component

π162M61

Public Made by Adom

by adom

2Pai Semi Digital Isolators, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentcommunication interface chip-uart-485-232π162m61factory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
162m61 / README.md
History Download
Ray Publish 0.1.0 850a20f 6d ago

π162M61

2Pai Semi · Digital Isolators · SOIC-16-300mil

π162M61 from 2Pai Semi, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Supply voltage for isolator side 1, operating range 3 V to 5.5 V (absolute maximum 7.0 V), bypassed to GND1 with 0.1 µF to 10 µF.
2 VIA input Logic input A on side 1.
3 VIB input Logic input B on side 1.
4 VIC input Logic input C on side 1.
5 VID input Logic input D on side 1.
6 VOE output Logic output E on side 1.
7 VOF output Logic output F on side 1.
8 GND1 power_in Ground 1, the ground reference for isolator side 1.
9 GND2 power_in Ground 2, the ground reference for isolator side 2.
10 VIF input Logic input F on side 2.
11 VIE input Logic input E on side 2.
12 VOD output Logic output D on side 2.
13 VOC output Logic output C on side 2.
14 VOB output Logic output B on side 2.
15 VOA output Logic output A on side 2.
16 VDD2 power_in Supply voltage for isolator side 2, operating range 3 V to 5.5 V (absolute maximum 7.0 V), bypassed to GND2 with 0.1 µF to 10 µF.

