component
π162U31
Public Made by Adomby adom
2Pai Semi Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownπ162U31
2Pai Semi · Digital Isolators · SOIC-16
π162U31 from 2Pai Semi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | Supply Voltage for Isolator Side 1, operating from 3 V to 5.5 V per the recommended operating conditions. |
| 2 | VIA | input | Logic Input A, with VIH of at least 0.7VDDx and VIL of at most 0.3VDDx. |
| 3 | VIB | input | Logic Input B, with VIH of at least 0.7VDDx and VIL of at most 0.3VDDx. |
| 4 | VIC | input | Logic Input C, with VIH of at least 0.7VDDx and VIL of at most 0.3VDDx. |
| 5 | VID | input | Logic Input D, with VIH of at least 0.7VDDx and VIL of at most 0.3VDDx. |
| 6 | VOE | output | Logic Output E, rated for high level output current IOH of -6 mA and low level output current IOL of 6 mA. |
| 7 | VOF | output | Logic Output F, rated for high level output current IOH of -6 mA and low level output current IOL of 6 mA. |
| 8 | GND1 | power_in | Ground 1, the ground reference for Isolator Side 1. |
| 9 | GND2 | power_in | Ground 2, the ground reference for Isolator Side 2. |
| 10 | VIF | input | Logic Input F, with VIH of at least 0.7VDDx and VIL of at most 0.3VDDx. |
| 11 | VIE | input | Logic Input E, with VIH of at least 0.7VDDx and VIL of at most 0.3VDDx. |
| 12 | VOD | output | Logic Output D, rated for high level output current IOH of -6 mA and low level output current IOL of 6 mA. |
| 13 | VOC | output | Logic Output C, rated for high level output current IOH of -6 mA and low level output current IOL of 6 mA. |
| 14 | VOB | output | Logic Output B, rated for high level output current IOH of -6 mA and low level output current IOL of 6 mA. |
| 15 | VOA | output | Logic Output A, rated for high level output current IOH of -6 mA and low level output current IOL of 6 mA. |
| 16 | VDD2 | power_in | Supply Voltage for Isolator Side 2, operating from 3 V to 5.5 V per the recommended operating conditions. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | 2Pai Semi |
| Package | SOIC-16 |
| Category | Interface ICs |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltages (VDD1-GND1, VDD2-GND2) | -0.5 | 7 | V | 4 | |||
| Input Voltages (VIA, VIB) | -0.5 | V | 4 | ||||
| Output Voltages (VOA, VOB) | -0.5 | V | 4 | ||||
| Average Output Current per Pin, Side 1 | IO1 | -10 | 10 | mA | 4 | ||
| Average Output Current per Pin, Side 2 | IO2 | -10 | 10 | mA | 4 | ||
| Common-Mode Transients Immunity | -150 | 150 | kV/µs | 4 | |||
| Storage Temperature Range | TST | -65 | 150 | °C | 4 | ||
| Ambient Operating Temperature Range | TA | -40 | 125 | °C | 4 | ||
| Supply Voltage | VDDx | 3 | 5.5 | V | 4 | ||
| Low Level Input Signal Voltage | VIL | 0 | V | 4 | |||
| High Level Output Current | IOH | -6 | mA | 4 | |||
| Low Level Output Current | IOL | 6 | mA | 4 | |||
| Maximum Data Rate | 0 | 150 | Kbps | 4 | |||
| Junction Temperature | TJ | -40 | 150 | °C | 4 | ||
| Ambient Operating Temperature | TA | -40 | 125 | °C | 4 | ||
| Minimum Pulse Width | PW | 6.5 | us | Within pulse width distortion (PWD) limit | 5 | ||
| Propagation Delay Time | tpHL, tpLH | 3 | 4.5 | us | 50% input to 50% output, 5VDC supply | 5 | |
| Propagation Delay Time | tpHL, tpLH | 3.2 | 4.8 | us | 50% input to 50% output, 3.3VDC supply | 5 | |
| Pulse Width Distortion | PWD | 0 | 0.02 | 0.2 | us | /tpHL - tpLH/, 5VDC supply | 5 |
| Part to Part Propagation Delay Skew | tPSK | 0.3 | us | 5VDC supply, same temperature, load and voltage | 5 | ||
| Channel to Channel Propagation Delay Skew | tCSK | 0 | 0.2 | us | 5VDC supply | 5 | |
| Output Signal Rise/Fall Time | tr/tf | 1.5 | ns | 10% to 90% signal terminated 50 | 5 | ||
| Common-Mode Transient Immunity | CMTI | 100 | 150 | kV/µs | VIN = VDDx2 or 0V, VCM = 1000 V | 5 | |
| ESD (HBM - Human Body Model) | ESD | -8 | 8 | kV | All pins | 5 | |
| Low Level Output Voltage | VOL | 0 | 0.1 | V | 20 µA output current | 5 | |
| Low Level Output Voltage | VOL | 0.1 | 0.2 | V | 2 mA output current | 6 | |
| Input Current per Signal Channel | IIN | -10 | 0.5 | 10 | µA | 0 V ≤ Signal voltage ≤ VDDX1 | 6 |
| VDDx1 Undervoltage Rising Threshold | VDDxUV+ | 2.45 | 2.65 | 2.9 | V | 6 | |
| VDDx1 Undervoltage Falling Threshold | VDDxUV− | 2.3 | 2.5 | 2.75 | V | 6 | |
| Quiescent Supply Current (side 1) | IDD1 (Q) | 1015 | 1269 | 1650 | µA | @5VDC supply, 0V input signal | 6 |
| Quiescent Supply Current (side 2) | IDD2 (Q) | 1570 | 1963 | 2552 | µA | @5VDC supply, 0V input signal | 6 |
| Quiescent Supply Current (side 1) | IDD1 (Q) | 889 | 1111 | 1444 | µA | @5VDC supply, 5V input signal | 6 |
| Quiescent Supply Current (side 2) | IDD2 (Q) | 1596 | 1995 | 2594 | µA | @5VDC supply, 5V input signal | 6 |
| Quiescent Supply Current (side 1) | IDD1 (Q) | 922 | 1152 | 1498 | µA | @3.3VDC supply, 0V input signal | 6 |
| Quiescent Supply Current (side 2) | IDD2 (Q) | 1506 | 1882 | 2447 | µA | @3.3VDC supply, 0V input signal | 6 |
| Quiescent Supply Current (side 1) | IDD1 (Q) | 878 | 1098 | 1427 | µA | @3.3VDC supply, 3.3V input signal | 6 |
| Quiescent Supply Current (side 2) | IDD2 (Q) | 1578 | 1972 | 2564 | µA | @3.3VDC supply, 3.3V input signal | 6 |
| Supply Current side 1, 2 Kbps | IDD1 | 1.18 | 1.77 | mA | @5VDC supply, 2 Kbps | 7 | |
| Supply Current side 1, 50 Kbps | IDD1 | 1.19 | 1.79 | mA | @5VDC supply, 50 Kbps | 7 | |
| Supply Current side 1, 150 Kbps | IDD1 | 1.21 | 1.82 | mA | @5VDC supply, 150 Kbps | 7 | |
| Supply Current side 2, 2 Kbps | IDD2 | 1.97 | 2.96 | mA | @5VDC supply, 2 Kbps | 7 | |
| Supply Current side 2, 50 Kbps | IDD2 | 1.99 | 2.99 | mA | @5VDC supply, 50 Kbps | 7 | |
| Supply Current side 2, 150 Kbps | IDD2 | 2.02 | 3.03 | mA | @5VDC supply, 150 Kbps | 7 | |
| Supply Current side 1, 2 Kbps | IDD1 | 1.11 | 1.67 | mA | @3.3VDC supply, 2 Kbps | 7 | |
| Supply Current side 1, 50 Kbps | IDD1 | 1.12 | 1.68 | mA | @3.3VDC supply, 50 Kbps | 7 | |
| Supply Current side 1, 150 Kbps | IDD1 | 1.12 | 1.68 | mA | @3.3VDC supply, 150 Kbps | 7 | |
| Supply Current side 2, 2 Kbps | IDD2 | 1.92 | 2.88 | mA | @3.3VDC supply, 2 Kbps | 7 | |
| Supply Current side 2, 50 Kbps | IDD2 | 1.93 | 2.9 | mA | @3.3VDC supply, 50 Kbps | 7 | |
| Supply Current side 2, 150 Kbps | IDD2 | 1.94 | 2.91 | mA | @3.3VDC supply, 150 Kbps | 7 | |
| Minimum External Air Gap (Clearance) | L (CLR) | 4 | mm | Measured from input terminals to output terminals, shortest distance through air | 7 | ||
| Minimum External Tracking (Creepage) | L (CRP) | 4 | mm | Measured from input terminals to output terminals, shortest distance path along body | 7 | ||
| Minimum Internal Gap (Internal Clearance) | 11 | µm | Insulation distance through insulation | 7 | |||
| Rated Dielectric Insulation Voltage | 3000 | V rms | 1-minute duration | 7 | |||
| Maximum Working Insulation Voltage | VIORM | 707 | V peak | DIN V VDE V 0884-10, 3 kV variant | 9 | ||
| Maximum Junction Temperature (safety limiting) | TS | 150 | °C | Safety limiting values | 9 | ||
| IC Junction to Ambient Thermal Resistance | θJA | 76 | °C/W | Thermocouple located at center of package underside | 7 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pC | In accordance with DIN V VDE V 0884-10, eachπ160U3x/π161U3x/π162U3x /π163U3x is proof tested by applying an insulation test voltage ≥ 1326 V peak for 1 sec (partial discharge detection limit = 5 pC); | 8 |
CAD (KiCad official)
- Symbol:
π162U31 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
162u31-etched.step/162u31-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);162u31.step/162u31.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: 2Pai Semi datasheet (16 pp, sha256
ce6539eb2784bb49, retrieved 2026-11-04, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).