component
1206L050YR
Public Made by Adomby adom
Littelfuse Resettable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdown1206L050YR
Littelfuse · Resettable Fuses · 1206
1206L050YR from Littelfuse, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One of two interchangeable solder-plated copper end terminals of the resettable PTC; the 1206L050 is rated 0.50 A hold, 1.00 A trip, 6 Vdc max, 100 A max fault current. |
| 2 | 2 | passive | Second interchangeable solder-plated copper end terminal of the resettable PTC (non-polarized); the 1206L050 has 0.10 ohm min and 0.150 ohm R1max resistance, with 0.70 ohm listed as the maximum resistance after trip or reflow. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Minimum resistance in initial (un-soldered) state | R min | 0.15 | Ω | Initial un-soldered state | 1 | ||
| Maximum resistance at 20°C after trip or reflow | R 1max | 0.7 | Ω | 20°C, measured one hour after tripping or reflow soldering of 260°C for 20 sec | 1 | ||
| Hold current | I hold | 0.5 | A | 20°C still air; maximum current device passes without tripping | 1 | ||
| Trip current | I trip | 1 | A | 20°C still air; minimum current at which device trips | 1 | ||
| Maximum voltage | V max | 6 | Vdc | Maximum voltage device withstands without damage at rated current (I max) | 1 | ||
| Maximum fault current | I max | 100 | A | Maximum fault current device withstands without damage at rated voltage (Vmax) | 1 | ||
| Maximum time to trip | 0.1 | s | At 8.00 A | 1 | |||
| Hold current vs ambient temperature | I hold | 0.71 | A | Ambient -40°C | 2 | ||
| Hold current vs ambient temperature | I hold | 0.64 | A | Ambient -20°C | 2 | ||
| Hold current vs ambient temperature | I hold | 0.57 | A | Ambient 0°C | 2 | ||
| Hold current vs ambient temperature | I hold | 0.5 | A | Ambient 20°C | 2 | ||
| Hold current vs ambient temperature | I hold | 0.42 | A | Ambient 40°C | 2 | ||
| Hold current vs ambient temperature | I hold | 0.39 | A | Ambient 50°C | 2 | ||
| Hold current vs ambient temperature | I hold | 0.35 | A | Ambient 60°C | 2 | ||
| Hold current vs ambient temperature | I hold | 0.31 | A | Ambient 70°C | 2 | ||
| Hold current vs ambient temperature | I hold | 0.25 | A | Ambient 85°C | 2 | ||
| Passive aging resistance change | -5 | 5 | % | Passive aging +85°C, 1000 hours; typical resistance change | 3 | ||
| Humidity aging resistance change | -5 | 5 | % | Humidity aging +85°C, 85% R.H., 1000 hours; typical resistance change | 3 | ||
| Operating/storage temperature | -40 | 85 | °C | Operating/storage | 3 | ||
| Maximum device surface temperature in tripped state | 125 | °C | Tripped state | 3 | |||
| Preheat temperature | Ts | 150 | 200 | °C | Pb-free reflow preheat | 3 | |
| Preheat time | ts | 60 | 180 | s | Pb-free reflow, preheat from Ts(min) to Ts(max) | 3 | |
| Time above liquidus | tL | 60 | 150 | s | Pb-free reflow, above TL 217°C | 3 | |
| Time within 5°C of peak temperature | tp | 20 | 40 | s | Pb-free reflow | 3 | |
| Average ramp-up rate (TS(max) to TP) | 3 | °C/second | Pb-free reflow, maximum | 3 | |||
| Ramp-down rate | 6 | °C/second | Pb-free reflow, maximum | 3 | |||
| Time 25°C to peak temperature | 8 | minutes | Pb-free reflow, maximum | 3 | |||
| Power dissipated in tripped state | Pd | 0.6 | W | Tripped state, 20°C still air | 1 | ||
| Trip-time reference temperature liquidus | TL | 217 | °C | Pb-free reflow, time maintained above TL | 3 | ||
| Thermal shock resistance change | -30 | % | MIL-STD-202 Method 107, +85°C/-40°C 20 times; typical resistance change | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | Terminal Material Solder-Plated Copper (Solder Material: | 3 |
CAD (KiCad official)
- Symbol:
1206L050YR - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
1206l050yr-etched.step/1206l050yr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);1206l050yr.step/1206l050yr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Littelfuse datasheet (6 pp, sha256
e7684db822499dee, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).