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1808B681K302NT
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FH Guangdong Fenghua Advanced Tech Multilayer Ceramic Capacitors MLCC - SMD/SMT, 1808. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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1808B681K302NT
FH Guangdong Fenghua Advanced Tech · Multilayer Ceramic Capacitors MLCC - SMD/SMT · 1808
1808B681K302NT from FH Guangdong Fenghua Advanced Tech, in a 1808. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised capacitor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised capacitor; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FH Guangdong Fenghua Advanced Tech |
| Package | 1808 |
| Category | Capacitors |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Capacitance tolerance (code K) | -10 | 10 | % | K = ±10% per part-numbering table | 4 | ||
| Temperature coefficient (X7R) | -15 | 15 | % | Reference temperature 25°C, X7R | 5 | ||
| Operating temperature range (X7R) | -55 | 125 | °C | X7R | 5 | ||
| Insulation resistance (Class II) | IR | 10000 | MΩ | C≤25 nF | 16 | ||
| Reflow preheat temperature difference (soldering temp vs chip surface) | 150 | °C | Reflow and wave preheating | 28 | |||
| Manual soldering iron tip temperature | 350 | °C | Manual soldering; 3 s max, 20 W max, preheat ≤130°C | 29 |
CAD (KiCad official)
- Symbol:
1808B681K302NT - Footprint:
Capacitor_SMD:C_1808_4520Metric - 3D model: 1808 (KiCad packages3D, STEP)
- 3D model files:
1808b681k302nt-etched.step/1808b681k302nt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);1808b681k302nt.step/1808b681k302nt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: FH Guangdong Fenghua Advanced Tech datasheet (30 pp, sha256
705023d3be045414, retrieved 2026-10-15, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# 1808B681K302NT
**FH Guangdong Fenghua Advanced Tech** · Multilayer Ceramic Capacitors MLCC - SMD/SMT · 1808
1808B681K302NT from FH Guangdong Fenghua Advanced Tech, in a 1808. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised capacitor; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised capacitor; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | FH Guangdong Fenghua Advanced Tech |
| Package | 1808 |
| Category | Capacitors |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Capacitance tolerance (code K) | | -10 | | 10 | % | K = ±10% per part-numbering table | 4 |
| Temperature coefficient (X7R) | | -15 | | 15 | % | Reference temperature 25°C, X7R | 5 |
| Operating temperature range (X7R) | | -55 | | 125 | °C | X7R | 5 |
| Insulation resistance (Class II) | IR | 10000 | | | MΩ | C≤25 nF | 16 |
| Reflow preheat temperature difference (soldering temp vs chip surface) | | | | 150 | °C | Reflow and wave preheating | 28 |
| Manual soldering iron tip temperature | | | | 350 | °C | Manual soldering; 3 s max, 20 W max, preheat ≤130°C | 29 |
## CAD (KiCad official)
- Symbol: `1808B681K302NT`
- Footprint: `Capacitor_SMD:C_1808_4520Metric`
- 3D model: 1808 (KiCad packages3D, STEP)
- 3D model files: `1808b681k302nt-etched.step` / `1808b681k302nt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `1808b681k302nt.step` / `1808b681k302nt.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [FH Guangdong Fenghua Advanced Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8770997628861997057) (30 pp, sha256 `705023d3be045414`, retrieved 2026-10-15, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/1808b681k302nt-datasheet.pdf)