# 1206TD-15AS

**prosemi** · Disposable Fuses · 1206

1206TD-15AS from prosemi, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the non-polarized 15 A time-delay thick-film chip fuse, with typical cold resistance 0.0035 ohm, typical melting I2t 45 A2Sec and typical voltage drop 0.085 V. |
| 2 | 2 | passive | Second terminal of the non-polarized 15 A time-delay thick-film chip fuse, interchangeable with the other terminal, on the 1.52 mm gap, 2.03 mm tall pad layout. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | prosemi |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Opening time at 1.0In (rated current 6A~40A), minimum |  | 4 |  |  | hour | Rated current 6A~40A, at 1.0In | 1 |
| Opening time at 3.5In (rated current 6A~40A), maximum |  |  |  | 5 | sec | Rated current 6A~40A, at 3.5In | 1 |
| Opening time at 10.0In (rated current 6A~40A), range |  | 0.2 |  | 20 | ms | Rated current 6A~40A, at 10.0In | 1 |
| Rated current |  |  | 15 |  | A |  | 1 |
| Typical DC cold resistance |  |  | 0.0035 |  | Ω | Measured at <10% of rated current, ambient 25℃ | 1 |
| Typical melting I2t | I2t |  | 45 |  | A2Sec | Measured at 10In current | 1 |
| Typical voltage drop | V |  | 0.085 |  | V |  | 1 |
| Operating temperature |  | -55 |  | 150 | ℃ | With proper correction factor applied | 2 |
| Peak temperature (Tp), IR reflow profile | Tp |  |  | 260 | °C | Printed as 260+0/-5°C; IR reflow profile | 2 |
| Time 25 °C to peak temperature |  |  |  | 8 | minutes | IR/wave soldering profile | 2 |
| Wave soldering time |  |  |  | 10 | sec | Wave soldering at 260°C | 2 |
| Infrared reflow time |  |  |  | 30 | sec | Infrared reflow at 260°C | 2 |

## CAD (KiCad official)

- Symbol: `1206TD-15AS`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `1206td-15as-etched.step` / `1206td-15as-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `1206td-15as.step` / `1206td-15as.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [prosemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590182934260191232) (3 pp, sha256 `67b0c0e704a0a3d2`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/1206td-15as-datasheet.pdf)