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1812L260THDR
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Littelfuse Resettable Fuses, 1812. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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1812L260THDR
Littelfuse · Resettable Fuses · 1812
1812L260THDR from Littelfuse, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal of the two-terminal resettable PTC (solder-plated copper end termination, non-polarized); 1812L260TH is rated 2.60 A hold, 5.20 A trip, 8 Vdc max, 100 A max fault current. |
| 2 | 2 | passive | Second terminal of the two-terminal resettable PTC (solder-plated copper end termination, non-polarized); series-connected with terminal 1 in the protected current path. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Minimum resistance (initial, un-soldered) | R min | 0.015 | Ω | Initial (un-soldered) state | 2 | ||
| Maximum resistance after trip or reflow | R 1max | 0.047 | Ω | 20°C, measured one hour after tripping or reflow soldering of 260°C for 20 sec | 2 | ||
| Maximum time to trip | Time | 2.5 | s | At 8.00 A current | 2 | ||
| Maximum voltage (V max) | V max | 8 | Vdc | Maximum voltage device can withstand without damage at rated current (I max) | 2 | ||
| Maximum fault current (I max) | I max | 100 | A | Maximum fault current device can withstand without damage at rated voltage (Vmax) | 2 | ||
| Max device surface temperature in tripped state | 125 | °C | In tripped state | 3 | |||
| Operating/Storage temperature | -40 | 85 | °C | Operating/Storage Temp. | 3 | ||
| Passive aging resistance change | -5 | 5 | % | Passive aging +85°C, 1000 hours; typical resistance change | 3 | ||
| Humidity aging resistance change | -5 | 5 | % | Humidity aging +85°C, 85% R.H., 1000 hours; typical resistance change | 3 | ||
| Thermal shock resistance change | -30 | % | MIL-STD-202 Method 107, +85°C/-40°C 20 times; typical resistance change | 3 | |||
| Maximum ramp-up rate (TS max to TP) | 3 | °C/second | Pb-free reflow profile, average ramp-up | 3 | |||
| Maximum ramp-down rate | 6 | °C/second | Pb-free reflow profile | 3 | |||
| Time 25°C to peak temperature | 8 | minutes | Pb-free reflow profile, time from 25°C to peak temperature (TP) | 3 | |||
| Peak classification temperature (reflow) | TP | 260 | °C | Pb-free reflow; printed as 260 +0/-5 °C | 3 | ||
| Power dissipated in tripped state | P d | 0.8 | W | Tripped state at 20°C still air | 2 | ||
| Hold current | I hold | 2.6 | A | 20°C still air; maximum current device will pass without tripping | 2 | ||
| Trip current | I trip | 5.2 | A | 20°C still air; minimum current at which device will trip | 2 | ||
| Hold current at ambient | I hold | 3.4 | A | Ambient -40°C | 2 | ||
| Hold current at ambient | I hold | 3.16 | A | Ambient -20°C | 2 | ||
| Hold current at ambient | I hold | 3 | A | Ambient 0°C | 2 | ||
| Hold current at ambient | I hold | 2.6 | A | Ambient 20°C | 2 | ||
| Hold current at ambient | I hold | 2.3 | A | Ambient 40°C | 2 | ||
| Hold current at ambient | I hold | 2.15 | A | Ambient 50°C | 2 | ||
| Hold current at ambient | I hold | 2 | A | Ambient 60°C | 2 | ||
| Hold current at ambient | I hold | 1.85 | A | Ambient 70°C | 2 | ||
| Hold current at ambient | I hold | 1.63 | A | Ambient 85°C | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | Terminal Material Solder-Plated Copper (Solder Material: | 3 |
CAD (KiCad official)
- Symbol:
1812L260THDR - Footprint:
Fuse:Fuse_1812_4532Metric - 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
1812l260thdr-etched.step/1812l260thdr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);1812l260thdr.step/1812l260thdr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Littelfuse datasheet (7 pp, sha256
6208de21968a51c9, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# 1812L260THDR
**Littelfuse** · Resettable Fuses · 1812
1812L260THDR from Littelfuse, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal of the two-terminal resettable PTC (solder-plated copper end termination, non-polarized); 1812L260TH is rated 2.60 A hold, 5.20 A trip, 8 Vdc max, 100 A max fault current. |
| 2 | 2 | passive | Second terminal of the two-terminal resettable PTC (solder-plated copper end termination, non-polarized); series-connected with terminal 1 in the protected current path. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Minimum resistance (initial, un-soldered) | R min | 0.015 | | | Ω | Initial (un-soldered) state | 2 |
| Maximum resistance after trip or reflow | R 1max | | | 0.047 | Ω | 20°C, measured one hour after tripping or reflow soldering of 260°C for 20 sec | 2 |
| Maximum time to trip | Time | | | 2.5 | s | At 8.00 A current | 2 |
| Maximum voltage (V max) | V max | | | 8 | Vdc | Maximum voltage device can withstand without damage at rated current (I max) | 2 |
| Maximum fault current (I max) | I max | | | 100 | A | Maximum fault current device can withstand without damage at rated voltage (Vmax) | 2 |
| Max device surface temperature in tripped state | | | | 125 | °C | In tripped state | 3 |
| Operating/Storage temperature | | -40 | | 85 | °C | Operating/Storage Temp. | 3 |
| Passive aging resistance change | | -5 | | 5 | % | Passive aging +85°C, 1000 hours; typical resistance change | 3 |
| Humidity aging resistance change | | -5 | | 5 | % | Humidity aging +85°C, 85% R.H., 1000 hours; typical resistance change | 3 |
| Thermal shock resistance change | | -30 | | | % | MIL-STD-202 Method 107, +85°C/-40°C 20 times; typical resistance change | 3 |
| Maximum ramp-up rate (TS max to TP) | | | | 3 | °C/second | Pb-free reflow profile, average ramp-up | 3 |
| Maximum ramp-down rate | | | | 6 | °C/second | Pb-free reflow profile | 3 |
| Time 25°C to peak temperature | | | | 8 | minutes | Pb-free reflow profile, time from 25°C to peak temperature (TP) | 3 |
| Peak classification temperature (reflow) | TP | | | 260 | °C | Pb-free reflow; printed as 260 +0/-5 °C | 3 |
| Power dissipated in tripped state | P d | | 0.8 | | W | Tripped state at 20°C still air | 2 |
| Hold current | I hold | | 2.6 | | A | 20°C still air; maximum current device will pass without tripping | 2 |
| Trip current | I trip | | 5.2 | | A | 20°C still air; minimum current at which device will trip | 2 |
| Hold current at ambient | I hold | | 3.4 | | A | Ambient -40°C | 2 |
| Hold current at ambient | I hold | | 3.16 | | A | Ambient -20°C | 2 |
| Hold current at ambient | I hold | | 3 | | A | Ambient 0°C | 2 |
| Hold current at ambient | I hold | | 2.6 | | A | Ambient 20°C | 2 |
| Hold current at ambient | I hold | | 2.3 | | A | Ambient 40°C | 2 |
| Hold current at ambient | I hold | | 2.15 | | A | Ambient 50°C | 2 |
| Hold current at ambient | I hold | | 2 | | A | Ambient 60°C | 2 |
| Hold current at ambient | I hold | | 1.85 | | A | Ambient 70°C | 2 |
| Hold current at ambient | I hold | | 1.63 | | A | Ambient 85°C | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | | Terminal Material Solder-Plated Copper (Solder Material: | 3 |
## CAD (KiCad official)
- Symbol: `1812L260THDR`
- Footprint: `Fuse:Fuse_1812_4532Metric`
- 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal _1806_ height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `1812l260thdr-etched.step` / `1812l260thdr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `1812l260thdr.step` / `1812l260thdr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Littelfuse datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588909265632808961) (7 pp, sha256 `6208de21968a51c9`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/1812l260thdr-datasheet.pdf)