# 1206FA-8A

**prosemi** · Disposable Fuses · 1206

1206FA-8A from prosemi, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One end termination of the non-polarized 8A fast-acting thick film chip fuse (32Vdc @ 150A / 24Vdc @ 300A interrupting rating, 0.0085 ohm typical cold resistance), connected to a 1.52 x 2.03 mm pad. |
| 2 | 2 | passive | Other end termination of the non-polarized 8A fast-acting thick film chip fuse (typical voltage drop 0.110 V), connected to the second 1.52 x 2.03 mm pad. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | prosemi |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Opening time at 100% of amp rating |  | 4 |  |  | hours | 0.25~40A, 100% of amp rating | 1 |
| Opening time at 350% of amp rating |  |  |  | 5 | seconds | 6~40A, 350% of amp rating | 1 |
| Operating temperature |  | -55 |  | 150 | °C | With proper correction factor applied | 2 |
| Preheat temperature (Tsmin to Tsmax) |  | 150 |  | 200 | °C | IR reflow profile, preheat | 2 |
| Preheat time (Tsmin to Tsmax) | ts | 60 |  | 120 | seconds | IR reflow profile, preheat | 2 |
| Average ramp-up rate (Tsmax to Tp) |  |  |  | 3 | °C/second | IR reflow profile, maximum | 2 |
| Time at liquidous (tL) | tL | 60 |  | 150 | seconds | IR reflow profile, liquidous temperature TL 217°C | 2 |
| Liquidous temperature (TL) | TL |  | 217 |  | °C | IR reflow profile | 2 |
| Peak temperature (Tp) | Tp |  |  | 260 | °C | IR reflow profile; printed as 260+0/-5°C | 2 |
| Time within 5°C of actual peak temperature (tp) | tp | 10 |  | 30 | seconds | IR reflow profile | 2 |
| Average ramp-down rate (Tp to Tsmax) |  |  |  | 6 | °C/second | IR reflow profile, maximum | 2 |
| Time 25°C to peak temperature |  |  |  | 8 | minutes | IR reflow profile, maximum | 2 |
| Wave soldering time |  |  |  | 10 | seconds | Wave soldering at 260°C | 2 |
| Infrared reflow time |  |  |  | 30 | seconds | Infrared reflow at 260°C | 2 |
| Rated current (amp rating) |  |  | 8 |  | A |  | 1 |
| Typical cold resistance |  |  | 0.0085 |  | Ohms | Measured at <10% of rated current, ambient 25°C | 1 |
| Typical pre-arcing I2t | I2t |  | 14 |  | A Sec | Measured at 10In current | 1 |
| Typical voltage drop |  |  | 0.11 |  | V |  | 1 |

## CAD (KiCad official)

- Symbol: `1206FA-8A`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `1206fa-8a-etched.step` / `1206fa-8a-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `1206fa-8a.step` / `1206fa-8a.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [prosemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590921237751820288) (3 pp, sha256 `f745819c7dd288fa`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/1206fa-8a-datasheet.pdf)