Key specifications

Parameter Value
Manufacturer 2Pai Semi
Package SOIC-16-300mil
Category Communication Interface Chip/UART/485/232
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (abs max) VDD1-GND1, VDD2-GND2 -0.5 7 V TA=25°C 4
Average Output Current per Pin, Side 1 IO1 -10 10 mA 4
Average Output Current per Pin, Side 2 IO2 -10 10 mA 4
Common-Mode Transients Immunity (abs max) -200 200 kV/µs 4
Storage Temperature TST -65 150 °C 4
Ambient Operating Temperature (abs max) TA -40 125 °C 4
Supply Voltage VDDx 3 5.5 V 4
High Level Output Current IOH -6 mA 4
Low Level Output Current IOL 6 mA 4
Data Rate 0 10 Mbps 4
Junction Temperature TJ -40 150 °C 4
Ambient Operating Temperature TA -40 125 °C 4
Minimum Pulse Width PW 100 ns Within pulse width distortion (PWD) limit 5
Maximum Data Rate 10 Mbps Within PWD limit 5
Propagation Delay Time tpHL, tpLH 12 16 ns 5VDC supply 6
Propagation Delay Time tpHL, tpLH 14 18.5 ns 3.3VDC supply 6
Pulse Width Distortion PWD 0.3 3 ns 5VDC supply, /tpHL - tpLH/ 6
Pulse Width Distortion PWD 0.4 3 ns 3.3VDC supply, /tpHL - tpLH/ 6
Part to Part Propagation Delay Skew tPSK 2 ns 5VDC supply 6
Channel to Channel Propagation Delay Skew tCSK 0 1.8 ns 5VDC supply 6
Channel to Channel Propagation Delay Skew tCSK 0 2 ns 3.3VDC supply 6
Output Signal Rise/Fall Time tr/tf 1.5 ns See Figure 11 6
Dynamic Input Supply Current per Channel IDDI (D) 10 µA/Mbps CL = 0 pF @ 5VDC Supply 6
Dynamic Output Supply Current per Channel IDDO (D) 45 µA/Mbps CL = 0 pF @ 5VDC Supply 6
Dynamic Input Supply Current per Channel IDDI (D) 9 µA/Mbps CL = 0 pF @ 3.3VDC Supply 6
Dynamic Output Supply Current per Channel IDDO (D) 28 µA/Mbps CL = 0 pF @ 3.3VDC Supply 6
Common-Mode Transient Immunity CMTI 120 kV/µs VIN = VDDx or 0V, VCM = 1000 V 6
Jitter (peak-to-peak) 180 ps p-p See the Jitter Measurement section 6
Jitter (rms) 30 ps rms See the Jitter Measurement section 6
ESD (HBM) ESD -8 8 kV 6
Low Level Output Voltage VOL 0 0.1 V 20 µA output current 6
Low Level Output Voltage VOL 0.1 0.2 V 2 mA output current 6
Input Current per Signal Channel IIN -10 0.5 10 µA 0 V ≤ Signal voltage ≤ VDDX 6
VDDx Undervoltage Rising Threshold VDDxUV+ 2.45 2.75 2.95 V 6
VDDx Undervoltage Falling Threshold VDDxUV− 2.3 2.6 2.75 V 7
VDDx Hysteresis VDDxUVH 0.15 V 7
Quiescent Supply Current IDD1 IDD1 (Q) 0.92 1.15 1.5 mA 5VDC, VI=0V for π16xMx0 8
Quiescent Supply Current IDD2 IDD2 (Q) 1.69 2.12 2.75 mA 5VDC, VI=5V for π16xMx1 8
Quiescent Supply Current IDD1 IDD1 (Q) 1.22 1.53 1.99 mA 5VDC, VI=5V for π16xMx0 8
Quiescent Supply Current IDD2 IDD2 (Q) 1.64 2.06 2.67 mA 5VDC, VI=0V for π16xMx1 8
Quiescent Supply Current IDD1 IDD1 (Q) 0.89 1.11 1.44 mA 3.3VDC, VI=0V for π16xMx0 8
Quiescent Supply Current IDD2 IDD2 (Q) 1.64 2.05 2.66 mA 3.3VDC, VI=3.3V for π16xMx1 8
Quiescent Supply Current IDD1 IDD1 (Q) 1.03 1.29 1.68 mA 3.3VDC, VI=3.3V for π16xMx0 8
Quiescent Supply Current IDD2 IDD2 (Q) 1.55 1.94 2.52 mA 3.3VDC, VI=0V for π16xMx1 8
Total Supply Current IDD1 at 150 Kbps IDD1 1.31 1.97 mA 5VDC, CL = 0 pF 9
Total Supply Current IDD2 at 150 Kbps IDD2 2.14 3.21 mA 5VDC, CL = 0 pF 9
Total Supply Current IDD1 at 1 Mbps IDD1 1.5 2.26 mA 5VDC, CL = 0 pF 9
Total Supply Current IDD2 at 1 Mbps IDD2 2.37 3.55 mA 5VDC, CL = 0 pF 9
Total Supply Current IDD1 at 10 Mbps IDD1 2.99 4.48 mA 5VDC, CL = 0 pF 9
Total Supply Current IDD2 at 10 Mbps IDD2 4.23 6.35 mA 5VDC, CL = 0 pF 9
Total Supply Current IDD1 at 150 Kbps IDD1 1.19 1.79 mA 3.3VDC, CL = 0 pF 9
Total Supply Current IDD2 at 150 Kbps IDD2 2.04 3.06 mA 3.3VDC, CL = 0 pF 9
Total Supply Current IDD1 at 1 Mbps IDD1 1.3 1.94 mA 3.3VDC, CL = 0 pF 9
Total Supply Current IDD2 at 1 Mbps IDD2 2.17 3.26 mA 3.3VDC, CL = 0 pF 9
Total Supply Current IDD1 at 10 Mbps IDD1 2.23 3.34 mA 3.3VDC, CL = 0 pF 9
Total Supply Current IDD2 at 10 Mbps IDD2 3.36 5.04 mA 3.3VDC, CL = 0 pF 9
Rated Dielectric Insulation Voltage 5000 V rms 1-minute duration 9
Minimum External Air Gap (Clearance) L (CLR) 8 mm Measured from input terminals to output terminals, shortest distance through air 9
Minimum External Tracking (Creepage) L (CRP) 8 mm Measured from input terminals to output terminals, shortest distance path along body 9
IC Junction to Ambient Thermal Resistance θJA 45 °C/W Thermocouple located at center of package underside 9

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pC In accordance with DIN V VDE V 0884-11, eachπ160M3x/π161M3x/π162M3x /π163M3x is proof tested by applying an insulation test voltage ≥ 848 V peak for 1 sec (partial discharge detection limit = 5 pC); e 10

CAD (KiCad official)

  • Symbol: π162M61
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: 162m61-etched.step / 162m61-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 162m61.step / 162m61.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: 2Pai Semi datasheet (19 pp, sha256 5bda2a660ddaeeda, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF