# 1808CG331G501NT

**FH Guangdong Fenghua Advanced Tech** · Multilayer Ceramic Capacitors MLCC - SMD/SMT · 1808

1808CG331G501NT from FH Guangdong Fenghua Advanced Tech, in a 1808. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised capacitor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised capacitor; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | FH Guangdong Fenghua Advanced Tech |
| Package | 1808 |
| Category | Capacitors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Capacitance tolerance (code G) |  | -2 |  | 2 | % | Tolerance code G = ±2% (MPN position 'G'); page 4 | 4 |
| Temperature coefficient (C0G) |  | -30 | 0 | 30 | ppm/°C | C0G Class I, reference 25°C; page 5 | 5 |
| Insulation resistance (Class I) | IR | 50000 |  |  | MΩ | C≤10nF; test voltage = rated voltage (max 500V), 60±5 s, 25°C, RH≤75%; page 16 | 16 |
| Dissipation factor (Class I) | DF |  |  | 0.1 | % | C≥30pF; 1MHz±10%, 1.0±0.2Vrms; page 16 | 16 |
| Rated voltage | Ur |  |  | 500 | V | DC rated voltage, MPN code 501 = 500 V; page 4 | 4 |
| Operating temperature range |  | -55 |  | 125 | °C | C0G operating temperature range; page 5 | 5 |
| Storage temperature |  | 5 |  | 40 | °C | Storage (not operation); recommended below 30°C; page 25 | 25 |
| Storage relative humidity |  | 20 |  | 70 | % | Storage (not operation); page 25 | 25 |

## CAD (KiCad official)

- Symbol: `1808CG331G501NT`
- Footprint: `Capacitor_SMD:C_1808_4520Metric`
- 3D model: 1808 (KiCad packages3D, STEP)
- 3D model files: `1808cg331g501nt-etched.step` / `1808cg331g501nt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `1808cg331g501nt.step` / `1808cg331g501nt.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [FH Guangdong Fenghua Advanced Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8770992435868643328) (30 pp, sha256 `705023d3be045414`, retrieved 2026-10-13, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/1808cg331g501nt-datasheet.pdf)