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π160U31

Public Made by Adom

by adom

2Pai Semi Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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π160U31

2Pai Semi · Digital Isolators · SOIC-16

π160U31 from 2Pai Semi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Supply voltage for isolator side 1, 3.0 V to 5.5 V, bypassed to GND1 with 0.1 µF to 10 µF.
2 VIA input Logic input A on side 1.
3 VIB input Logic input B on side 1.
4 VIC input Logic input C on side 1.
5 VID input Logic input D on side 1.
6 VIE input Logic input E on side 1.
7 VIF input Logic input F on side 1.
8 GND1 power_in Ground 1, the ground reference for isolator side 1.
9 GND2 power_in Ground 2, the ground reference for isolator side 2.
10 VOF output Logic output F on side 2.
11 VOE output Logic output E on side 2.
12 VOD output Logic output D on side 2.
13 VOC output Logic output C on side 2.
14 VOB output Logic output B on side 2.
15 VOA output Logic output A on side 2.
16 VDD2 power_in Supply voltage for isolator side 2, 3.0 V to 5.5 V, bypassed to GND2 with 0.1 µF to 10 µF.

Key specifications

Parameter Value
Manufacturer 2Pai Semi
Package SOIC-16
Category Communication Interface Chip/UART/485/232
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDDx 3 5.5 V 4
Low Level Output Current IOL 6 mA 4
High Level Output Current IOH -6 mA 4
Data Rate 0 150 Kbps 4
Junction Temperature TJ -40 150 °C 4
Ambient Operating Temperature TA -40 125 °C 4
Supply Voltages VDD1-GND1, VDD2-GND2 -0.5 7 V TA = 25°C 4
Average Output Current per Pin, Side 1 IO1 -10 10 mA TA = 25°C 4
Average Output Current per Pin, Side 2 IO2 -10 10 mA TA = 25°C 4
Common-Mode Transients Immunity -300 300 kV/µs TA = 25°C 4
Storage Temperature TST -65 150 °C 4
Ambient Operating Temperature TA -40 125 °C TA = 25°C 4
IC Junction to Ambient Thermal Resistance θJA 76 °C/W Thermocouple located at center of package underside 9
Minimum Pulse Width PW 6.5 us Within pulse width distortion (PWD) limit 5
Maximum Data Rate 150 Kbps Within PWD limit 5
Propagation Delay Time tpHL, tpLH 3 4.5 us 5VDC supply 5
Propagation Delay Time tpHL, tpLH 3.2 4.8 us 3.3VDC supply 5
Pulse Width Distortion PWD 0 0.02 0.2 us The max different time between tpHL and tpLH@ 5VDC supply. And The value is / tpHL - tpLH / 5
Output Signal Rise/Fall Time tr/tf 1.5 ns See Figure 11. 5
Common-Mode Transient Immunity CMTI 250 kV/µs VIN = VDDx or 0V, VCM = 1000 V 5
ESD (HBM) ESD -8 8 kV All pins 5
Low Level Output Voltage VOL 0 0.1 V 20 µA output current 6
Low Level Output Voltage VOL 0.1 0.2 V 2 mA output current 6
Input Current per Signal Channel IIN -10 0.5 10 µA 0 V ≤ Signal voltage ≤ VDDX 6
VDDx Undervoltage Rising Threshold VDDxUV+ 2.45 2.75 2.95 V 6
VDDx Undervoltage Falling Threshold VDDxUV− 2.3 2.6 2.75 V 6
VDDx Hysteresis VDDxUVH 0.15 V 6
Quiescent Supply Current IDD1 IDD1 (Q) 0.46 0.58 0.75 mA 5VDC, VI=0V for π16xUx1 6
Quiescent Supply Current IDD2 IDD2 (Q) 2.12 2.66 3.45 mA 5VDC, VI=5V for π16xUx0 6
Quiescent Supply Current IDD1 IDD1 (Q) 0.18 0.23 0.3 mA 5VDC, VI=5V for π16xUx1 6
Quiescent Supply Current IDD2 IDD2 (Q) 2.3 2.88 3.74 mA 5VDC, VI=0V for π16xUx0 6
Quiescent Supply Current IDD1 IDD1 (Q) 0.34 0.42 0.55 mA 3.3VDC, VI=0V for π16xUx1 6
Quiescent Supply Current IDD2 IDD2 (Q) 2.09 2.61 3.39 mA 3.3VDC, VI=3.3V for π16xUx0 6
Quiescent Supply Current IDD1 IDD1 (Q) 0.18 0.23 0.29 mA 3.3VDC, VI=3.3V for π16xUx1 6
Quiescent Supply Current IDD2 IDD2 (Q) 2.28 2.84 3.7 mA 3.3VDC, VI=0V for π16xUx0 6
Rated Dielectric Insulation Voltage 3000 V rms 1-minute duration 8
Resistance (Input to Output) RIO 10 Ω 9
Capacitance (Input to Output) CIO 1.5 pF @1MHz 9
Input Capacitance CI 3 pF @1MHz 9

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pC In accordance with DIN V VDE V 0884-11, eachπ160U3x/π161U3x/π162U3x /π163U3x is proof tested by applying an insulation test voltage ≥ 848 V peak for 1 sec (partial discharge detection limit = 5 pC); e 9

CAD (KiCad official)

  • Symbol: π160U31
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: 160u31-etched.step / 160u31-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 160u31.step / 160u31.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: 2Pai Semi datasheet (18 pp, sha256 e1b1ac8b32e8b573, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF