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Name Last commit message Last updated
docs 1117-3-3: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain STEP) · Ray
viewers 1117-3-3: footprint pads join the pin-hover bus with the symbol (4 pads) · Ray
1117-3-3-etched.fit.json 1117-3-3: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
1117-3-3-etched.glb 1117-3-3: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain STEP) · Ray
1117-3-3-etched.step 1117-3-3: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain STEP) · Ray
1117-3-3.glb Publish 0.1.0 · Ray
1117-3-3.kicad_mod 1117-3-3: one-pass backfill (courtyard 63.36 -> 57.13 mm2 (margin 0.25, default)) · Ray
1117-3-3.kicad_sym Publish 0.1.0 · Ray
1117-3-3.lbr 1117-3-3: one-pass backfill (courtyard 63.36 -> 57.13 mm2 (margin 0.25, default)) · Ray
1117-3-3.step Publish 0.1.0 · Ray
package.json Publish 0.3.3 · Ray
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json Publish 0.3.3 · Ray
README.md 1117-3-3: specified limits as data (metadata.characteristics, 19 rows from the datasheet) · Ray

1117-3.3

IDCHIP · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-223

1117-3.3 from IDCHIP, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference for the fixed-output (3.3V) version. On adjustable variants this same pin is the ADJ feedback input; on the -3.3 fixed part it is tied to system ground.
2 VOUT power_out Regulated 3.3V output (±1% at TJ=25°C, 3.235-3.365V over 10mA-1A, VIN 4.75-10V). Requires at least 22µF output capacitor for stability per the typical application circuit.
3 VIN power_in Unregulated input supply, up to 12V absolute maximum. For the 3.3V variant, recommended VIN range is 4.75V to 10V. Typical application uses a 10µF input capacitor.

Key specifications

Parameter Value
Manufacturer IDCHIP
Package SOT-223
Category PMIC
Pins 3

Ordering variants

Same part, different packaging or reel option.

  • 1117-3.3H
  • 1117-3.3H-3.3
  • 1117-3.3R
  • 1117-3.3T
  • 1117-3.3S
  • 1117-3.3D

The extractor listed these alongside 1117-3.3, but they are different parts with different electrical characteristics. Do not order them as substitutes.

  • 1117-3.3H-1.8
  • 1117-3.3H-ADJ

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage (3.3V fixed), TJ=25°C VOUT 3.267 3.3 3.333 V IOUT=10mA, VIN=5V, TJ=25°C, 0≤IOUT≤1A, 4.75V≤VIN≤10V 4
Output voltage (3.3V fixed), full temperature range VOUT 3.235 3.3 3.365 V IOUT=10mA, VIN=5V, TJ=25°C, 0≤IOUT≤1A, 4.75V≤VIN≤10V 4
Ilimit current limit Ilimit 1 1.1 1.2 A 4
Quiescent current Iq 5 10 mA 4.25V≤VIN≤6.5V 4
Line regulation Rline 3 7 mV VINMIN ≤VIN≤ 12V, VOUT=Fixed/Adj, IOUT=10mA 4
Load regulation Rload 6 12 mV 10mA≤IOUT≤ 1A, VOUT=Fixed/Adj 4
Ripple rejection ratio PSRR 60 75 dB fRIPPLE=120Hz, (VIN-VOUT)=3V, VRIPPLE=1VPP 4
Output voltage temperature stability TSOUT 0.3 % 4
Thermal shutdown point TSD 150 °C 4
Temperature stability 0.5 % 5
RMS output noise 0.003 % % of VOUT, 10Hz≤f≤10kHz 5
Thermal resistance junction-to-ambient, SOT-223-3L (no heatsink) θJA 120 °C/W no heatsink 5
Input voltage (absolute maximum) VIN 12 V 3
Lead temperature (soldering) TLead 260 °C 5 s soldering 3
Operating junction temperature (absolute maximum) TJ 150 °C 3
Storage temperature TSTG -65 150 °C 3
ESD capability (minimum value) ESD 2000 V 3
Input voltage (recommended) VIN 12 V 3
Operating junction temperature (recommended) TJ -40 125 °C 3

CAD (KiCad official)

  • Symbol: 1117-3.3
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: 1117-3-3-etched.step / 1117-3-3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); 1117-3-3.step / 1117-3-3.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
1117-3-3.step 64 KB You want the bare part, or you mark your own boards.
1117-3-3-etched.step 1.2 MB You want the part with 1117-3.3 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 303 faces against 75 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: IDCHIP datasheet (9 pp, sha256 860cbde3d5dfdba4, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF