescent current output chip IQ2 1.2 2 mA VVCC2 = 15 V, IN+ = High, IN- = Low => OUT = High 16
High level output peak current IOUT+,PEAK 6 10 A IN+ = High, IN- = Low, VVCC2 = 15 V 16
Low level output peak current IOUT-,PEAK 6 9.4 A IN+ = Low, IN- = Low, VVCC2 = 15 V 16
Clamping voltage (OUT+) (VOUT - VVCC2) VCLPout 0.9 1.3 V IN+ = High, IN- = Low, OUT = High, IOUT = 500 mA pulse test, tCLPmax = 10 µs 17
Input IN to output propagation delay ON TPDON 95 120 142 ns CLOAD = 100 pF, VIN+ = 50%, VOUT = 50% @ 25°C 17
Input IN to output propagation delay OFF TPDOFF 105 125 150 ns CLOAD = 100 pF, VIN+ = 50%, VOUT = 50% @ 25°C 17
Input IN to output propagation delay distortion (TPDOFF - TPDON) TPDISTO -15 5 25 ns 17
Input pulse suppression IN+, IN- TMININ+, TMININ- 30 40 ns 17
IN input to output propagation delay ON variation due to temperature TPDONt 10 ns CLOAD = 100 pF, VIN+ = 50%, VOUT = 50% 17
IN input to output propagation delay OFF variation due to temperature TPDOFFt 10 ns CLOAD = 100 pF, VIN+ = 50%, VOUT = 50% 17
IN input to output propagation delay distortion variation due to temperature (TPDOFF-TPDON) TPDISTOt 4 ns CLOAD = 100 pF, VIN+ = 50%, VOUT = 50% 17
Rise time TRISE 5 10 20 ns CLOAD = 1 nF, VL 20%, VH 80% 17
Fall time TFALL 4 9 19 ns CLOAD = 1 nF, VL 20%, VH 80% 17
Active shut down voltage VACTSD 2.2 2.5 V IOUT-/IOUT-,PEAK = 0.1, VCC2 open 18

CAD (KiCad official)

  • Symbol: 1EDI60N12AF
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: 1edi60n12af-etched.step / 1edi60n12af-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1edi60n12af.step / 1edi60n12af.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (22 pp, sha256 e151972a8f8433c8, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF