# 12T.50000032AG12ZSHGB02

**Xucheng Elec** · Disposable Fuses · 1206

12T.50000032AG12ZSHGB02 from Xucheng Elec, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One end-cap terminal of the 1206 (3.2x1.6 mm) slow-blow SMD fuse; the fuse is non-polarized and the terminals are interchangeable. |
| 2 | 2 | passive | Other end-cap terminal of the 1206 (3.2x1.6 mm) slow-blow SMD fuse; the fuse is non-polarized and the terminals are interchangeable. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Xucheng Elec |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Time at 100% of rated current (no-open time) |  | 4 |  |  | h | 100% of In, 12T slow-blow series | 4 |
| Operating time at 250% of rated current |  | 0.5 |  | 60 | s | 250% of In, 12T slow-blow series | 4 |
| Operating time at 300% of rated current |  | 0.1 |  | 3 | s | 300% of In, 12T slow-blow series | 4 |
| Operating time at 1000% of rated current |  | 0.2 |  | 20 | ms | 1000% of In, 12T slow-blow series | 4 |
| Temperature rise at rated current |  |  |  | 135 | K | 1 In applied for 1 h; max rise measured after thermal balance within 2 h | 4 |
| Breaking capacity |  | 50 |  |  | A | At rated voltage DC 63V/32V/24V, 50A test; no ignition or bursting | 5 |
| Wave solder temperature |  |  |  | 260 | °C | Wave solder, ≤5 s (RoHS) | 6 |
| Hand solder temperature |  |  |  | 360 | °C | Hand solder, ≤1 s (RoHS) | 6 |
| Storage temperature |  | 5 |  | 35 | °C | Storage | 6 |
| Storage humidity |  | 25 |  | 75 | % | Storage (relative humidity) | 6 |

## CAD (KiCad official)

- Symbol: `12T.50000032AG12ZSHGB02`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `12t-50000032ag12zshgb02-etched.step` / `12t-50000032ag12zshgb02-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `12t-50000032ag12zshgb02.step` / `12t-50000032ag12zshgb02.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Xucheng Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588899923966640128) (9 pp, sha256 `4b1968f45e8af532`, retrieved 2026-10-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/12t-50000032ag12zshgb02-datasheet.pdf)