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π160M31

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2Pai Semi Digital Isolators, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentsignal isolation devicesπ160m31factory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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π160M31

2Pai Semi · Digital Isolators · SOIC-16

π160M31 from 2Pai Semi, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD1 power_in Supply voltage for isolator side 1, operating range 3.0 V to 5.5 V.
2 VIA input Logic input A on side 1.
3 VIB input Logic input B on side 1.
4 VIC input Logic input C on side 1.
5 VID input Logic input D on side 1.
6 VIE input Logic input E on side 1.
7 VIF input Logic input F on side 1.
8 GND1 power_in Ground 1, the ground reference for isolator side 1.
9 GND2 power_in Ground 2, the ground reference for isolator side 2.
10 VOF output Logic output F on side 2.
11 VOE output Logic output E on side 2.
12 VOD output Logic output D on side 2.
13 VOC output Logic output C on side 2.
14 VOB output Logic output B on side 2.
15 VOA output Logic output A on side 2.
16 VDD2 power_in Supply voltage for isolator side 2, operating range 3.0 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer 2Pai Semi
Package SOIC-16
Category Signal Isolation Devices
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDDx 3 5.5 V 4
Data Rate 0 10 Mbps 4
High Level Output Current IOH -6 mA 4
Low Level Output Current IOL 6 mA 4
Junction Temperature TJ -40 150 °C 4
Ambient Operating Temperature TA -40 125 °C 4
Supply Voltage (abs max) VDDx-GNDx -0.5 7 V VDD1-GND1, VDD2-GND2 4
Input Voltage (abs max) -0.5 V -0.5 V to VDDx + 0.5 V 4
Output Voltage (abs max) -0.5 V -0.5 V to VDDx + 0.5 V 4
Average Output Current per Pin IO1, IO2 -10 10 mA Side 1 / Side 2 4
Common-Mode Transients Immunity -200 200 kV/µs 4
Storage Temperature TST -65 150 °C 4
Ambient Operating Temperature (abs max) TA -40 125 °C 4
Propagation Delay Time tpHL, tpLH 5.5 8 12.5 ns 5VDC supply 5
Propagation Delay Time tpHL, tpLH 6.5 9 13.5 ns 3.3VDC supply 5
Pulse Width Distortion PWD 0.3 3 ns /tpHL - tpLH/ @ 5VDC supply 5
Pulse Width Distortion PWD 0.4 3 ns /tpHL - tpLH/ @ 3.3VDC supply 5
Part to Part Propagation Delay Skew tPSK 2 ns @ 5VDC supply 5
Channel to Channel Propagation Delay Skew tCSK 1.8 ns @ 5VDC supply 5
Channel to Channel Propagation Delay Skew tCSK 2 ns @ 3.3VDC supply 5
Minimum Pulse Width PW 100 ns Within pulse width distortion (PWD) limit 5
Maximum Data Rate 10 Mbps Within PWD limit 5
ESD (HBM) ESD -8 8 kV 5
Input Current per Signal Channel IIN -10 0.5 10 µA 0 V ≤ Signal voltage ≤ VDDX 6
VDDx Undervoltage Rising Threshold VDDxUV+ 2.45 2.75 2.95 V 6
VDDx Undervoltage Falling Threshold VDDxUV- 2.3 2.6 2.75 V 7
Quiescent Supply Current IDD1 IDD1 (Q) 0.19 0.24 0.31 mA 5VDC, VI=0V for π16xMx0 7
Quiescent Supply Current IDD2 IDD2 (Q) 2.34 2.93 3.81 mA 5VDC, VI=5V for π16xMx1 7
Quiescent Supply Current IDD1 IDD1 (Q) 0.47 0.59 0.77 mA 5VDC, VI=5V for π16xMx0 7
Quiescent Supply Current IDD2 IDD2 (Q) 2.22 2.77 3.6 mA 5VDC, VI=0V for π16xMx1 7
Quiescent Supply Current IDD2 IDD2 (Q) 2.32 2.9 3.76 mA 3.3VDC, VI=3.3V for π16xMx1 7
Quiescent Supply Current IDD1 IDD1 (Q) 0.35 0.44 0.57 mA 3.3VDC, VI=3.3V for π16xMx0 7
Quiescent Supply Current IDD2 IDD2 (Q) 2.13 2.66 3.46 mA 3.3VDC, VI=0V for π16xMx1 7
Supply Current IDD1 at 150 Kbps IDD1 0.42 0.63 mA 5VDC, CL = 0 pF 8
Supply Current IDD2 at 150 Kbps IDD2 2.85 4.28 mA 5VDC, CL = 0 pF 8
Supply Current IDD1 at 1 Mbps IDD1 0.45 0.68 mA 5VDC, CL = 0 pF 8
Supply Current IDD2 at 1 Mbps IDD2 3.06 4.59 mA 5VDC, CL = 0 pF 8
Supply Current IDD1 at 10 Mbps IDD1 0.72 1.08 mA 5VDC, CL = 0 pF 8
Supply Current IDD2 at 10 Mbps IDD2 5.28 7.92 mA 5VDC, CL = 0 pF 8
Supply Current IDD1 at 150 Kbps IDD1 0.33 0.5 mA 3.3VDC, CL = 0 pF 8
Supply Current IDD2 at 150 Kbps IDD2 2.79 4.19 mA 3.3VDC, CL = 0 pF 8
Supply Current IDD1 at 1 Mbps IDD1 0.36 0.54 mA 3.3VDC, CL = 0 pF 8
Supply Current IDD2 at 1 Mbps IDD2 2.91 4.37 mA 3.3VDC, CL = 0 pF 8
Supply Current IDD1 at 10 Mbps IDD1 0.54 0.81 mA 3.3VDC, CL = 0 pF 8
Supply Current IDD2 at 10 Mbps IDD2 4.29 6.44 mA 3.3VDC, CL = 0 pF 8
Rated Dielectric Insulation Voltage 3000 V rms 1-minute duration 9
Output Signal Rise/Fall Time tr/tf 1.5 ns See Figure 11. 5
Common-Mode Transient Immunity CMTI 75 kV/µs VIN = VDDx or 0V, VCM = 1000 V 5
Undervoltage Hysteresis VDDxUVH 0.15 V 7
Dynamic Input Supply Current per Channel IDDI (D) 9 µA/Mbps Inputs switching, 50% duty cycle square wave, CL = 0 pF @ 5VDC Supply 5
Dynamic Output Supply Current per Channel IDDO (D) 38 µA/Mbps Inputs switching, 50% duty cycle square wave, CL = 0 pF @ 5VDC Supply 5
IC Junction to Ambient Thermal Resistance θJA 76 °C/W Thermocouple located at center of package underside 9

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing pC In accordance with DIN V VDE V 0884-11, eachπ160M3x/π161M3x/π162M3x /π163M3x is proof tested by applying an insulation test voltage ≥ 848 V peak for 1 sec (partial discharge detection limit = 5 pC); e 10

CAD (KiCad official)

  • Symbol: π160M31
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: 160m31-etched.step / 160m31-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 160m31.step / 160m31.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: 2Pai Semi datasheet (19 pp, sha256 5bda2a660ddaeeda, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF