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1ED3122MC12HXUMA1

Infineon Technologies · Gate Drivers · SOIC-8-300mil

1ED3122MC12HXUMA1 from Infineon Technologies, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC1 power_in Logic input supply voltage, operating over a wide range of 3.3 V up to 15 V (Table 5 gives VCC1 = 3.1 V to 15 V).
2 IN+ input Non-inverted driver input (active high) with an internal noise filter and an internal weak pull-down that favors the off state.
3 IN- input Inverted driver input (active low) with an internal noise filter and an internal weak pull-up that favors the off state.
4 GND1 power_in Logic ground, the ground connection of the input circuit, referenced for all pins 1 to 3.
5 VEE2 power_in Power ground, the reference ground of the output driving circuit, connected to the negative supply in a bipolar supply configuration.
6 CLAMP output Active Miller clamp output that ties to VEE2 during off-state once the gate voltage drops below 2.0 V referred to VEE2, and should be connected directly to the IGBT gate.
7 OUT output Combined source and sink driver output that switches between VCC2 and VEE2, is turned off on UVLO, and is held low by active shut-down during UVLO.
8 VCC2 power_in Positive power supply pin of the output driving circuit, which requires a blocking capacitor placed close to the pin and operates from 10 V to 35 V referred to VEE2.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOIC-8-300mil
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input to output offset voltage VOFFSET 2300 V VVEE2,max-VVEE2,min with VVEE2,max ≥ VGND1 ≥ VVEE2,min 11
Power supply output side VVCC2 -0.3 40 V 11
Power supply input side VVCC1 -0.3 17 V VCC1 - GND1 11
Logic input voltages (IN+, IN-) VIN -0.3 6.5 V IN - GND1 11
Junction temperature TJ -40 150 °C 11
Storage temperature TStg -55 150 °C 11
Power dissipation (input side) PD,IN 100 mW TA = 65°C 11
Power dissipation (output side) PD,OUT 700 mW TA = 65°C 11
Thermal resistance junction to ambient RthJA,OUT 88 K/W TA = 85°C 300 mil, 1s0p, PJ = 266 mW 11
Characterization parameter junction to package top input side ΨJtop 6 K/W 11
ESD robustness (human body model) VESD,HBM 4 kV Human body model 11
Power supply output side (operating) VVCC2 10 35 V 12
Power supply input side (operating) VVCC1 3.1 15 V 12
Logic input voltages (IN+, IN-) (operating) VIN -0.3 5.5 V 12
Switching frequency fSW 1 MHz PD applies 12
Ambient temperature TA -40 125 °C 12
Common mode transient immunity CMTI -200 200 kV/µs VOFFSET,test = 1500 V 12
UVLO threshold input side (on) VUVLOH1 3.1 V 13
UVLO threshold input side (off) VUVLOL1 2.5 V 13
UVLO hysteresis input side VHYS1 0.1 0.2 V 13
UVLO threshold output side (on) VUVLOH2,1 10 V 1ED3120MC12H, 1ED3122MC12H, 1ED3123MC12H 13
UVLO threshold output side (off) VUVLOL2,1 8 V 1ED3120MC12H, 1ED3122MC12H, 1ED3123MC12H 13
UVLO hysteresis output side VHYS2 0.8 V 13
Quiescent current input side IQ1 1.1 mA static, output low 13
Quiescent current output side IQ2 2 mA 13
Start up time tSTART 2.5 20 µs 13
UVLO detection filter time tUVLOflt 50 ns 13
IN+, IN- logic low input voltage VIN,L 1.1 V 13
IN+, IN- logic high input voltage VIN,H 2.5 V 13
IN+, IN- low/high hysteresis VIN,HYS 0.5 0.8 V 13
IN+, IN- input current IIN 100 µA VVCC1 = 5 V; VIN ≤ VVCC1 13
IN+ pull down resistor RIN,PD 75 kΩ to GND1 13
IN- pull up resistor RIN,PU 75 kΩ ensures high-level detection with unconnected pin 13
High level output peak current (1ED3122MC12H) IOUT,H 4 10 A VCC2-OUT = 15 V, Output on 14
High level output on resistance (1ED3122MC12H) RDSON,H 0.3 0.55 0.85 Ω IOUT,H = 0.1 A 14
Low level output peak current (1ED3122MC12H) IOUT,L 4 9 A OUT-VEE2 = 15 V, Output off 14
Low level output on resistance (1ED3122MC12H) RDSON,L 0.3 0.45 0.65 Ω IOUT,L = 0.1 A 14
Low level clamp peak current (1ED3122MC12H) ICLAMP,L 2 3 A VCLAMP = 2.0 V 14
Low level clamp on resistance (1ED3122MC12H) RDSON,CLP 0.33 0.55 0.76 Ω ICLAMP,L = 0.1 A 14
CLAMP threshold voltage (1ED3122MC12H) VCLAMP 1.6 2 2.4 V CLAMP-VEE2 14
CLAMP comparator to CLAMP activation delay time (1ED3122MC12H) tCLPDLY 80 ns VCLAMP ≤ 2.0 V 14
High level output voltage (all variants) ΔVOUT,H 0.3 V VCC2-VOUT,H; IOUT = 20 mA 14
Low level output voltage (all variants) ΔVOUT,L 0.1 V VCC2-VOUT,H; IOUT = 20 mA 14
Short circuit clamp voltage between OUT+/CLAMP and VCC2 (all variants) VCLP 2 V Output on, IOUT = 500 mA, t < 10 µs 14
Input to output propagation delay ON tPDON 80 90 100 ns CLOAD = 100 pF, IN turn-on threshold to 10% output on 15
Input to output propagation delay OFF tPDOFF 80 90 100 ns CLOAD = 100 pF, IN turn-off threshold to 90% output off 15
Input to output propagation delay distortion tPDISTO -5 0 5 ns tPDOFF - tPDON 15
Input pulse suppression time (filter time) tINFLT 30 ns shorter pulses will not propagate to the output 15
Minimum input pulse length tMININ 40 ns 15
Input to output propagation delay variation due to temperature tPD,T 14 ns 15
Input to output propagation delay distortion variation due to temperature tPDISTO,T 3 ns 15
Input to output, part to part propagation delay ON variation /tPDon,P2P/ 7 ns CLOAD = 100 pF 16
Rise time tRISE 15 ns CLOAD = 100 pF 16
Fall time tFALL 15 ns CLOAD = 100 pF 16
Rise time tRISE 30 ns CLOAD = 1 nF 16
Fall time tFALL 30 ns CLOAD = 1 nF 16
Active shut down voltage, cold VACTSD,C 1.9 V IOUT = 10 mA; VCC2 unsupplied; TA < 20°C 16
Active shut down voltage, hot VACTSD,H 1.7 V IOUT- = 10 mA; VCC2 unsupplied; TA ≥ 20°C 16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pet Maximum repetitive insulation voltage VIORM 1767 V (peak) 17

CAD (KiCad official)

  • Symbol: 1ED3122MC12HXUMA1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
  • 3D model files: 1ed3122mc12hxuma1-etched.step / 1ed3122mc12hxuma1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1ed3122mc12hxuma1.step / 1ed3122mc12hxuma1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (20 pp, sha256 8633c6933062e730, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF