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Contents

README

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1206TD-1.5A

prosemi · Disposable Fuses · 1206

1206TD-1.5A from prosemi, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive One terminal of the two-terminal 1206TD-1.5A time-delay chip fuse (1.50 A rating, 0.23 ohm typical cold resistance); the fuse is not polarized and the datasheet gives no pin names.
2 2 passive Second terminal of the two-terminal 1206TD-1.5A time-delay chip fuse (1.50 A rating, 0.23 ohm typical cold resistance); the fuse is not polarized and the datasheet gives no pin names.

Key specifications

Parameter Value
Manufacturer prosemi
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Opening time at 100% of amp rating 4 hours 100% of amp rating, 0.63~30A 1
Opening time at 200% of amp rating 1 60 sec 200% of amp rating, 0.633A; printed 1sec60sec 1
Opening time at 250% of amp rating 5 Seconds 250% of amp rating, 0.63~5A 1
Opening time at 300% of amp rating 0.1 3 sec 300% of amp rating, 0.635A; printed 0.1sec3sec 1
Opening time at 1000% of amp rating 0.2 20 ms 1000% of amp rating, 0.6330A; printed 0.2ms20ms 1
Operating temperature -55 150 ℃ with proper correction factor applied 2
Typical cold resistance 0.23 Ohms measured at <10% of rated current in ambient temperature of 25℃ 1
Typical pre-arcing I2t I2t 0.17 A Sec measured at 10In current 1
Typical voltage drop 0.465 V 1
Ampere rating 1.5 A 1
Average ramp-up rate (Tsmax to Tp) 3 °C/second IR reflow profile 2
Average ramp-down rate (Tp to Tsmax) 6 °C/second IR reflow profile 2
Peak temperature (Tp) Tp 260 °C IR reflow profile; printed 260+0/-5°C 2
Wave soldering temperature 260 °C Wave soldering, 10 seconds max. 2
Wave soldering time 10 seconds Wave soldering at 260°C 2
Infrared reflow time 30 seconds Infrared reflow at 260°C 2
Time 25°C to peak temperature 8 minutes as printed alongside wave soldering entry 2
Preheat temperature min (Tsmin) Tsmin 150 °C Preheat 2
Preheat temperature max (Tsmax) Tsmax 200 °C Preheat 2
Time (Tsmin to Tsmax) ts 60 120 seconds Preheat 2
Time at liquidous (tL) tL 60 150 seconds 2
Time within 5°C of actual peak temperature (tp) tp 10 30 seconds 2
Liquidous temperature (TL) TL 217 °C 2

CAD (KiCad official)

  • Symbol: 1206TD-1.5A
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: 1206td-1-5a-etched.step / 1206td-1-5a-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1206td-1-5a.step / 1206td-1-5a.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: prosemi datasheet (4 pp, sha256 18a9527882f84a83, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF