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π140M30
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2Pai Semi Digital Isolators, SOIC-16-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownπ140M30
2Pai Semi · Digital Isolators · SOIC-16-300mil
π140M30 from 2Pai Semi, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VDD1 | power_in | Supply voltage for isolator side 1, 3 V to 5.5 V recommended operating range. |
| 2 | GND1 | power_in | Ground 1, the ground reference for isolator side 1. |
| 3 | VIA | input | Logic input A. |
| 4 | VIB | input | Logic input B. |
| 5 | VIC | input | Logic input C. |
| 6 | VID | input | Logic input D. |
| 7 | NC | unconnected | No connect. |
| 8 | GND1 | power_in | Ground 1, the ground reference for isolator side 1. |
| 9 | GND2 | power_in | Ground 2, the ground reference for isolator side 2. |
| 10 | NC | unconnected | No connect for the π140M3X (this pin is the EN2 output enable only on the π140M6X). |
| 11 | VOD | output | Logic output D. |
| 12 | VOC | output | Logic output C. |
| 13 | VOB | output | Logic output B. |
| 14 | VOA | output | Logic output A. |
| 15 | GND2 | power_in | Ground 2, the ground reference for isolator side 2. |
| 16 | VDD2 | power_in | Supply voltage for isolator side 2, 3 V to 5.5 V recommended operating range. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | 2Pai Semi |
| Package | SOIC-16-300mil |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VDDx | 3 | 5.5 | V | 3 | ||
| Data Rate | 0 | 10 | Mbps | 4 | |||
| High Level Output Current | IOH | -6 | mA | 4 | |||
| Low Level Output Current | IOL | 6 | mA | 4 | |||
| Junction Temperature | TJ | -40 | 150 | °C | 4 | ||
| Ambient Operating Temperature | TA | -40 | 125 | °C | 4 | ||
| Supply Voltages | VDDx | -0.5 | 7 | V | VDD1-GND1, VDD2-GND2 | 3 | |
| Average Output Current per Pin, Side 1 | IO1 | -10 | 10 | mA | 3 | ||
| Average Output Current per Pin, Side 2 | IO2 | -10 | 10 | mA | 3 | ||
| Common-Mode Transients Immunity | -200 | 200 | kV/µs | 3 | |||
| Storage Temperature | TST | -65 | 150 | °C | 3 | ||
| Ambient Operating Temperature | TA | -40 | 125 | °C | 3 | ||
| Minimum Pulse Width | PW | 100 | ns | Within pulse width distortion (PWD) limit | 4 | ||
| Maximum Data Rate | 10 | Mbps | Within PWD limit | 5 | |||
| Propagation Delay Time | tpHL, tpLH | 5.5 | 8 | 12.5 | ns | 5VDC supply | 5 |
| Propagation Delay Time | tpHL, tpLH | 6.5 | 9 | 13.5 | ns | 3.3VDC supply | 5 |
| Pulse Width Distortion | PWD | 0.3 | 3 | ns | 5VDC supply, /tpHL - tpLH/ | 5 | |
| Pulse Width Distortion | PWD | 0.4 | 3 | ns | 3.3VDC supply, /tpHL - tpLH/ | 5 | |
| Part to Part Propagation Delay Skew | tPSK | 2 | ns | 5VDC supply | 5 | ||
| Channel to Channel Propagation Delay Skew | tCSK | 0 | 1.8 | ns | 5VDC supply | 5 | |
| Channel to Channel Propagation Delay Skew | tCSK | 0 | 2 | ns | 3.3VDC supply | 5 | |
| Total Supply Current Side 1, 10 Mbps | IDD1 | 0.48 | 0.72 | mA | 5VDC, 10 Mbps, CL = 0 pF | 8 | |
| Total Supply Current Side 2, 10 Mbps | IDD2 | 3.52 | 5.28 | mA | 5VDC, 10 Mbps, CL = 0 pF | 8 | |
| Total Supply Current Side 1, 10 Mbps | IDD1 | 0.36 | 0.54 | mA | 3.3VDC, 10 Mbps, CL = 0 pF | 8 | |
| Total Supply Current Side 2, 10 Mbps | IDD2 | 2.86 | 4.29 | mA | 3.3VDC, 10 Mbps, CL = 0 pF | 8 | |
| Total Supply Current Side 1, 1 Mbps | IDD1 | 0.3 | 0.45 | mA | 5VDC, 1 Mbps, CL = 0 pF | 8 | |
| Total Supply Current Side 2, 1 Mbps | IDD2 | 2.04 | 3.06 | mA | 5VDC, 1 Mbps, CL = 0 pF | 8 | |
| Total Supply Current Side 1, 150 Kbps | IDD1 | 0.28 | 0.42 | mA | 5VDC, 150 Kbps, CL = 0 pF | 8 | |
| Total Supply Current Side 2, 150 Kbps | IDD2 | 1.9 | 2.85 | mA | 5VDC, 150 Kbps, CL = 0 pF | 8 | |
| Output Signal Rise/Fall Time | tr/tf | 1.5 | ns | See Figure 10. | 5 | ||
| Common-Mode Transient Immunity | CMTI | 75 | kV/µs | VIN = VDDx or 0V, VCM = 1000 V | 5 | ||
| Jitter (peak-to-peak) | 120 | ps p-p | See the Jitter Measurement section | 5 | |||
| Jitter (rms) | 20 | ps rms | See the Jitter Measurement section | 5 | |||
| ESD (HBM) | ESD | 8 | kV | Human body model, ±8 kV | 5 | ||
| Dynamic Input Supply Current per Channel | IDDI (D) | 9 | µA/Mbps | Inputs switching, 50% duty cycle square wave, CL = 0 pF @ 5VDC Supply | 5 | ||
| Dynamic Output Supply Current per Channel | IDDO (D) | 38 | µA/Mbps | Inputs switching, 50% duty cycle square wave, CL = 0 pF @ 5VDC Supply | 5 | ||
| Dynamic Input Supply Current per Channel | IDDI (D) | 5 | µA/Mbps | Inputs switching, 50% duty cycle square wave, CL = 0 pF @ 3.3VDC Supply | 5 | ||
| Dynamic Output Supply Current per Channel | IDDO (D) | 23 | µA/Mbps | Inputs switching, 50% duty cycle square wave, CL = 0 pF @ 3.3VDC Supply | 5 | ||
| IC Junction to Ambient Thermal Resistance | θJA | 100 | °C/W | Thermocouple located at center of package underside | 9 | ||
| Rated Dielectric Insulation Voltage | 3000 | V rms | 1-minute duration | 9 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pC | In accordance with DIN V VDE V 0884-11, each π140M3x/π141M3x/π142M3x is proof tested by applying an insulation test voltage ≥ 848 V peak for 1 sec (partial discharge detection limit = 5 pC); each π140 | 10 |
CAD (KiCad official)
- Symbol:
π140M30 - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
- 3D model files:
140m30-etched.step/140m30-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);140m30.step/140m30.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: 2Pai Semi datasheet (20 pp, sha256
85b22c927af6ccc5, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).